JPS63169729A - Dry etching device - Google Patents

Abstract

PURPOSE:To equalize an etching rate on the surface of a wafer by dividing a region holding one wafer in a wafer holder body section into at least two blocks and independently annexing temperature controllers to said each block. CONSTITUTION:A wafer holder body section is divided into three blocks of a circular central block 1a, an annular intermediate block 1b on the outside of the block 1a and an external block 1c on the outside of the block 1b by double concentric circles. Temperature controllers 3 are arranged in parallel with each of the central block 1a, the intermediate block 1b and the external block 1c, a heat exchange agent is circulated through respective block through circulating pipes 2, and the temperatures of each block are controlled independently. Accordingly, the nonuniformity of speed in a wafer surface based on electrode structure is absorbed by temperature difference among the blocks, thus equalizing at etching rate in the wafer surface.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of practical application] The present invention relates to a dry etching apparatus that performs etching without using a liquid, and a wafer holder that heats and holds a wafer to be etched.

[Conventional technology]

FIG. 3 (ml is a plan view of a wafer held by a wafer holder of a conventional dry etching apparatus, and FIG. 3(b) is a sectional view taken along line A-A in FIG. 3(a). FIG. 3(a), (
In bl, wafer 1 of wafer holder 1711m
A holder main body part 6 is used to maintain the temperature of the wafer at the desired temperature, and a holder main body part 6 is connected to the main body part 6 through two vias. 〇 [The point where the invention is about to be decided] As mentioned above, one wafer is held in the wafer holder of the conventional dry etching equipment, and this holder is It was controlled by a warm controller to maintain the temperature. However, with dry etching equipment, the etching depth is non-uniform within the wafer surface based on the structure for generating lasma, and the etching shape becomes non-uniform, making it difficult to obtain the desired etching shape. There are 90 drawbacks [Means to increase problem 1#] To solve the above problem, in the present invention, since the etching rate is a function of the wafer temperature, the area of the wafer where the etching rate is slow is raised to a high temperature. The temperature side # is performed so that the temperature sound image is placed in the area where the etching rate is high. For rounding, the wafer holder is divided into at least 21161 blocks, and each block is provided with a temperature controller that can independently control the temperature. Therefore, the speed in the wafer S plane based on the electrode structure is independent - t% temperature difference between blocks. This makes the etching rate uniform within the wafer surface.

〔Example〕

Next, the present invention will be examined with reference to embodiments. Fig. 1(a) shows a plane view of a wafer holder according to an embodiment of the present invention, and Fig. 1(b) shows a cross section taken along line A-A in Fig. 1(a). It is a diagram. In these figures, the wafer holder main body is divided into three blocks by double concentric circles: a circular central block la, an annular intermediate block lb outside the central block la, and an outer block 1c outside the central block la. 1m, each of the intermediate block lb and the outer block 1c.

A temperature controller 3 is attached, and a heat exchange agent is circulated and accumulated in each block through a circulation pipe 2, and the temperature of each block is controlled independently. FIG. 7 is a plan view and a cross-sectional view of a wafer holder according to another embodiment of the invention. 27th (
a).

In (b), the anomalous wafer holder main body is the first
As in the example in the figure, it is divided into 311 blocks, but 1
The circular central block 4a has a concentric annular intermediate block 4b outside it at a position offset from the center of the circle of the holder outline, and an outer block 4C that occupies the entire outer area. , chromaticity can be controlled independently for each block. :The J controller 3 is connected to the heat exchange circulation pipe 2, and the electric conduction in the example in Figure 1 is incorrect (corresponding to the electrode structure different from A), the in-plane etching speed is made uniform across the wafer. .

[Brief explanation of the drawing]

Advantages and disadvantages (a) μ Plane of wafer holder according to an embodiment of the present invention 1. Same figure (b) #2 Same figure (A-A cross-sectional view of ω. 2nd (9) (ω) Recommendation--1 Plan view of a wafer holder according to another embodiment of the present invention, same figure (b) #: r same meat (
ml A- cross-sectional view, Figure 3 (a), (b) +! 0 1 & e 4 a . . . center block, lb, which are a plan view and a sectional view of a wafer holder related to a conventional dry etching apparatus
4b... Intermediate block s lc, 46...
...Outer block, 2...Heat exchange agent circulation pipe, 3,7...Temperature controller, 6...
・Holder body W, 10...Wafer. Figure 1 erased 20

Claims (1)

[Claims] In a dry etching apparatus equipped with a wafer holder that holds and heats a wafer to be etched, the wafer holder main body has an area for holding one wafer divided into at least two blocks, and a region for holding one of the wafers is divided into at least two blocks. is a dry etching device characterized by being equipped with a temperature controller that can independently control the temperature.