JPS6317357B2 - - Google Patents

Info

Publication number
JPS6317357B2
JPS6317357B2 JP57187675A JP18767582A JPS6317357B2 JP S6317357 B2 JPS6317357 B2 JP S6317357B2 JP 57187675 A JP57187675 A JP 57187675A JP 18767582 A JP18767582 A JP 18767582A JP S6317357 B2 JPS6317357 B2 JP S6317357B2
Authority
JP
Japan
Prior art keywords
thick film
palladium
ceramic
wiring layer
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57187675A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5975695A (ja
Inventor
Fukuzo Mizuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Priority to JP57187675A priority Critical patent/JPS5975695A/ja
Priority to US06/544,243 priority patent/US4529835A/en
Publication of JPS5975695A publication Critical patent/JPS5975695A/ja
Publication of JPS6317357B2 publication Critical patent/JPS6317357B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Conductive Materials (AREA)
JP57187675A 1982-10-23 1982-10-23 セラミツク厚膜回路基板 Granted JPS5975695A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP57187675A JPS5975695A (ja) 1982-10-23 1982-10-23 セラミツク厚膜回路基板
US06/544,243 US4529835A (en) 1982-10-23 1983-10-21 Ceramic thick film circuit substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57187675A JPS5975695A (ja) 1982-10-23 1982-10-23 セラミツク厚膜回路基板

Publications (2)

Publication Number Publication Date
JPS5975695A JPS5975695A (ja) 1984-04-28
JPS6317357B2 true JPS6317357B2 (forum.php) 1988-04-13

Family

ID=16210177

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57187675A Granted JPS5975695A (ja) 1982-10-23 1982-10-23 セラミツク厚膜回路基板

Country Status (2)

Country Link
US (1) US4529835A (forum.php)
JP (1) JPS5975695A (forum.php)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59119796A (ja) * 1982-12-25 1984-07-11 松下電器産業株式会社 多層配線基板
JPS59119795A (ja) * 1982-12-25 1984-07-11 松下電器産業株式会社 多層配線基板
JPS61236192A (ja) * 1985-04-12 1986-10-21 株式会社日立製作所 セラミツク基板の電極形成方法
US4783722A (en) * 1985-07-16 1988-11-08 Nippon Telegraph And Telephone Corporation Interboard connection terminal and method of manufacturing the same
JPS62123795A (ja) * 1985-11-25 1987-06-05 株式会社東芝 配線基板
JPH0714105B2 (ja) * 1986-05-19 1995-02-15 日本電装株式会社 混成集積回路基板及びその製造方法
EP0247575B1 (en) * 1986-05-30 1993-07-21 Furukawa Denki Kogyo Kabushiki Kaisha Multilayer printed wiring board and method for producing the same
US4963187A (en) * 1987-03-04 1990-10-16 Ngk Spark Plug Co., Ltd. Metallizing paste for circuit board having low thermal expansion coefficient
JPH01248593A (ja) * 1988-03-30 1989-10-04 Ngk Insulators Ltd セラミック多層配線基板
JP3286651B2 (ja) * 1993-12-27 2002-05-27 株式会社住友金属エレクトロデバイス セラミック多層配線基板およびその製造法並びにセラミック多層配線基板用導電材料
US5889462A (en) * 1996-04-08 1999-03-30 Bourns, Inc. Multilayer thick film surge resistor network
JP3399349B2 (ja) * 1998-03-17 2003-04-21 株式会社村田製作所 積層バリスタおよびその製造方法
US7615481B2 (en) * 2006-11-17 2009-11-10 Ricoh Company, Ltd. Method of manufacturing multilevel interconnect structure and multilevel interconnect structure
KR100896610B1 (ko) * 2007-11-05 2009-05-08 삼성전기주식회사 다층 세라믹 기판 및 그 제조방법
KR100969437B1 (ko) * 2008-06-13 2010-07-14 삼성전기주식회사 인쇄회로기판 및 그 제조방법
JP5906264B2 (ja) * 2014-02-12 2016-04-20 新光電気工業株式会社 配線基板及びその製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1096655A (en) * 1914-03-05 1914-05-12 Gen Electric Platinum alloy.
GB157988A (en) * 1914-03-05 1922-05-12 British Thomson Houston Co Ltd Improvements in and relating to platinum alloys
US1779603A (en) * 1926-03-02 1930-10-28 Western Electric Co Alloy for electrical contacts
US2094570A (en) * 1936-07-01 1937-09-28 Western Union Telegraph Co Electric contact
US3838204A (en) * 1966-03-30 1974-09-24 Ibm Multilayer circuits
US3511640A (en) * 1968-03-27 1970-05-12 Du Pont Degassing platinum powders
JPS4954859A (forum.php) * 1972-09-27 1974-05-28
US3872360A (en) * 1973-01-08 1975-03-18 Du Pont Capacitors with nickel containing electrodes
US3912611A (en) * 1973-03-12 1975-10-14 Bell Telephone Labor Inc Film material and devices using same
JPS569030B2 (forum.php) * 1973-09-12 1981-02-26
JPS6036948B2 (ja) * 1976-03-10 1985-08-23 株式会社パイロット ドツトプリンテイングワイヤ−
FR2476913B1 (fr) * 1980-02-25 1985-09-13 Nippon Electric Co Circuit a plusieurs couches pour integration a grande echelle et procede de fabrication de ce circuit
JPS5712600A (en) * 1980-06-27 1982-01-22 Hitachi Ltd Method of producing thick film multilayer circuit board

Also Published As

Publication number Publication date
US4529835A (en) 1985-07-16
JPS5975695A (ja) 1984-04-28

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