JPS63195774U - - Google Patents

Info

Publication number

JPS63195774U

JPS63195774U JP8715687U JP8715687U JPS63195774U JP S63195774 U JPS63195774 U JP S63195774U JP 8715687 U JP8715687 U JP 8715687U JP 8715687 U JP8715687 U JP 8715687U JP S63195774 U JPS63195774 U JP S63195774U

Authority

JP

Japan

Prior art keywords

wiring board

printed wiring

auxiliary

hole

protrusion

Prior art date

1987-06-04

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
• 239000011889 copper foil Substances 0.000 claims description 4
• 238000000034 method Methods 0.000 claims description 3
• 238000005476 soldering Methods 0.000 claims description 2
• 230000013011 mating Effects 0.000 claims 1
• 239000002184 metal Substances 0.000 description 2
• 229910052751 metal Inorganic materials 0.000 description 2
• 239000003795 chemical substances by application Substances 0.000 description 1
• 238000007796 conventional method Methods 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1