JPS63140642U - - Google Patents

Info

Publication number
JPS63140642U
JPS63140642U JP3207187U JP3207187U JPS63140642U JP S63140642 U JPS63140642 U JP S63140642U JP 3207187 U JP3207187 U JP 3207187U JP 3207187 U JP3207187 U JP 3207187U JP S63140642 U JPS63140642 U JP S63140642U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit device
bonding pad
shape
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3207187U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3207187U priority Critical patent/JPS63140642U/ja
Publication of JPS63140642U publication Critical patent/JPS63140642U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP3207187U 1987-03-04 1987-03-04 Pending JPS63140642U (US07709020-20100504-C00041.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3207187U JPS63140642U (US07709020-20100504-C00041.png) 1987-03-04 1987-03-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3207187U JPS63140642U (US07709020-20100504-C00041.png) 1987-03-04 1987-03-04

Publications (1)

Publication Number Publication Date
JPS63140642U true JPS63140642U (US07709020-20100504-C00041.png) 1988-09-16

Family

ID=30838393

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3207187U Pending JPS63140642U (US07709020-20100504-C00041.png) 1987-03-04 1987-03-04

Country Status (1)

Country Link
JP (1) JPS63140642U (US07709020-20100504-C00041.png)

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