JPS63185539U - - Google Patents

Info

Publication number

JPS63185539U

JPS63185539U JP7794587U JP7794587U JPS63185539U JP S63185539 U JPS63185539 U JP S63185539U JP 7794587 U JP7794587 U JP 7794587U JP 7794587 U JP7794587 U JP 7794587U JP S63185539 U JPS63185539 U JP S63185539U

Authority

JP

Japan

Prior art keywords

lower mold

insertion hole

recess

lead insertion

hole

Prior art date

1987-05-22

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 230000037431 insertion Effects 0.000 claims description 6
• 238000003780 insertion Methods 0.000 claims description 6
• 238000007789 sealing Methods 0.000 claims description 6
• 239000002184 metal Substances 0.000 claims description 3
• 230000002093 peripheral effect Effects 0.000 claims 1
• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2