JPS63143867U - - Google Patents
Info
- Publication number
- JPS63143867U JPS63143867U JP1987034448U JP3444887U JPS63143867U JP S63143867 U JPS63143867 U JP S63143867U JP 1987034448 U JP1987034448 U JP 1987034448U JP 3444887 U JP3444887 U JP 3444887U JP S63143867 U JPS63143867 U JP S63143867U
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- relay
- housing
- ceramic substrate
- cable harness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 4
Landscapes
- Multi-Conductor Connections (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図は本考案の第１実施例を示すケーブルハ
ーネスの接続構造を示す断面図、第２図は従来の
ケーブルハーネス接続構造を示す断面図、第３図
は本考案の第２実施例を示すケーブルハーネスの
接続構造を示す断面図、第４図は本考案の第３実
施例を示すケーブルハーネスの接続構造を示す断
面図である。
１…印刷回路板、２…ベース板、３…ケーブル
ハーネス、４…中継ハウジング、７，１０，１３
…ターミナル、８，１１，１４…チツプ端子、９
，１２，１５…中継印刷板。
Fig. 1 is a sectional view showing a cable harness connection structure according to a first embodiment of the present invention, Fig. 2 is a sectional view showing a conventional cable harness connection structure, and Fig. 3 is a sectional view showing a cable harness connection structure according to a second embodiment of the present invention. FIG. 4 is a sectional view showing a cable harness connection structure according to a third embodiment of the present invention. DESCRIPTION OF SYMBOLS 1...Printed circuit board, 2...Base board, 3...Cable harness, 4...Relay housing, 7, 10, 13
...Terminal, 8, 11, 14...Chip terminal, 9
, 12, 15...Relay printing board.
Claims (1)
、 (b) 該ハウジング内に中継ハウジングを介して
導入されるケーブルハーネスと、 (c) 前記中継ハウジングに設けられるターミナ
ルと、 (d) 前記セラミツク基板に接続されるチツプ端
子と、 (e) 該チツプ端子と前記ターミナル間に設けら
れる中継印刷板とを設け、 (f) 前記セラミツク基板上のチツプ端子と前記
中継ハウジングのターミナルを前記中継印刷板へ
搭載し、セラミツク基板とケーブルハーネスを接
続することを特徴とするケーブルハーネス接続構
造。[Claims for Utility Model Registration] (a) A ceramic substrate built into a housing, (b) A cable harness introduced into the housing via a relay housing, (c) A terminal provided in the relay housing. (d) a chip terminal connected to the ceramic substrate; (e) a relay printed board provided between the chip terminal and the terminal; (f) a connection between the chip terminal on the ceramic substrate and the relay housing; A cable harness connection structure characterized in that a terminal is mounted on the relay printing board to connect the ceramic substrate and the cable harness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987034448U JPS63143867U (en) | 1987-03-11 | 1987-03-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987034448U JPS63143867U (en) | 1987-03-11 | 1987-03-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63143867U true JPS63143867U (en) | 1988-09-21 |
Family
ID=30843009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987034448U Pending JPS63143867U (en) | 1987-03-11 | 1987-03-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63143867U (en) |
-
1987
- 1987-03-11 JP JP1987034448U patent/JPS63143867U/ja active Pending
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