JPS63172174U - - Google Patents

Info

Publication number

JPS63172174U

JPS63172174U JP6565287U JP6565287U JPS63172174U JP S63172174 U JPS63172174 U JP S63172174U JP 6565287 U JP6565287 U JP 6565287U JP 6565287 U JP6565287 U JP 6565287U JP S63172174 U JPS63172174 U JP S63172174U

Authority

JP

Japan

Prior art keywords

wiring board

printed wiring

multilayer printed

damping function

layer

Prior art date

1987-04-28

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 238000013016 damping Methods 0.000 claims description 5
• 239000000463 material Substances 0.000 claims description 2
• 239000010410 layer Substances 0.000 description 5
• 239000000853 adhesive Substances 0.000 description 3
• 230000001070 adhesive effect Effects 0.000 description 3
• 239000011229 interlayer Substances 0.000 description 3