JPS63174453U - - Google Patents
Info
- Publication number
- JPS63174453U JPS63174453U JP8095286U JP8095286U JPS63174453U JP S63174453 U JPS63174453 U JP S63174453U JP 8095286 U JP8095286 U JP 8095286U JP 8095286 U JP8095286 U JP 8095286U JP S63174453 U JPS63174453 U JP S63174453U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- sealed semiconductor
- sealed
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 5
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8095286U JPS63174453U (it) | 1986-05-30 | 1986-05-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8095286U JPS63174453U (it) | 1986-05-30 | 1986-05-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63174453U true JPS63174453U (it) | 1988-11-11 |
Family
ID=30932236
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8095286U Pending JPS63174453U (it) | 1986-05-30 | 1986-05-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63174453U (it) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020148879A1 (ja) * | 2019-01-18 | 2020-07-23 | 三菱電機株式会社 | 半導体装置、半導体装置の製造方法及び電力変換装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS582048A (ja) * | 1981-06-29 | 1983-01-07 | Toshiba Corp | 樹脂封止半導体装置 |
JPS6251501A (ja) * | 1985-08-27 | 1987-03-06 | Shimizu Constr Co Ltd | 定温倉庫搬送システム |
-
1986
- 1986-05-30 JP JP8095286U patent/JPS63174453U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS582048A (ja) * | 1981-06-29 | 1983-01-07 | Toshiba Corp | 樹脂封止半導体装置 |
JPS6251501A (ja) * | 1985-08-27 | 1987-03-06 | Shimizu Constr Co Ltd | 定温倉庫搬送システム |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020148879A1 (ja) * | 2019-01-18 | 2020-07-23 | 三菱電機株式会社 | 半導体装置、半導体装置の製造方法及び電力変換装置 |
JPWO2020148879A1 (ja) * | 2019-01-18 | 2021-09-27 | 三菱電機株式会社 | 半導体装置、半導体装置の製造方法及び電力変換装置 |
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