JPS63185274U - - Google Patents
Info
- Publication number
- JPS63185274U JPS63185274U JP7439287U JP7439287U JPS63185274U JP S63185274 U JPS63185274 U JP S63185274U JP 7439287 U JP7439287 U JP 7439287U JP 7439287 U JP7439287 U JP 7439287U JP S63185274 U JPS63185274 U JP S63185274U
- Authority
- JP
- Japan
- Prior art keywords
- electric element
- printed circuit
- flux
- circuit board
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000004907 flux Effects 0.000 claims description 4
- 239000000758 substrate Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図はこの考案の一実施例によるプリント基
板を示す要部断面図、第２図はこの考案の他の実
施例を示す要部斜視図、第３図は従来のプリント
基板の一例を示す要部断面図である。
図において、１は基板本体、３は基板貫通形電
気素子、８は粘着性フラツクスである。なお、各
図中、同一符号は同一又は相当部分を示す。
Fig. 1 is a sectional view of the main parts showing a printed circuit board according to one embodiment of this invention, Fig. 2 is a perspective view of main parts showing another embodiment of this invention, and Fig. 3 shows an example of a conventional printed circuit board. It is a sectional view of the main part. In the figure, 1 is a substrate body, 3 is a substrate penetrating electric element, and 8 is an adhesive flux. In each figure, the same reference numerals indicate the same or equivalent parts.
Claims (1)
が塗布されたプリント基板において、前記フラツ
クスに粘着性を持たせ、前記電気素子を前記フラ
ツクスを介して前記基板本体に接着させたことを
特徴とするプリント基板。 (2) 電気素子は基板貫通形電気素子である実用
新案登録請求の範囲第１項記載のプリント基板。[Claims for Utility Model Registration] (1) In a printed circuit board in which a flux is applied to the board body on which an electric element is mounted, the flux is made sticky, and the electric element is attached to the board body through the flux. A printed circuit board characterized by being bonded. (2) The printed circuit board according to claim 1, wherein the electric element is a board-penetrating electric element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7439287U JPS63185274U (en) | 1987-05-20 | 1987-05-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7439287U JPS63185274U (en) | 1987-05-20 | 1987-05-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63185274U true JPS63185274U (en) | 1988-11-29 |
Family
ID=30919564
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7439287U Pending JPS63185274U (en) | 1987-05-20 | 1987-05-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63185274U (en) |
-
1987
- 1987-05-20 JP JP7439287U patent/JPS63185274U/ja active Pending