JPS6314470Y2 - - Google Patents

Info

Publication number
JPS6314470Y2
JPS6314470Y2 JP1981004759U JP475981U JPS6314470Y2 JP S6314470 Y2 JPS6314470 Y2 JP S6314470Y2 JP 1981004759 U JP1981004759 U JP 1981004759U JP 475981 U JP475981 U JP 475981U JP S6314470 Y2 JPS6314470 Y2 JP S6314470Y2
Authority
JP
Japan
Prior art keywords
lead
main body
semiconductor device
package
package main
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1981004759U
Other languages
English (en)
Japanese (ja)
Other versions
JPS57119548U (instruction
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1981004759U priority Critical patent/JPS6314470Y2/ja
Publication of JPS57119548U publication Critical patent/JPS57119548U/ja
Application granted granted Critical
Publication of JPS6314470Y2 publication Critical patent/JPS6314470Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1981004759U 1981-01-16 1981-01-16 Expired JPS6314470Y2 (instruction)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981004759U JPS6314470Y2 (instruction) 1981-01-16 1981-01-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981004759U JPS6314470Y2 (instruction) 1981-01-16 1981-01-16

Publications (2)

Publication Number Publication Date
JPS57119548U JPS57119548U (instruction) 1982-07-24
JPS6314470Y2 true JPS6314470Y2 (instruction) 1988-04-22

Family

ID=29803160

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981004759U Expired JPS6314470Y2 (instruction) 1981-01-16 1981-01-16

Country Status (1)

Country Link
JP (1) JPS6314470Y2 (instruction)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7195964B2 (ja) * 2019-02-14 2022-12-26 株式会社東芝 スイッチング装置および電子機器

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52156559A (en) * 1976-06-23 1977-12-27 Hitachi Ltd Small electronic device packaging package
JPS55153362A (en) * 1979-05-18 1980-11-29 Matsushita Electric Ind Co Ltd Chip type semiconductor part

Also Published As

Publication number Publication date
JPS57119548U (instruction) 1982-07-24

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