JPS63142646A - Wafer prober - Google Patents

Wafer prober

Info

Publication number
JPS63142646A
JPS63142646A JP61289059A JP28905986A JPS63142646A JP S63142646 A JPS63142646 A JP S63142646A JP 61289059 A JP61289059 A JP 61289059A JP 28905986 A JP28905986 A JP 28905986A JP S63142646 A JPS63142646 A JP S63142646A
Authority
JP
Japan
Prior art keywords
probes
data
pad
wafer
stage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP61289059A
Other languages
Japanese (ja)
Inventor
Yasuyoshi Yamatsu
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP61289059A priority Critical patent/JPS63142646A/en
Publication of JPS63142646A publication Critical patent/JPS63142646A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To improve the operating efficiency of a probing test and to enhance the positioning reliability by a method wherein a position-detecting means to detect the position of a probe is installed on a stage of a prober so as to detect the position of the probe automatically and the data on the position of this probe is compared with the data on the position of a pad on a wafer.
CONSTITUTION: Pressure-sensor cells 19 with which probes 31 are brought into contact detect the pressing pressure on the basis of the change in the resistance value or the electrostatic capacitance value on the surface and the reverse side of the cells and judge the position of the probes 31. During this process, after the position in the upward and downward directions of the probes which have detected the pressure (θ: the position in the upward and downward directions of the Z-stage) has been detected, the height value of the tip of the probes is detected and is then stored. The data on the position of the probes 31 is transmitted to a position-computing unit 17. Then, a wafer 15 is mounted on a chuck 14 and is fixed by a vacuum suction method. This wafer 15 is shifted under an image-processing unit 23 by driving an X-Y stage 12. The image processing unit 23 senses a pad at a chip on the wafer 15 and transmits the data on the position of the pad to the position-computing unit 17. The position- computing unit 17 compares the position of the probes with the position of the pad on the basis of the data on the position of the probes 31 and the data on the position of the pad.
COPYRIGHT: (C)1988,JPO&Japio
JP61289059A 1986-12-05 1986-12-05 Wafer prober Pending JPS63142646A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61289059A JPS63142646A (en) 1986-12-05 1986-12-05 Wafer prober

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61289059A JPS63142646A (en) 1986-12-05 1986-12-05 Wafer prober

Publications (1)

Publication Number Publication Date
JPS63142646A true JPS63142646A (en) 1988-06-15

Family

ID=17738287

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61289059A Pending JPS63142646A (en) 1986-12-05 1986-12-05 Wafer prober

Country Status (1)

Country Link
JP (1) JPS63142646A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017092408A (en) * 2015-11-17 2017-05-25 三菱電機株式会社 Evaluation device and evaluation method for semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017092408A (en) * 2015-11-17 2017-05-25 三菱電機株式会社 Evaluation device and evaluation method for semiconductor device

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