JPS63185229U - - Google Patents
Info
- Publication number
- JPS63185229U JPS63185229U JP7683587U JP7683587U JPS63185229U JP S63185229 U JPS63185229 U JP S63185229U JP 7683587 U JP7683587 U JP 7683587U JP 7683587 U JP7683587 U JP 7683587U JP S63185229 U JPS63185229 U JP S63185229U
- Authority
- JP
- Japan
- Prior art keywords
- large number
- polygonal
- dotted
- semiconductor die
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005219 brazing Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000000945 filler Substances 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7683587U JPS63185229U (US06277897-20010821-C00009.png) | 1987-05-21 | 1987-05-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7683587U JPS63185229U (US06277897-20010821-C00009.png) | 1987-05-21 | 1987-05-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63185229U true JPS63185229U (US06277897-20010821-C00009.png) | 1988-11-29 |
Family
ID=30924284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7683587U Pending JPS63185229U (US06277897-20010821-C00009.png) | 1987-05-21 | 1987-05-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63185229U (US06277897-20010821-C00009.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02127060U (US06277897-20010821-C00009.png) * | 1989-03-30 | 1990-10-19 |
-
1987
- 1987-05-21 JP JP7683587U patent/JPS63185229U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02127060U (US06277897-20010821-C00009.png) * | 1989-03-30 | 1990-10-19 |
