JPS6318863U - - Google Patents

Info

Publication number

JPS6318863U

JPS6318863U JP11222986U JP11222986U JPS6318863U JP S6318863 U JPS6318863 U JP S6318863U JP 11222986 U JP11222986 U JP 11222986U JP 11222986 U JP11222986 U JP 11222986U JP S6318863 U JPS6318863 U JP S6318863U

Authority

JP

Japan

Prior art keywords

circuit board

printed circuit

metal foil

thickness

solder resist

Prior art date

1986-07-22

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000011888 foil Substances 0.000 claims description 4
• 239000002184 metal Substances 0.000 claims description 4
• 229910052751 metal Inorganic materials 0.000 claims description 4
• 229910000679 solder Inorganic materials 0.000 claims description 3
• 238000000034 method Methods 0.000 claims 1
• 238000010586 diagram Methods 0.000 description 2
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• 235000014676 Phragmites communis Nutrition 0.000 description 1
• 239000011889 copper foil Substances 0.000 description 1