JPS63169270A - Abrasive tape - Google Patents

Abrasive tape

Info

Publication number
JPS63169270A
JPS63169270A JP30931086A JP30931086A JPS63169270A JP S63169270 A JPS63169270 A JP S63169270A JP 30931086 A JP30931086 A JP 30931086A JP 30931086 A JP30931086 A JP 30931086A JP S63169270 A JPS63169270 A JP S63169270A
Authority
JP
Japan
Prior art keywords
abrasive
antistatic
antistatic agent
binder resin
agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP30931086A
Other languages
Japanese (ja)
Inventor
Yasuki Suzuura
泰樹 鈴浦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP30931086A priority Critical patent/JPS63169270A/en
Publication of JPS63169270A publication Critical patent/JPS63169270A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To prevent a polishing flaw from occurring as well as to make uniform finishing attainable, by installing a charge preventive abrasive layer in at least one side of a film-form abrasive tape base material. CONSTITUTION:An abrasive layer 2 may be made up of a binder resin layer inclusive of an abradant subjected to antistatic treatment or another binder resin layer inclusive of an antistatic agent and the abradant-either will do. A binder component is polyester resin or salt, vinegar vinyl resin, or mixed rein of them. Abradant grains to be used for the abrasive layer use a primary grain of 0.1-20mum in grain size of silicon carbide and diamond or the like. The antistatic agent is an amphoteric antistatic agent or the like of a quaternary ammonium salt compound or the like. To manufacture an abrasive tape, the abradant, the binder resin and the antistatic agent are added into such an organic solvent as dissolving the binder resin and the antistatic agent, and they are sufficiently decomposed and dispersed, adjusting a coat agent, and this agent is applied to at least one side of a base material film and dried up.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は磁気ヘッドや磁気ディスクの仕上げ研磨、金型
の精密仕上げ研磨等に使用される研磨テープに関するも
のである。
DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a polishing tape used for final polishing of magnetic heads and magnetic disks, precision final polishing of molds, and the like.

(従来の技術) 精密機械部品や精密電子部品に使用される磁気ヘッド等
の表面は、例えばミクロン又はサブミクロンオーダー以
下の精密な表面に仕上げられることが、近年、しばしば
必要とされており、フィルムや合成紙等からなる研磨テ
ープ用のフィルム状基材上に、硬度の高い無機質微粉末
を樹脂溶液中に分散させた無機質微粉末の分散樹脂溶液
を塗布、乾燥し、研磨層を形成することによって得られ
る研磨テープ(例えば特公昭!;3−’It!7/II
号公報)等が利用されている。
(Prior Art) In recent years, it has often been necessary for the surfaces of magnetic heads, etc. used in precision mechanical parts and precision electronic parts to be finished to a precision surface of, for example, micron or submicron order. Applying a dispersed resin solution of fine inorganic powder in which fine inorganic powder with high hardness is dispersed in a resin solution is applied onto a film-like base material for polishing tape made of synthetic paper, etc., and then dried to form a polishing layer. Abrasive tape obtained by
Publication No.) etc. are used.

さらに研磨によるムラや傷の発生は研磨テープへのゴミ
、異物の混入によることが多く、前記研磨テープ(=お
ける研磨層中にカーボン粉末を含有させた研磨テープ(
特開昭jg−/ 77.26+)も提案されている。
Furthermore, the occurrence of unevenness and scratches due to polishing is often due to the contamination of the polishing tape with dust and foreign matter.
Japanese Unexamined Patent Application Publication No. 2003-120011 (Sho JG-/77.26+) has also been proposed.

(発明が解決しようとする問題点) ところで前記従来の研磨層中にカーボン粉末を含有させ
た研磨テープは研磨テープの種別を明示するための着色
が困雛であり、しかも研磨層に摩耗粉を溜めるため(二
多数の略正六角形が前後左右に略均等配置されて構成さ
れる亀甲形状の画線相応部分と、前記亀甲形状を構成し
ているそれぞれの略正六角形の中心部相応部分とに凹状
部が構成されている研磨テープにおいて、上記形状の製
造時に研磨剤粒子とカーボン粒子の粒度、比重、凝集程
度の差により粒子の移動に対する抵抗が異なりその結果
、粒子の分離がおこり、最終的には研磨層表面が不均一
になる等の欠点を有している。
(Problems to be Solved by the Invention) However, with the conventional abrasive tape containing carbon powder in the abrasive layer, it is difficult to color the abrasive tape to clearly identify the type of the abrasive tape. In order to store (two parts corresponding to the drawing lines of a tortoise shell shape made up of a large number of substantially regular hexagons arranged substantially evenly in the front, back, left and right, and a part corresponding to the center of each substantially regular hexagon making up the tortoise shell shape) In an abrasive tape that has concave portions, the resistance to particle movement varies due to differences in particle size, specific gravity, and degree of aggregation between abrasive particles and carbon particles during manufacture of the above shape, resulting in separation of particles and final Specifically, it has drawbacks such as the surface of the polishing layer becoming non-uniform.

(問題点を解決するための手段) 本発明者は上述の如き従来技術の欠点を解決すべく鋭意
研究の結果、研磨テープ用基材に特定の構成の帯電防止
性研磨層を形成することにより、解決できることを知見
して本発明を完成した。
(Means for Solving the Problems) As a result of intensive research in order to solve the above-mentioned drawbacks of the prior art, the present inventors have found that by forming an antistatic polishing layer with a specific configuration on a base material for polishing tape. The present invention was completed after discovering that the problem could be solved.

すなわち、本発明の研磨テープはフィルム状をなす研磨
テープ用基材と該基材の少なくとも片面(=設けた帯電
防止性研磨層からなり、前記帯電防止性研磨層が下記の
(a)、(b)、(c)のいずれかの構成であることを
特徴とする研磨テープである。
That is, the polishing tape of the present invention comprises a film-like polishing tape base material and an antistatic polishing layer provided on at least one side of the base material, and the antistatic polishing layer has the following (a), ( This is an abrasive tape characterized by having the structure of either b) or (c).

(a)帯電防止処理した研磨剤を含むバインダー樹脂層
(a) A binder resin layer containing an antistatically treated abrasive.

(bl帯電防止剤および研磨剤を含むバインダー樹脂層
(bl Binder resin layer containing antistatic agent and abrasive.

(c)研磨剤を含むバインダー樹脂層とその上に設けた
帯電防止層。
(c) A binder resin layer containing an abrasive and an antistatic layer provided thereon.

次(二本発明の帯電防止性研磨テープを図解的に例示す
る第1図および第2図を参照して説明する。゛ 第1図は本発明の帯電防止性研磨テープの7つの実施例
の断面を図解的に示すものであり、また第2図は本発明
の帯電防止性研磨テープの他の実施例の断面を図解的(
二示している。
The following will be explained with reference to FIGS. 1 and 2, which schematically illustrate the antistatic abrasive tape of the present invention. FIG. 1 shows seven embodiments of the antistatic abrasive tape of the present invention. FIG. 2 schematically shows a cross section of another embodiment of the antistatic abrasive tape of the present invention.
Two are shown.

第1図から明らかな通り本発明の研磨テープの7つの実
施例では基材フィルム/の少なくとも一方の面に研磨層
コを形成する。また、第2図に示す実施例では基材フィ
ルム/の少な(とも一方の面に研M層コを設け、その上
に帯電防止層3を設けろ。
As is clear from FIG. 1, in the seven embodiments of the abrasive tape of the present invention, an abrasive layer is formed on at least one surface of the base film. In addition, in the embodiment shown in FIG. 2, the base film is coated with an abrasive M layer on one side, and an antistatic layer 3 is provided thereon.

上記の第1図においては、研磨層コは、帯電防止処理し
た研磨剤を含むバインダー樹脂層であっても、また帯電
防止剤と研磨剤を含むバインダー樹脂層であってもよい
In FIG. 1 above, the polishing layer may be a binder resin layer containing an antistatically treated abrasive, or a binder resin layer containing an antistatic agent and an abrasive.

本発明においては、上記の如き構成により、従来技術の
研磨テープの前述の如き種々の問題点を解決したもので
ある。
In the present invention, the above-described configuration solves the various problems of the prior art abrasive tapes as described above.

次に、本発明を本発明の研磨テープを構成するのに必要
とする材料および形成方法を説明すること(二より更(
−具体的(=説明する。
Next, the materials and forming method necessary to construct the abrasive tape of the present invention will be explained (more on that later).
-Specific (=explain.

本発明のフィルム状をなす研磨テープ用基材としては、
ポリエチレンテレフタレート等からなる厚さ/2−10
0μm程度の機械的強度、寸法安定性、耐熱性等に優れ
た性質を有するフィルムが利用されろ。
The film-like polishing tape base material of the present invention includes:
Thickness made of polyethylene terephthalate, etc./2-10
A film with excellent properties such as mechanical strength of about 0 μm, dimensional stability, and heat resistance should be used.

また、研磨層の構成成分の中のバインダー成分は、ポリ
エステル樹脂または塩・酢ビニル樹脂あるいはこれらの
混合樹脂であるが、得られる研磨層の耐摩耗性や耐熱性
等の性質を向上させるため(=、研磨層形成用のコーテ
ィング剤中にトルイレンジイソシアナー)(TDI)、
キシリレンジイソシアナート(XDI)、ヘキサメチレ
ンジイソシアナート(HMDI)等のイソシアナート系
硬化剤を添加し、前述の樹脂における官能基(−〇H1
−NH2等)と反応させて熱硬化樹脂によるバインダー
成分となすこともできる。尚、これらの硬化剤の添加量
は〔イソシアナート基(−NCO)/樹脂の官能基〕で
表示される当量比がO,S〜io程度の範囲内となるこ
とが好ましい。
In addition, the binder component among the constituent components of the polishing layer is polyester resin, salt/vinyl acetate resin, or a mixed resin thereof, but in order to improve the properties such as abrasion resistance and heat resistance of the resulting polishing layer ( = Toluylene diisocyaner (TDI) in the coating agent for forming the polishing layer,
An isocyanate curing agent such as xylylene diisocyanate (XDI) or hexamethylene diisocyanate (HMDI) is added to cure the functional group (-〇H1) in the aforementioned resin.
-NH2, etc.) to form a binder component using a thermosetting resin. The amount of these curing agents added is preferably such that the equivalent ratio expressed as [isocyanate group (-NCO)/resin functional group] is within a range of about O, S to io.

本発明の研磨層に使用する研磨剤粒子は、例えば、酸化
アルミニクム、炭化硅素、窒化硅素、酸化ジルコニクム
、酸化クロム、酸化鉄、ダイヤモンド、窒化ホウ素、エ
メリー等の7次粒子の粒径0,7〜コθμm程度のもの
が使用される。
The abrasive particles used in the abrasive layer of the present invention are, for example, 7th particles of aluminum oxide, silicon carbide, silicon nitride, zirconium oxide, chromium oxide, iron oxide, diamond, boron nitride, emery, etc. with a particle size of 0.7 ~ θμm is used.

研腑層コの厚みとしては一般に3〜りOμm程度である
The thickness of the training layer is generally about 3 to 0 μm.

本発明で使用する帯電防止剤は、従来公知のもの、例え
ば、q級アンモニクム塩化合物、イミダシリン系化合物
等の如く、カチオン系の帯電防止剤、アルキル硫酸エス
テル系化合物、アルキルアリールスルホン酸系化合物、
アルキル燐酸エステル系化合物等のアニオン性帯電防止
★1j、ベタイン系化合物等の両性帯電防止剤、ソルビ
タン系化合物、エステル系化合物等のノニオン性帯電防
止剤、あるいは極性基を有しているアクリルアンモニウ
ム系、シラン系等の高分子帯電防止剤等がいずれも使用
できる。本発明において特に好ましいものは、カチオン
系の帯電防止剤である。
The antistatic agents used in the present invention include conventionally known ones, such as cationic antistatic agents such as q-class ammonium salt compounds and imidacillin compounds, alkyl sulfate ester compounds, alkylaryl sulfonic acid compounds,
Anionic antistatic agents such as alkyl phosphate ester compounds★1j, amphoteric antistatic agents such as betaine compounds, nonionic antistatic agents such as sorbitan compounds, ester compounds, or acryl ammonium compounds that have polar groups , silane-based polymer antistatic agents, etc. can be used. Particularly preferred in the present invention are cationic antistatic agents.

このような帯電防止剤は、使用前に前記の研摩剤に付着
あるいは吸着させて使用する場合と、単(=研磨層形成
用のコート剤中に添加する場合があるが、いずれにして
も、固形分基準で、バインダー樹脂100重量部あたり
約0.5〜20重量部の割合で使用するのが適当である
。使用量が0.5重量部未満では、十分な帯電防止効果
が達成されず、一方、20重量部を超える量では、研磨
層の表面へのブリードアクトが激しく、得られる研磨テ
ープがブロッキングしたり、その耐摩性が低下するので
好ましくない。
Such an antistatic agent may be used by being attached or adsorbed to the abrasive before use, or may be simply added to the coating agent for forming the abrasive layer, but in either case, Based on the solid content, it is appropriate to use it at a ratio of about 0.5 to 20 parts by weight per 100 parts by weight of the binder resin.If the amount used is less than 0.5 parts by weight, a sufficient antistatic effect will not be achieved. On the other hand, if the amount exceeds 20 parts by weight, the bleeding effect on the surface of the abrasive layer will be severe, and the resulting abrasive tape will block or its abrasion resistance will decrease, which is not preferable.

本発明の研磨テープを製造するために、上記の如き材料
から基材フィルムの少なくとも一方の面(=研磨層を形
成するには、1つの方法として、上記の如き材料を適当
な有接溶剤、すなわち、上記のバインダー樹脂および帯
電防止剤を溶解するような有機溶剤中に、上記の研摩剤
(あるいは帯電防止処理した研磨剤)、バインダー樹脂
および帯電防止剤を、上記の如き使用割合で添加し、十
分(=溶解および分散させてコート剤を調製し、該コー
ト剤を基材フィルムの少なくとも一方の面に塗布し、乾
燥させる方法である。
In order to manufacture the abrasive tape of the present invention, one method is to form at least one surface (=abrasive layer) of the base film from the above-mentioned materials using a suitable welding agent, That is, the above-mentioned abrasive (or antistatic-treated abrasive), binder resin, and antistatic agent are added to an organic solvent that dissolves the above-mentioned binder resin and antistatic agent in the proportions described above. , a method in which a coating agent is prepared by dissolving and dispersing the coating agent, and the coating agent is applied to at least one surface of the base film and dried.

他の方法としては、帯電防止剤を実質的(=含まない、
あるいは少食含有する上記の如きコート剤により、−担
研磨層を形成し、次いでその表面に、帯電防止剤による
帯電防止層を形成する方法があげられる。このような方
法では、前記の如き帯電防止剤を水または適当な有機溶
剤中(=溶解あるいは分散させて、塗布および乾燥させ
るのが好ましく、このような方法で形成する層は、上記
の如き研磨層上に形成してもよく、またその裏面に形成
してもよい。このような別コート方法を用いれば、少な
い帯電防止剤の使用量で優れた帯電防止性を研磨テープ
に与えることができ、また研磨テープの耐摩性を低下さ
せる恐れもないので好ましい。使用する帯電防止剤の量
は、好ましくは約0.0 /〜2バの割合であり、十分
な帯電防止効果を付与することができる。
Another method is to substantially (=not contain) an antistatic agent.
Alternatively, a method may be mentioned in which a -polishing layer is formed using a coating agent as described above containing a small amount of abrasive, and then an antistatic layer is formed using an antistatic agent on the surface thereof. In such a method, it is preferable to apply and dry the antistatic agent as described above in water or a suitable organic solvent (=dissolved or dispersed). It may be formed on the layer or on the back side of the layer.If such a separate coating method is used, excellent antistatic properties can be imparted to the abrasive tape with a small amount of antistatic agent used. Also, it is preferable because there is no risk of reducing the abrasion resistance of the abrasive tape.The amount of antistatic agent used is preferably about 0.0/~2 bar to provide a sufficient antistatic effect. can.

(実施例) 実施例/ 厚さ50μmのポリエステルフィルムからなる研磨テー
プ用基材の片面にポリエステル樹脂700重量部とアル
ミナ微粉末(平均粒径/μm)100重量部と前記ポリ
エステル樹脂中のOH基とキンリレンジイソシアナート
のNCO基との関係が−NCO/−0H=弘(当量比)
に相当する量、のキシリレンジイソシアナートとからな
るコート剤を三本リバースロール法により乾燥時厚さで
、20μmの厚さに塗布、乾燥後、aO℃にて7日間の
エージング処理し、更にこの上に帯電防止剤スタテイサ
イド濃縮f(アナリティカルケミカルラボラトリーズ)
をIPAで100倍に希釈しダイレクトグラビア法で塗
布、乾燥して帯電防止性研磨テープを得た。得られた研
磨テープは表面抵抗率が1010Ωで、本研磨テープを
使用して中心線平均粗さ0.033mの!;、2 j 
1nckフロツピーデイスクの研磨仕上げをしたところ
中心線平均粗さ0.03μmの研磨仕上げができ、研磨
層の発生は無かった。
(Example) Example: 700 parts by weight of polyester resin, 100 parts by weight of alumina fine powder (average particle size/μm), and OH groups in the polyester resin were applied to one side of a polishing tape base material made of a polyester film with a thickness of 50 μm. The relationship between and the NCO group of quinrylene diisocyanate is -NCO/-0H=Hiroshi (equivalent ratio)
A coating agent consisting of xylylene diisocyanate in an amount corresponding to On top of this, the antistatic agent Statyside Concentrated F (Analytical Chemical Laboratories)
was diluted 100 times with IPA, applied by a direct gravure method, and dried to obtain an antistatic polishing tape. The resulting abrasive tape has a surface resistivity of 1010Ω, and an average center line roughness of 0.033 m using this abrasive tape! ;, 2 j
When a 1 nk floppy disk was polished, it was finished with a center line average roughness of 0.03 μm, and no polishing layer was formed.

実施例コ 厚さ75μmのポリエステルフィルムからなる研磨テー
プ用基材の片面に塩化ビニル−酢酸ビニル共重合体io
o重量部と炭化珪素微粉末(平均粒径3μm)qso重
量部、帯電防止剤アーカードT−30(ライオンアクゾ
)3重量部とからなるコート剤を9本リバースロール法
により、乾燥時厚さで25μmの厚さく=塗布、乾燥し
帯電防止性研磨テープを得た。得られた研磨テープは表
面抵抗率が109Ωで本研磨テープを使用して中心線平
均粗さ0070μmのVH8磁気テープを仕上げたとこ
ろ中心線平均粗さO,OSμmの研磨仕上げができ、研
磨傷の発生はなかった。
Example: Vinyl chloride-vinyl acetate copolymer io was coated on one side of a polishing tape base material made of a polyester film with a thickness of 75 μm.
9 parts by weight of a coating agent consisting of parts by weight of silicon carbide fine powder (average particle size 3 μm) qso, and 3 parts by weight of an antistatic agent Alucard T-30 (Lion Akzo) were coated using a reverse roll method to a dry thickness. It was coated to a thickness of 25 μm and dried to obtain an antistatic abrasive tape. The resulting polishing tape has a surface resistivity of 109Ω, and when this polishing tape was used to finish a VH8 magnetic tape with a centerline average roughness of 0,070μm, a polishing finish with a centerline average roughness of O,OS μm was achieved, and there were no polishing scratches. There were no outbreaks.

比較例/ 実施例/の帯電防止剤コーティング前の研磨テープを使
用して中心線平均粗さo、o rμmの3;、23; 
1nchフロツピーデイスクの研磨仕上げをしたところ
中心線平均粗さo、oqμmの研磨仕上げができたが研
磨傷が発生しており均一な仕上げが得られなかりた。
Using the abrasive tape before antistatic agent coating of Comparative Example/Example/Central line average roughness o, o rμm of 3;, 23;
When a 1-inch floppy disk was polished, a polishing finish with a center line average roughness of o, qμm was achieved, but polishing scratches occurred and a uniform finish could not be obtained.

比較例コ 実施例/の研磨剤粒子分散コート剤(二叉にカーボンブ
ラック(平均粒径20−3!fmμm)を部を添加した
コート剤を3本リバースロール法により乾燥時厚さで2
0μmの厚さく=塗布、乾燥後、ダθ0Cにて7日間の
エージング処理(−付し比較のための研磨テープを得た
。得られた研磨テープは表面抵抗率が1011Ωで本研
磨テープを使用して中心線平均粗さo、ogμmの5.
25inchフロツピーデイスクの研磨仕上げをしたと
ころ中心線平均粗さは0.06μmであり、均一な仕上
げが得られなかった。
Comparative Example: Three coats of the abrasive particle dispersion coating agent (to which two parts of carbon black (average particle size 20-3!fmμm) were added) were coated using a reverse roll method to a dry thickness of 2.
After coating and drying, a polishing tape for comparison was obtained for comparison. 5. Center line average roughness o, og μm.
When a 25-inch floppy disk was polished and finished, the center line average roughness was 0.06 μm, and a uniform finish could not be obtained.

(発明の効果) 以上説明したように、本発明の研磨テープを用いれば、
研磨傷の発生もなく、均一な仕上げができるという効果
がある。
(Effect of the invention) As explained above, if the abrasive tape of the present invention is used,
The effect is that a uniform finish can be achieved without the occurrence of polishing scratches.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図および第2図は本発明の帯電防止性研磨テープの
断面を図解的(二示すものである。 /・―・基材フィルム コ・・・研磨層 3・・・帯電防止層 ダ・・・研磨粒子
FIGS. 1 and 2 schematically show the cross section of the antistatic abrasive tape of the present invention.・Abrasive particles

Claims (2)

【特許請求の範囲】[Claims] (1)フィルム状をなす研磨テープ用基材の少なくとも
片面に帯電防止性研磨層を設けてなる研磨テープにおい
て、前記帯電防止性研磨層が下記の(a)、(b)、(
c)のいずれかの構成であることを特徴とする研磨テー
プ。 (a)帯電防止処理した研磨剤を含むバインダー樹脂層
。 (b)帯電防止剤および研磨剤を含むバインダー樹脂層
。 (c)研磨剤を含むバインダー樹脂層とその上に設けた
帯電防止層。
(1) In an abrasive tape comprising an antistatic abrasive layer provided on at least one side of a film-like abrasive tape substrate, the antistatic abrasive layer is one of the following (a), (b), (
An abrasive tape characterized by having any of the configurations of c). (a) A binder resin layer containing an antistatically treated abrasive. (b) A binder resin layer containing an antistatic agent and an abrasive. (c) A binder resin layer containing an abrasive and an antistatic layer provided thereon.
(2)帯電防止剤が、カチオン系帯電防止剤である特許
請求の範囲第(1)項に記載の研磨テープ。
(2) The polishing tape according to claim (1), wherein the antistatic agent is a cationic antistatic agent.
JP30931086A 1986-12-27 1986-12-27 Abrasive tape Pending JPS63169270A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30931086A JPS63169270A (en) 1986-12-27 1986-12-27 Abrasive tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30931086A JPS63169270A (en) 1986-12-27 1986-12-27 Abrasive tape

Publications (1)

Publication Number Publication Date
JPS63169270A true JPS63169270A (en) 1988-07-13

Family

ID=17991472

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30931086A Pending JPS63169270A (en) 1986-12-27 1986-12-27 Abrasive tape

Country Status (1)

Country Link
JP (1) JPS63169270A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02106275A (en) * 1988-10-15 1990-04-18 Hitachi Maxell Ltd Polishing tape
JPH02266926A (en) * 1989-04-07 1990-10-31 Fuji Photo Film Co Ltd Polishing tape
JP2002530213A (en) * 1998-11-20 2002-09-17 フェアアイニヒテ・シュミルゲル−ウント・マシイネン−ファブリーケン・アクチェンゲゼルシャフト Fan wheel

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6133868A (en) * 1984-07-26 1986-02-17 Toyamaken Blocking preventing method of wood work sanding belt
JPS61152373A (en) * 1984-12-25 1986-07-11 Mitsui Toatsu Chem Inc Synthetic resinous abrasive
JPS61265279A (en) * 1985-05-17 1986-11-25 Tohoku Metal Ind Ltd Polishing tape for flexible magnetic disk
JPS6294270A (en) * 1985-10-18 1987-04-30 Fuji Photo Film Co Ltd Abrasive tape
JPS62130181A (en) * 1985-12-02 1987-06-12 Nippon Micro Kooteingu Kk Manufacture of electrification preventing polishing sheet

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6133868A (en) * 1984-07-26 1986-02-17 Toyamaken Blocking preventing method of wood work sanding belt
JPS61152373A (en) * 1984-12-25 1986-07-11 Mitsui Toatsu Chem Inc Synthetic resinous abrasive
JPS61265279A (en) * 1985-05-17 1986-11-25 Tohoku Metal Ind Ltd Polishing tape for flexible magnetic disk
JPS6294270A (en) * 1985-10-18 1987-04-30 Fuji Photo Film Co Ltd Abrasive tape
JPS62130181A (en) * 1985-12-02 1987-06-12 Nippon Micro Kooteingu Kk Manufacture of electrification preventing polishing sheet

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02106275A (en) * 1988-10-15 1990-04-18 Hitachi Maxell Ltd Polishing tape
JPH02266926A (en) * 1989-04-07 1990-10-31 Fuji Photo Film Co Ltd Polishing tape
JP2002530213A (en) * 1998-11-20 2002-09-17 フェアアイニヒテ・シュミルゲル−ウント・マシイネン−ファブリーケン・アクチェンゲゼルシャフト Fan wheel

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