JPS63145093A - Ic module - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an IC module, and more specifically, to an IC module.
The present invention relates to an IC module suitable for thin mounting for use in cards and the like.

[Conventional technology]

A thin IC module mounted on an IC card or the like has the following structure.

FIG. 7 is a cross-sectional view illustrating the structure of a thin IC module according to the prior art, in which 1 is an IC chip, 2 is a pad of the IC chip, 3 is a bonding wire, 4 is a bonding terminal of a wiring board, and 5 is a wiring. A substrate, 5' is a contact terminal board, 5'' is a frame, 6 is an external contact terminal, 7 is a glue bonding paste, and 8 is a sealing resin.

In the figure, this IC module has an IC chip mounted on a recessed part of a plastic wiring board 5 having a recessed part.
are firmly bonded and fixed with a paste 7 such as epoxy, and the pad 2 which is the electrode of the IC chip 1 and the bonding terminal 4 of the wiring board 5 are bonded with a bonding wire 3 such as a gold wire, and then the resin 8 is filled. and sealed.

This resin 8 is applied to the concave portion of the wiring board 5 and the contact terminal board 5.
It fills the space formed by the frame 5'' and the IC chip 1, and has the function of burying the IC chip 1 and the bonding wire 3 and covering and protecting them.

The IC module configured as described above is an IC module (not shown).
It is embedded in a C card substrate and is further coated with an overlay or the like to become a so-called IC card. At this time,
The contact terminal 6 is not coated with the above coating and is exposed on the surface of the IC card, and when it is set in a card reader/writer, it contacts the terminal provided on the card reader/writer side and sends and receives signals. conduct.

[Problem that the invention seeks to solve]

In the above-mentioned conventional technology, since a bonding wire is used to connect the IC chip and the wiring board, a relatively high loop is formed in the wire.

The height of this loop is as shown in FIG.
It occupies a fairly large dimension with respect to the overall thickness of the module, and when resin is injected to sufficiently cover the loop, the thickness of the resin increases to the extent that the IC on the loop side
It reaches almost the surface of the module. Specifically, if the standard thickness of an IC card is 0.76 mm, then the overall thickness of the IC module used for this card, including the external contact terminals, will be 0.76 mm, taking into account the overlay coating.
It is necessary to keep it below 65w. Therefore, if the thickness of the IC chip is approximately 0.25+n and the thickness of the bonding pad is 0.15 to 0.20, the height of the bonding wire loop will be approximately 0.2u. The thickness of the resin from the IC chip to the IC module surface is slightly over 0°2.
The protective layer for the chip must be made only of the resin, and there is no room for further installation of a reinforcing plate or the like to protect the IC chip.

For this reason, the IC chip of the IC module embedded in the IC card and its bonding wire joint are fragile to external forces, and there is a risk of accidents such as destruction of the IC chip or disconnection of the bonding wire joint. be.

An object of the present invention is to solve the drawback that the thin IC module according to the prior art has insufficient protection ability against external forces, and to provide an IC module having an excellent structure that improves external force resistance. .

[Means to solve the problem]

The above purpose is to use leads formed by the TAB method (tape automated bonding method) to bond the IC chip and the wiring board, and to cover the top surface of the recessed part formed on the wiring board and to make the IC module manufactured. This is achieved by sealing the recessed portion with a reinforcing material made of a flat plate made of ceramic or metal that covers almost the entire area of the plane, thereby isolating the IC chip and its connecting terminal portion from the influence of external forces. .

[Effect]

IC modules mounted on IC cards and the like are required to be small and thin. Since there is a limit to reducing the thickness of the IC chip itself, in order to make the IC module thinner, it is preferable to use the TAB method, which does not significantly affect the increase in the thickness of the bond to the wiring board.

On the other hand, the IC chip itself or the joint between the IC chip and the wiring board is easily damaged by external force, such as breakage or breakage. Even if the thickness of the IC chip portion can be reduced by simply performing resin sealing similar to that explained in FIG. 7, protection against external forces is not sufficient. That is, as shown in FIG. 8, the IC chip 1 is mounted in the recess formed by the wiring board 5 and the external contact terminal board 5' by the TAB method, and the IC chip 1 is mounted on the recess defined by the frame 5'' with D = 0.65 mm. Even if an IC module is formed by injecting and solidifying the resin 8 to the following thickness, if an external force is applied, for example as shown by arrow A, while this IC module is mounted on a card and used, the bonding terminal portion may break. , arrow B
If the external force shown in Figure 1 is applied, there is a possibility that an undesirable situation such as cracking of the IC chip 1 may occur.

On the other hand, according to the structure of the IC module according to the present invention, the above-mentioned situation can be completely avoided.

〔Example〕

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a sectional view showing an embodiment of an IC module according to the present invention, in which 1 is an IC chip, 2' is a bump of the IC chip, 3' is a lead, 4 is a bonding terminal of a wiring board, and 5 is a wiring. Board, 5° is a contact terminal board, 5" is a frame, 6 is a contact terminal, 8" is a chip coat made of an IC chip with leads attached by the TAB method and a resin to protect the leads, 9 is made of polyimide film, etc. 10 is a closed space for storing the IC chip; 1) is a rigid supporter made of ceramic such as alumina or metal such as stainless steel, preferably 0.2fl or less;
．． It is a thin flat plate with a thickness of 0.05 to 0.2 m.

In the same figure, an IC chip 1 has leads 3' bonded to bumps 2' by the TAB method in advance.
Together with the lead supporter 9, the chip coat is held at 8° (note that this chip coat is not necessarily required). This IC chip 1 is housed in a recess provided in a wiring board 5, and bonding terminals 4 are formed on the wiring board.
and are bonded by lead 3. The bottom part of the recessed part is composed of a substrate 5'' on which external contact terminals 6 are formed, and the upper part is sealed with a thin flat plate 1) covered with a frame 5'' at a position regulated in the thickness direction. Further, the IC chip may be fixed in the closed space by injecting a resin into the closed space IO and solidifying it. In this case, it is preferable to use an epoxy resin as the resin to simultaneously obtain the adhesion of the thin flat plate. However, instead of this, a photosensitive resin may be used, a transparent plate with sufficient strength may be used as a thin flat plate, and the resin may be cured with energy rays such as ultraviolet rays.

Furthermore, even if the closed space is filled with an inert gas such as nitrogen,
Alternatively, it may be filled with an appropriate liquid coolant or may be left empty.

In addition, this IC module can be mounted on a card material to create an IC.
When the card is set in a reader/writer, the contact terminal 6 that contacts the contact terminal provided on the reader/writer to transmit and receive signals is connected to the bonding terminal 4 of the wiring board 5 through a through hole (not shown). The substrate 5' of the contact terminal 6 forms the bottom of the recess, and also firmly reinforces the lower surface of the IC module as shown in the figure.
It is preferable to use a particularly rigid material so as to have the function of protecting the chip 1. Also, T in the same figure
The AB lead supporter 9 is for reinforcing and holding the plurality of glues 3', and is formed in a lead connecting process using the TA'B method.

According to the embodiment described above, the joint portion between the IC chip and the wiring board is completely isolated from external forces, so that
Destruction of the C-chip and damage to the joints can be completely avoided.

FIG. 2 is a sectional view showing another embodiment of the present invention, in which the same reference numerals as in FIG. 1 correspond to the same parts.

In this embodiment, an IC chip 1 is housed face down (in a position where the top and bottom sides are reversed from FIG. 1) in a recess formed in a wiring board 5. In some cases, a step is provided at the bottom itself or near the bottom to allow face-down gigantic bonding.

FIG. 3 is a sectional view showing still another embodiment of the present invention, in which the same reference numerals as in FIG. 1 correspond to the same parts.

The leads 3' of the IC chip 1 are gang-bonded to the bonding terminals 4 formed on the wiring board 5 by the TAB method. When an IC module having an IC chip mounted thereon by the TAB method is sealed with only resin on its upper surface as explained in FIG. In the case where cracks occur in the solder due to repeated external force acting near the lead 3'', there is no possibility that the lead 3'' will separate from the bonding terminal 4 and protrude toward the top of the figure. However, according to the present invention, as shown in FIG.
The leads 3' located between the thin flat plate 1) covering the top surface of the IC module and the bonding terminals 4 of the wiring board 5 are connected to the thin flat plate 1).
This suppresses the protrusion in the upper surface direction. Thin flat plate 1)
Ideally, the lead 3' should be placed in a position that completely suppresses the lead 3', but the presence of an 8° chip coat or the I
Due to the limit of the thickness of the C-chip itself, a gap as shown in the figure d is normally formed. The dimensions may be such that the bonding between the terminal 4 and the bonding terminal 4 is maintained. In this case, if the thin flat plate 1) is made of an insulating material such as ceramic, the thin flat plate 1) can be installed as is, but if it is made of a conductive material such as metal, the leads 3' and It is necessary to insert an insulating material between them.

FIG. 4 is a process diagram illustrating the method for manufacturing an IC module according to the present invention, and is a process diagram for manufacturing the IC module shown in FIG.

In the figure, the IC chip is manufactured by the TAB method. First, the bumped IC is placed on the tape 12 on which the leads are wired.
13 is mounted using gigantic bonding (inner lead bonding) to bond the gold bumps of the IC chip and the tin-plated copper leads on the tape with gold-tin eutectic bonding using thermocompression bonding, and then the periphery of the IC chip is bonded with epoxy resin. Bot 8° and coat (chip coat), cure and harden. Next, the leads are cut and formed, the IC chip is separated from the tape, and the leaded IC is
14. This is set on a plastic wiring board 5 provided with a recessed part, and the tin-plated copper lead and the gold-plated copper terminal on the board side wired in the spacer part are bonded by thermocompression to gold-tin eutectic bonding. and secure it (guyang bonding □ outer lead bonding). Next, 10" of epoxy resin is injected into the recessed part of the substrate and filled with botting), and a thin stainless steel plate 1) is placed over the filled resin to cover almost the entire surface of the IC module. This is cured, and the filling resin is hardened and the stainless steel thin flat plate 1) is bonded at the same time to complete the sealing and the IC module 15 is obtained.

FIG. 5 is a cross-sectional view of essential parts showing an example of an IC card using an IC module according to the present invention, in which 1 is an IC chip;
3'' is a lead, 4 is a bonding terminal, 5 is a wiring board, 6 is an external contact terminal, 8'' is a chip coat, 9 is a TAB lead supporter, 1) is a thin flat plate, 15 is an IC module, and 16 is an IC card. The center core (eg, made of vinyl chloride sheet), 16'' is a module window, and 17 is an overlay made of vinyl chloride or the like.

In the figure, an IC module 15 is inserted into a module window 16' formed in a center core 16, which is a card main material made of a vinyl chloride sheet or the like, and fixed by an appropriate means. In this state, the external contact terminals 6 are substantially flush with the bottom surface of the card on the lower surface side in the figure, and an overlay 17 made of vinyl chloride or the like covers the entire surface of the card on the upper surface side in the figure.

The IC card constructed in this way has a thickness within the standard dimension of 0°76, and has a built-in IC chip and leads.
The joint terminal portion is sufficiently protected from external forces.

FIG. 6 is a conceptual diagram illustrating an example of a method for testing the durability of an IC card against external forces, in which 18 is an IC card, 19 is a rubber plate, 20 is a steel ball, 21 is a stand, 2
2 is the load, and 23 is the direction of reciprocating motion.

In the same figure, an IC card 18 is placed on a stand 21 with its thin flat side facing downward, with a steel ball 20 sandwiched between them.
A load 22 was applied via a rubber plate 19 while reciprocating movement was made on a table 21.

When an IC card equipped with an IC module according to the present invention was tested using this test method, the IC module did not suffer any damage and exhibited excellent durability.

In addition, as another test, an IC card equipped with an IC module according to the present invention was tested by stirring a large number of IC cards with water in a washing machine, and the failure rate was considerably lower than that of the conventional example. Ta.

C. Effects of the invention] As explained above, according to the present invention, the durability against external forces of an IC module that is required to be thin, such as one mounted on an IC card, etc. can be significantly improved, and the durability against external forces can be significantly improved. It is possible to provide an IC module with excellent functionality, excluding the technical drawbacks.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing one embodiment of an IC module according to the invention, FIG. 2 is a sectional view showing another embodiment of the invention, and FIG. 3 is a sectional view showing still another embodiment of the invention. , FIG. 4 is a process diagram explaining the method for manufacturing an IC module according to the present invention, and FIG.
6 is a conceptual diagram showing an example of a method for testing the durability of an IC card against external forces; FIG. 7 is a sectional view illustrating the structure of a thin IC module according to the prior art. , FIG. 8 is a sectional view illustrating the influence of external force on the IC module. 1...IC chip, 2゛---IC chip bump, 3゛-----lead, 4--junction terminal, 5--wiring board, 5゛-・----1 contact terminal board, 5"---frame, 6---contact terminal, 8゛---chip coat, 9---TAB lead supporter, 1 .0−−−−−・Closed space, 1)・・−1・
Thin board. Figure 1′ 1: [Cte,)゛5
″: Saiko 2': IC Su, No. 1
6: Repellent shoulder 3': Lead
8' 2nd, 4th court: Sawabara I Noji + Day, 1st 9 2 TAB Lead's 7th star 5; Kootsaizai Mototaka): rf
l Empty r Ni 5': holding p3 + board 1): Rang plate Fig. 2 Fig. 3 Fig. 4 Resin coating (W-'=t Tinge) Resin value conversion (
Cure) Figure 5 Figure 6

Claims (3)

[Claims] (1) In an IC module comprising a wiring board on which a bonding terminal is formed, an IC chip housed in a recess formed in the wiring board, and an external contact terminal formed on one side of the wiring board, the The IC chip has a lead, the lead is connected to the bonding terminal, and at least the IC chip is formed by bonding the lead to the bonding terminal.
An IC module characterized in that a reinforcing material made of a thin plate is provided to cover the chip and the joint portion between the lead and the connecting terminal, so as to protect the IC chip and the joint portion from external force. (2) The IC module according to claim (1), characterized in that a gap is provided between the bonding terminal formed on the wiring board and the reinforcing material. (3) In the IC module according to claim (1), the substrate forming the external contact terminal is made of a material with high rigidity, and at least the IC chip, the lead, and the connecting terminal are connected to each other. An IC module characterized in that the joint portion is protected from both sides together with the reinforcing material.