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Priority to JP1987087260UpriorityCriticalpatent/JPS63195741U/ja
Publication of JPS63195741UpublicationCriticalpatent/JPS63195741U/ja
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
H01L2224/331—Disposition
H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
