JPS63153550U - - Google Patents
Info
- Publication number
- JPS63153550U JPS63153550U JP4557387U JP4557387U JPS63153550U JP S63153550 U JPS63153550 U JP S63153550U JP 4557387 U JP4557387 U JP 4557387U JP 4557387 U JP4557387 U JP 4557387U JP S63153550 U JPS63153550 U JP S63153550U
- Authority
- JP
- Japan
- Prior art keywords
- package
- ceramic substrate
- film hybrid
- hole
- thick
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000004020 conductor Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4557387U JPS63153550U (en:Method) | 1987-03-30 | 1987-03-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4557387U JPS63153550U (en:Method) | 1987-03-30 | 1987-03-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63153550U true JPS63153550U (en:Method) | 1988-10-07 |
Family
ID=30864431
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4557387U Pending JPS63153550U (en:Method) | 1987-03-30 | 1987-03-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63153550U (en:Method) |
-
1987
- 1987-03-30 JP JP4557387U patent/JPS63153550U/ja active Pending