JPS63137946U - - Google Patents
Info
- Publication number
- JPS63137946U JPS63137946U JP1987030068U JP3006887U JPS63137946U JP S63137946 U JPS63137946 U JP S63137946U JP 1987030068 U JP1987030068 U JP 1987030068U JP 3006887 U JP3006887 U JP 3006887U JP S63137946 U JPS63137946 U JP S63137946U
- Authority
- JP
- Japan
- Prior art keywords
- notch
- insulating substrate
- semiconductor device
- metal pattern
- distance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 claims 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
- H01L2224/48139—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate with an intermediate bond, e.g. continuous wire daisy chain
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図Ａ，Ｂはこの考案の一実施による絶縁基
板の斜視図とその一部の拡大断面図、第２図Ａ，
Ｂはこの考案の他の実施例による斜視図とその断
面図、第３図Ａ，Ｂは従来の半導体装置を示す平
面図と側面図であり、第４図は第３図Ａの―
線における断面図、第５図は従来の絶縁基板を示
す斜視図、第６図はその割れた状態を示す斜視図
である。 図中、１は放熱板、２ａ，２ｂは半導体チツプ
、３ａ，３ｂは電極パツド、４は絶縁基板、５ａ
，５ｂは外部電極、７は封止樹脂、２１は絶縁基
板本体、２２ａ，２２ｂは金属パターン、２４は
切り込みである。尚、図中同一符号は同一または
相当部分を示す。
板の斜視図とその一部の拡大断面図、第２図Ａ，
Ｂはこの考案の他の実施例による斜視図とその断
面図、第３図Ａ，Ｂは従来の半導体装置を示す平
面図と側面図であり、第４図は第３図Ａの―
線における断面図、第５図は従来の絶縁基板を示
す斜視図、第６図はその割れた状態を示す斜視図
である。 図中、１は放熱板、２ａ，２ｂは半導体チツプ
、３ａ，３ｂは電極パツド、４は絶縁基板、５ａ
，５ｂは外部電極、７は封止樹脂、２１は絶縁基
板本体、２２ａ，２２ｂは金属パターン、２４は
切り込みである。尚、図中同一符号は同一または
相当部分を示す。
Claims (1)
- 【実用新案登録請求の範囲】 (1) 放熱板と、この放熱板上に接着され、かつ
半導体チツプおよび該半導体チツプより取り出さ
れた外部電極等を塔載した絶縁基板を備え、上記
半導体チツプと絶縁基板を封止樹脂により封止し
た構造よりなる半導体装置において、上記絶縁基
板にあらかじめ設けられている金属パターン以外
の部分に、割れ線用の切り込みを設けたことを特
徴とする半導体装置。 (2) 切り込みは、両側の金属パターンのほゞ中
間部に設けられ、かつ該切り込みと各金属パター
ンとの距離ｃは、金属パターンと基板本体の外縁
との距離ａ又はｂのうち、短い方と同等もしくは
それ以上の距離に設定されている実用新案登録請
求の範囲第１項記載の半導体装置。 (3) 切り込みは連続した錐状の穴で形成されて
いる実用新案登録請求の範囲第１項または第２項
記載の半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987030068U JPS63137946U (ja) | 1987-03-02 | 1987-03-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987030068U JPS63137946U (ja) | 1987-03-02 | 1987-03-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63137946U true JPS63137946U (ja) | 1988-09-12 |
Family
ID=30834540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987030068U Pending JPS63137946U (ja) | 1987-03-02 | 1987-03-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63137946U (ja) |
-
1987
- 1987-03-02 JP JP1987030068U patent/JPS63137946U/ja active Pending
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