JPS63157936U - - Google Patents
Info
- Publication number
- JPS63157936U JPS63157936U JP1987050643U JP5064387U JPS63157936U JP S63157936 U JPS63157936 U JP S63157936U JP 1987050643 U JP1987050643 U JP 1987050643U JP 5064387 U JP5064387 U JP 5064387U JP S63157936 U JPS63157936 U JP S63157936U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit element
- resin
- sealed
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 238000005259 measurement Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987050643U JPS63157936U (US07652168-20100126-C00068.png) | 1987-04-02 | 1987-04-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987050643U JPS63157936U (US07652168-20100126-C00068.png) | 1987-04-02 | 1987-04-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63157936U true JPS63157936U (US07652168-20100126-C00068.png) | 1988-10-17 |
Family
ID=30874188
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987050643U Pending JPS63157936U (US07652168-20100126-C00068.png) | 1987-04-02 | 1987-04-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63157936U (US07652168-20100126-C00068.png) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58168245A (ja) * | 1982-03-29 | 1983-10-04 | Toshiba Corp | 半導体装置の製造方法 |
| JPS5933866A (ja) * | 1982-08-19 | 1984-02-23 | Mitsubishi Electric Corp | 半導体装置 |
-
1987
- 1987-04-02 JP JP1987050643U patent/JPS63157936U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58168245A (ja) * | 1982-03-29 | 1983-10-04 | Toshiba Corp | 半導体装置の製造方法 |
| JPS5933866A (ja) * | 1982-08-19 | 1984-02-23 | Mitsubishi Electric Corp | 半導体装置 |
