JPS63167774U - - Google Patents
Info
- Publication number
- JPS63167774U JPS63167774U JP1987060142U JP6014287U JPS63167774U JP S63167774 U JPS63167774 U JP S63167774U JP 1987060142 U JP1987060142 U JP 1987060142U JP 6014287 U JP6014287 U JP 6014287U JP S63167774 U JPS63167774 U JP S63167774U
- Authority
- JP
- Japan
- Prior art keywords
- electronic circuit
- board
- connecting parts
- parts
- boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000036760 body temperature Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/0909—Preformed cutting or breaking line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Combinations Of Printed Boards (AREA)
Description
第1図は本考案を利用して製造された基板を含
む電子体温計の概略説明図、第2図は本考案の電
子回路用基板接続体により基板が接続された状態
を示す一部省略平面図である。 10……電子体温計、11……本体部、12…
…基板、14……部品取付部、16……体温伝達
部、18……体温検出素子、22……マイクロコ
ンピユータ、24……コイル、26……水晶発振
子、30……素材、34a,34b……接続部、
36……リブ部材。
む電子体温計の概略説明図、第2図は本考案の電
子回路用基板接続体により基板が接続された状態
を示す一部省略平面図である。 10……電子体温計、11……本体部、12…
…基板、14……部品取付部、16……体温伝達
部、18……体温検出素子、22……マイクロコ
ンピユータ、24……コイル、26……水晶発振
子、30……素材、34a,34b……接続部、
36……リブ部材。
Claims (1)
- 電子回路を組み立てるための複数個の基板が相
互に所定間隔離間して、分離可能な連結部を介し
て連続されてなり、しかも該連結部は分離する際
の応力が各基板に搭載される電子部品に実質的に
及ばない部位に配設されていることを特徴とする
電子回路用基板接続体。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987060142U JPH0625976Y2 (ja) | 1987-04-21 | 1987-04-21 | 電子回路用基板接続体 |
US07/184,364 US4851964A (en) | 1987-04-21 | 1988-04-21 | Connecting mechanism for electronic circuit board blanks |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987060142U JPH0625976Y2 (ja) | 1987-04-21 | 1987-04-21 | 電子回路用基板接続体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63167774U true JPS63167774U (ja) | 1988-11-01 |
JPH0625976Y2 JPH0625976Y2 (ja) | 1994-07-06 |
Family
ID=13133595
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987060142U Expired - Lifetime JPH0625976Y2 (ja) | 1987-04-21 | 1987-04-21 | 電子回路用基板接続体 |
Country Status (2)
Country | Link |
---|---|
US (1) | US4851964A (ja) |
JP (1) | JPH0625976Y2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH036084A (ja) * | 1989-06-02 | 1991-01-11 | Rohm Co Ltd | 電子部品製造用基板 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5503895A (en) * | 1993-09-20 | 1996-04-02 | Bi-Link Metal Specialties | Supply feedstock for workpiece finishing machine |
US5511661A (en) * | 1993-11-01 | 1996-04-30 | Clix Products, Inc. | Plastic paper clip and integral sheet-like packaging thereof |
US5711421A (en) * | 1996-09-12 | 1998-01-27 | Guo; Wen Li | Spray gun assembly |
AU716385B2 (en) * | 1996-10-22 | 2000-02-24 | Thomas & Betts International, Inc. | Cable tie bandoliers for use with automatic tools |
US5967316A (en) * | 1997-10-22 | 1999-10-19 | Thomas & Betts International, Inc. | Cable tie bandoliers for use with automatic tools |
JP3558921B2 (ja) | 1999-05-14 | 2004-08-25 | シャープ株式会社 | テープキャリア並びにテープキャリア型半導体装置の製造方法 |
US8887913B2 (en) * | 2005-12-19 | 2014-11-18 | Symmetry Medical Manufacturing, Inc. | Grommet matrix |
JP5381942B2 (ja) * | 2010-09-17 | 2014-01-08 | オムロンヘルスケア株式会社 | 電子体温計およびその製造方法 |
JP5381943B2 (ja) * | 2010-09-17 | 2014-01-08 | オムロンヘルスケア株式会社 | 電子体温計およびその製造方法 |
CN110027800B (zh) * | 2018-01-12 | 2024-08-23 | 深圳市施威德自动化科技有限公司 | 一种连体的扎带 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5181936U (ja) * | 1974-12-25 | 1976-06-30 | ||
JPS5254874U (ja) * | 1975-10-20 | 1977-04-20 | ||
JPS5634363U (ja) * | 1979-08-22 | 1981-04-03 | ||
JPS58124973U (ja) * | 1982-02-17 | 1983-08-25 | アルプス電気株式会社 | 回路基板 |
JPS58165390A (ja) * | 1982-03-26 | 1983-09-30 | 株式会社日立製作所 | 分割プリント基板 |
JPS5916173U (ja) * | 1982-07-22 | 1984-01-31 | 富士通株式会社 | 多数個取りプリント板 |
JPS5993167U (ja) * | 1982-12-15 | 1984-06-25 | 三菱電機株式会社 | 連取式プリント基板 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3550766A (en) * | 1969-03-03 | 1970-12-29 | David Nixen | Flat electronic package assembly |
US3958075A (en) * | 1974-11-11 | 1976-05-18 | Gentron Corporation | High power thick film circuit with overlapping lead frame |
JPS54182848U (ja) * | 1978-06-16 | 1979-12-25 | ||
US4565458A (en) * | 1982-03-01 | 1986-01-21 | The Torrington Company | Roller bearing |
JPS6036923A (ja) * | 1983-08-09 | 1985-02-26 | Terumo Corp | 電子体温計 |
JPS60157031A (ja) * | 1984-01-27 | 1985-08-17 | Terumo Corp | 電子体温計 |
US4600971A (en) * | 1984-05-11 | 1986-07-15 | Amp Incorporated | Lead frames with dielectric housings molded thereon |
US4611262A (en) * | 1984-05-11 | 1986-09-09 | Amp Incorporated | Electrical circuit package for greeting cards |
-
1987
- 1987-04-21 JP JP1987060142U patent/JPH0625976Y2/ja not_active Expired - Lifetime
-
1988
- 1988-04-21 US US07/184,364 patent/US4851964A/en not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5181936U (ja) * | 1974-12-25 | 1976-06-30 | ||
JPS5254874U (ja) * | 1975-10-20 | 1977-04-20 | ||
JPS5634363U (ja) * | 1979-08-22 | 1981-04-03 | ||
JPS58124973U (ja) * | 1982-02-17 | 1983-08-25 | アルプス電気株式会社 | 回路基板 |
JPS58165390A (ja) * | 1982-03-26 | 1983-09-30 | 株式会社日立製作所 | 分割プリント基板 |
JPS5916173U (ja) * | 1982-07-22 | 1984-01-31 | 富士通株式会社 | 多数個取りプリント板 |
JPS5993167U (ja) * | 1982-12-15 | 1984-06-25 | 三菱電機株式会社 | 連取式プリント基板 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH036084A (ja) * | 1989-06-02 | 1991-01-11 | Rohm Co Ltd | 電子部品製造用基板 |
Also Published As
Publication number | Publication date |
---|---|
US4851964A (en) | 1989-07-25 |
JPH0625976Y2 (ja) | 1994-07-06 |