JPS63180937U - - Google Patents
Info
- Publication number
- JPS63180937U JPS63180937U JP7136587U JP7136587U JPS63180937U JP S63180937 U JPS63180937 U JP S63180937U JP 7136587 U JP7136587 U JP 7136587U JP 7136587 U JP7136587 U JP 7136587U JP S63180937 U JPS63180937 U JP S63180937U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- circuit board
- lid
- resin filling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7136587U JPS63180937U (US20020051482A1-20020502-M00012.png) | 1987-05-13 | 1987-05-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7136587U JPS63180937U (US20020051482A1-20020502-M00012.png) | 1987-05-13 | 1987-05-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63180937U true JPS63180937U (US20020051482A1-20020502-M00012.png) | 1988-11-22 |
Family
ID=30913852
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7136587U Pending JPS63180937U (US20020051482A1-20020502-M00012.png) | 1987-05-13 | 1987-05-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63180937U (US20020051482A1-20020502-M00012.png) |
-
1987
- 1987-05-13 JP JP7136587U patent/JPS63180937U/ja active Pending
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