JPS6315480A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS6315480A
JPS6315480A JP16006886A JP16006886A JPS6315480A JP S6315480 A JPS6315480 A JP S6315480A JP 16006886 A JP16006886 A JP 16006886A JP 16006886 A JP16006886 A JP 16006886A JP S6315480 A JPS6315480 A JP S6315480A
Authority
JP
Japan
Prior art keywords
protecting film
metal
film
stepped
openings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16006886A
Other languages
Japanese (ja)
Inventor
Yukio Tomita
Original Assignee
Nec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corp filed Critical Nec Corp
Priority to JP16006886A priority Critical patent/JPS6315480A/en
Publication of JPS6315480A publication Critical patent/JPS6315480A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To prevent breakage of a surface protecting film due to resin stress by providing a metal film thicker than a maximum thickness of stepped portion of the protecting film over all the surface of its protecting film with the exception of bonding pads located at a surface of a semiconductor element.
CONSTITUTION: There is a surface protecting film 12 on electrode interconnections 11. On the protecting film a metal 13 is deposited by a vapor deposition process and the like as a cushion material to a thickness that is thicker than a maximum thickness of stepped portion of the surface protecting film 12. In addition, as regards bonding parts, openings are provided in the metal 13 after the deposition and when the openings of the protecting film are opened at the inside of the above metal by an etching process, it is ready to carry out bonding processes. Thus, the above arrangements prevent breakage of the surface protecting film 12 that is produced as a result of resin stress and help improve reliability on the surface protecting film.
COPYRIGHT: (C)1988,JPO&Japio
JP16006886A 1986-07-07 1986-07-07 Semiconductor device Pending JPS6315480A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16006886A JPS6315480A (en) 1986-07-07 1986-07-07 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16006886A JPS6315480A (en) 1986-07-07 1986-07-07 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS6315480A true JPS6315480A (en) 1988-01-22

Family

ID=15707197

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16006886A Pending JPS6315480A (en) 1986-07-07 1986-07-07 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS6315480A (en)

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