JPS63193536A - Positioning method in mounting component - Google Patents

Positioning method in mounting component

Info

Publication number
JPS63193536A
JPS63193536A JP62025776A JP2577687A JPS63193536A JP S63193536 A JPS63193536 A JP S63193536A JP 62025776 A JP62025776 A JP 62025776A JP 2577687 A JP2577687 A JP 2577687A JP S63193536 A JPS63193536 A JP S63193536A
Authority
JP
Japan
Prior art keywords
parts
part
positioning
thick
thick parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62025776A
Inventor
Kenji Osawa
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP62025776A priority Critical patent/JPS63193536A/en
Publication of JPS63193536A publication Critical patent/JPS63193536A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To perform positioning readily, by forming thick parts, which are thicken than part-connecting parts, at parts independent of electrode leads, and positioning the part at the thick parts.
CONSTITUTION: Electrolytic copper is plated on electrode leads 2. Thick parts 61W64 having copper plated layers are formed at parts other than part- connecting parts 3. Then a part 7 is guided along end surfaces 6a and 6b of the thick parts 61 and 62, stopped at the thick parts 63 and 64 and end surfaces 6c and 6d and positioned. Thus the positioning can be readily performed.
COPYRIGHT: (C)1988,JPO&Japio
JP62025776A 1987-02-06 1987-02-06 Positioning method in mounting component Pending JPS63193536A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62025776A JPS63193536A (en) 1987-02-06 1987-02-06 Positioning method in mounting component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62025776A JPS63193536A (en) 1987-02-06 1987-02-06 Positioning method in mounting component

Publications (1)

Publication Number Publication Date
JPS63193536A true JPS63193536A (en) 1988-08-10

Family

ID=12175249

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62025776A Pending JPS63193536A (en) 1987-02-06 1987-02-06 Positioning method in mounting component

Country Status (1)

Country Link
JP (1) JPS63193536A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7285734B2 (en) 2003-04-28 2007-10-23 Matsushita Electric Industrial Co., Ltd. Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7285734B2 (en) 2003-04-28 2007-10-23 Matsushita Electric Industrial Co., Ltd. Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same
US7288729B2 (en) 2003-04-28 2007-10-30 Matsushita Electric Industrial Co., Ltd. Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same
US7294532B2 (en) 2003-04-28 2007-11-13 Matsushita Electric Industrial Co., Ltd. Method for manufacturing semiconductor device

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