JPS63153849A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS63153849A
JPS63153849A JP30252086A JP30252086A JPS63153849A JP S63153849 A JPS63153849 A JP S63153849A JP 30252086 A JP30252086 A JP 30252086A JP 30252086 A JP30252086 A JP 30252086A JP S63153849 A JPS63153849 A JP S63153849A
Authority
JP
Japan
Prior art keywords
substrates
package
outer lead
direction
mounting density
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP30252086A
Inventor
Yuji Matsubara
Original Assignee
Nec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corp filed Critical Nec Corp
Priority to JP30252086A priority Critical patent/JPS63153849A/en
Publication of JPS63153849A publication Critical patent/JPS63153849A/en
Application status is Pending legal-status Critical

Links

Abstract

PURPOSE: To increase the mounting density of substrates by a method wherein, within a semiconductor device with outer lead protruding from only one side of a package, the package is inclined in the direction of the tip of outer lead.
CONSTITUTION: An outer lead 1 is bent so that the direction B of package 2 may make an oblique angle α with the direction A of the tip of outer lead 1. Thus, the mounting density of substrates 4 can be increased compared with conventional substrates 4 mounted with ZIP. Furthermore, when the taper angle βon the surface of another package 3 is equalized with the oblique angle α, the mounting density of substrates can be further increased.
COPYRIGHT: (C)1988,JPO&Japio
JP30252086A 1986-12-17 1986-12-17 Semiconductor device Pending JPS63153849A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30252086A JPS63153849A (en) 1986-12-17 1986-12-17 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30252086A JPS63153849A (en) 1986-12-17 1986-12-17 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS63153849A true JPS63153849A (en) 1988-06-27

Family

ID=17909952

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30252086A Pending JPS63153849A (en) 1986-12-17 1986-12-17 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS63153849A (en)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992003035A1 (en) * 1990-08-01 1992-02-20 Staktek Corporation Ultra high density integrated circuit packages, method and apparatus
US5369058A (en) * 1993-03-29 1994-11-29 Staktek Corporation Warp-resistent ultra-thin integrated circuit package fabrication method
US5367766A (en) * 1990-08-01 1994-11-29 Staktek Corporation Ultra high density integrated circuit packages method
US5377077A (en) * 1990-08-01 1994-12-27 Staktek Corporation Ultra high density integrated circuit packages method and apparatus
US5446620A (en) * 1990-08-01 1995-08-29 Staktek Corporation Ultra high density integrated circuit packages
US5448450A (en) * 1991-08-15 1995-09-05 Staktek Corporation Lead-on-chip integrated circuit apparatus
US5475920A (en) * 1990-08-01 1995-12-19 Burns; Carmen D. Method of assembling ultra high density integrated circuit packages
US5484959A (en) * 1992-12-11 1996-01-16 Staktek Corporation High density lead-on-package fabrication method and apparatus
US5572065A (en) * 1992-06-26 1996-11-05 Staktek Corporation Hermetically sealed ceramic integrated circuit heat dissipating package
US5644161A (en) * 1993-03-29 1997-07-01 Staktek Corporation Ultra-high density warp-resistant memory module
US5801437A (en) * 1993-03-29 1998-09-01 Staktek Corporation Three-dimensional warp-resistant integrated circuit module method and apparatus
US5945732A (en) * 1997-03-12 1999-08-31 Staktek Corporation Apparatus and method of manufacturing a warp resistant thermally conductive integrated circuit package
US6205654B1 (en) 1992-12-11 2001-03-27 Staktek Group L.P. Method of manufacturing a surface mount package
US6572387B2 (en) 1999-09-24 2003-06-03 Staktek Group, L.P. Flexible circuit connector for stacked chip module
US6576992B1 (en) 2001-10-26 2003-06-10 Staktek Group L.P. Chip scale stacking system and method
US6806120B2 (en) 2001-03-27 2004-10-19 Staktek Group, L.P. Contact member stacking system and method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5833862A (en) * 1981-08-24 1983-02-28 Sumitomo Electric Ind Ltd Mounting method and bending device for element lead wires

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5833862A (en) * 1981-08-24 1983-02-28 Sumitomo Electric Ind Ltd Mounting method and bending device for element lead wires

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5446620A (en) * 1990-08-01 1995-08-29 Staktek Corporation Ultra high density integrated circuit packages
WO1992003035A1 (en) * 1990-08-01 1992-02-20 Staktek Corporation Ultra high density integrated circuit packages, method and apparatus
US5367766A (en) * 1990-08-01 1994-11-29 Staktek Corporation Ultra high density integrated circuit packages method
US5377077A (en) * 1990-08-01 1994-12-27 Staktek Corporation Ultra high density integrated circuit packages method and apparatus
US5420751A (en) * 1990-08-01 1995-05-30 Staktek Corporation Ultra high density modular integrated circuit package
US5475920A (en) * 1990-08-01 1995-12-19 Burns; Carmen D. Method of assembling ultra high density integrated circuit packages
US5550711A (en) * 1990-08-01 1996-08-27 Staktek Corporation Ultra high density integrated circuit packages
US5566051A (en) * 1990-08-01 1996-10-15 Staktek Corporation Ultra high density integrated circuit packages method and apparatus
US5448450A (en) * 1991-08-15 1995-09-05 Staktek Corporation Lead-on-chip integrated circuit apparatus
US5572065A (en) * 1992-06-26 1996-11-05 Staktek Corporation Hermetically sealed ceramic integrated circuit heat dissipating package
US6205654B1 (en) 1992-12-11 2001-03-27 Staktek Group L.P. Method of manufacturing a surface mount package
US5484959A (en) * 1992-12-11 1996-01-16 Staktek Corporation High density lead-on-package fabrication method and apparatus
US5631193A (en) * 1992-12-11 1997-05-20 Staktek Corporation High density lead-on-package fabrication method
US6194247B1 (en) 1993-03-29 2001-02-27 Staktek Group L.P. Warp-resistent ultra-thin integrated circuit package fabrication method
US5369056A (en) * 1993-03-29 1994-11-29 Staktek Corporation Warp-resistent ultra-thin integrated circuit package fabrication method
US5644161A (en) * 1993-03-29 1997-07-01 Staktek Corporation Ultra-high density warp-resistant memory module
US5801437A (en) * 1993-03-29 1998-09-01 Staktek Corporation Three-dimensional warp-resistant integrated circuit module method and apparatus
US5828125A (en) * 1993-03-29 1998-10-27 Staktek Corporation Ultra-high density warp-resistant memory module
US5843807A (en) * 1993-03-29 1998-12-01 Staktek Corporation Method of manufacturing an ultra-high density warp-resistant memory module
US5864175A (en) * 1993-03-29 1999-01-26 Staktek Corporation Wrap-resistant ultra-thin integrated circuit package fabrication method
US5895232A (en) * 1993-03-29 1999-04-20 Staktek Corporation Three-dimensional warp-resistant integrated circuit module method and apparatus
US5369058A (en) * 1993-03-29 1994-11-29 Staktek Corporation Warp-resistent ultra-thin integrated circuit package fabrication method
US5581121A (en) * 1993-03-29 1996-12-03 Staktek Corporation Warp-resistant ultra-thin integrated circuit package
US6190939B1 (en) 1997-03-12 2001-02-20 Staktek Group L.P. Method of manufacturing a warp resistant thermally conductive circuit package
US5945732A (en) * 1997-03-12 1999-08-31 Staktek Corporation Apparatus and method of manufacturing a warp resistant thermally conductive integrated circuit package
US6572387B2 (en) 1999-09-24 2003-06-03 Staktek Group, L.P. Flexible circuit connector for stacked chip module
US6806120B2 (en) 2001-03-27 2004-10-19 Staktek Group, L.P. Contact member stacking system and method
US6576992B1 (en) 2001-10-26 2003-06-10 Staktek Group L.P. Chip scale stacking system and method

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