JPS63159843U - - Google Patents

Info

Publication number

JPS63159843U

JPS63159843U JP5296287U JP5296287U JPS63159843U JP S63159843 U JPS63159843 U JP S63159843U JP 5296287 U JP5296287 U JP 5296287U JP 5296287 U JP5296287 U JP 5296287U JP S63159843 U JPS63159843 U JP S63159843U

Authority

JP

Japan

Prior art keywords

semiconductor package

base

frame

semiconductor element

frame portion

Prior art date

1987-04-08

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Granted

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004065 semiconductor Substances 0.000 claims description 5
• 239000011521 glass Substances 0.000 claims description 4
• 238000007789 sealing Methods 0.000 claims description 3
• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
• 229910000881 Cu alloy Inorganic materials 0.000 claims 1
• 229910052802 copper Inorganic materials 0.000 claims 1
• 239000010949 copper Substances 0.000 claims 1
• 239000002184 metal Substances 0.000 claims 1
• 229910052751 metal Inorganic materials 0.000 claims 1
• 238000010586 diagram Methods 0.000 description 1