JPS63164222U - - Google Patents
Info
- Publication number
- JPS63164222U JPS63164222U JP5719087U JP5719087U JPS63164222U JP S63164222 U JPS63164222 U JP S63164222U JP 5719087 U JP5719087 U JP 5719087U JP 5719087 U JP5719087 U JP 5719087U JP S63164222 U JPS63164222 U JP S63164222U
- Authority
- JP
- Japan
- Prior art keywords
- paste
- leveling
- squeegee
- squeegees
- stages
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5719087U JPS63164222U (US07534539-20090519-C00280.png) | 1987-04-15 | 1987-04-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5719087U JPS63164222U (US07534539-20090519-C00280.png) | 1987-04-15 | 1987-04-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63164222U true JPS63164222U (US07534539-20090519-C00280.png) | 1988-10-26 |
Family
ID=30886671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5719087U Pending JPS63164222U (US07534539-20090519-C00280.png) | 1987-04-15 | 1987-04-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63164222U (US07534539-20090519-C00280.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02275692A (ja) * | 1990-01-22 | 1990-11-09 | Tokai Rika Co Ltd | 回路基板のコーティング装置 |
-
1987
- 1987-04-15 JP JP5719087U patent/JPS63164222U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02275692A (ja) * | 1990-01-22 | 1990-11-09 | Tokai Rika Co Ltd | 回路基板のコーティング装置 |
