JPS63136273A - Detecting device for optical pattern of sample substrate - Google Patents

Abstract

PURPOSE:To automatically inspect a sample substrate by applying a binarization process to both transmitted and reflected pictures to obtain automatically the inspection picture of a surface pattern of the sample substrate and a print pattern of a resistor from the logical arithmetic of the obtained binary picture. CONSTITUTION:A reflected picture A0 produced by the direct illumination 4 is picked up by a camera 5 and stored in a 1st picture memory 6. A transmitted picture B0 by transmissive illumination 3 is picked up by the camera 5 and stored in a 2nd picture memory 7. The picture signals A0 and B0 stored in the memories 6 and 7 are binarized by the binarizing means 8-10 for output of pictures A1, A2 and B1 respectively. An AND is calculated by a gate 12 between the binary picture A2 obtained by inverting the binary picture of the picture A0 and the binary picture B1 of the picture B0. Only a surface pattern is extracted out of an output C0 of the gate 12 since this surface pattern only is common with both pictures A2 and B1. The surface pattern of the output C0 is combined with a resistor of the picture A1 and a desired inspection picture is obtained from an output C1 of an OR gate 13.

Description

Detailed Description of the Invention [Objective of the Invention] (Industrial Field of Application) This invention provides an insulator and a vacuum for insulating conductor patterns and intersections of the patterns on an insulating substrate such as ceramic or epoxy resin. The printing of the printed sample substrate with the low antibody provided thereon relates to an optical pattern detection device for inspecting the printing condition.

(Conventional technology) Conventionally, a conductor pattern printed on a sample board,
Inspection of insulators and resistors relied on visual inspection.

(Problems to be Solved by the Invention) However, when inspecting the pattern of a sample board by visual inspection as in the past, work efficiency is poor and it is difficult to extract images of conductor patterns, insulators, and resistors. It was not possible to automate the inspection, which could be done.

Also, since an insulator is interposed at the intersection of the conductor patterns,
Cracks, etc. tend to appear in the pattern, but they are difficult to detect by visual inspection, resulting in inspection failures.

This invention was made in view of such conventional problems, and after subjecting the transmitted images and reflected images obtained by transmitted illumination and direct illumination to 2 nitrification processing, respectively, optically It is an object of the present invention to provide a temporary optical pattern detection device that can automatically obtain a pattern.

[Structure of the Invention] (Means for Solving the Problems) The optical pattern detection device for a sample substrate of the present invention has the following features:
An imaging means for obtaining a transmitted image by transmitted illumination of a sample substrate on which a conductive pattern, an insulator, and a resistor are printed on an insulating substrate, and a reflected image by direct illumination of the sample substrate, and this imaging means. an image memory for storing the transmitted image and the reflected image acquired in , and a binarization process is performed on the reflected image using a low-level first threshold value for extracting the resistor to create a first binarized image. a first binarization means for obtaining a value of A second binarization means for obtaining a two-binarized image, and a third threshold value that is approximately equal to the second threshold value for extracting a conductive pattern on the transparent image perform a binarization process. 3rd step to obtain a binarized image 2nd step
a surface pattern image obtaining means for obtaining a surface pattern image from the logical product of the inverted image of the second binary image and the third binary image; The present invention is characterized by comprising means for calculating the inspection image 1q from a logical sum with the image.

(Function) According to the optical pattern detection device for a sample substrate of the present invention, an inverted image of the second binarized image obtained by the binarization processing of the reflected image and a third 21ia image obtained by the binarization processing of the transmitted image are obtained. First, a temporary surface pattern image of the sample board is extracted from the logical product of be able to.

(Example) Hereinafter, one embodiment of the present invention will be explained in detail based on the drawings.

FIG. 1 shows an embodiment of the invention. The sample board 1 is an insulating board made of, for example, ceramic or epoxy resin, on which a conductor pattern, an insulator for insulating the intersections of the pattern, and a resistor provided on the pattern are printed. . There are two types of illumination devices for this sample substrate 1, namely, transmitted illumination 3 which is performed from the back via the diffuser plate 2, and direct illumination 4 which is performed directly from the front side.

Imaging other than the sample substrate 1 is performed by the camera 5, and a transmitted image [Bo3 by the transmitted illumination 3] and a transmitted image by the direct illumination 4 are taken by the camera 5.
A reflection image [Ao] is obtained.

Connected to the camera 5 are a first image memory 6 and a second image memory 7 that store the image pickup signals. Then, for these image memories 6.7, the first 2III
A converting means 8, a second 2m converting means 9, and a third binarizing means 10 are connected to each other.

The output image of the second second cropping means 9 @[Al1 is inverted by the inverting means 1
1 and the third binarization means 10
The output image (1 [B+] of be done.

Next, the procedure of an optical pattern detection method according to an embodiment of the present invention based on the sample substrate optical pattern detection system having the above configuration will be described.

First, the reflected image [
Ao] is imaged by the camera 5, and the image signal is stored in the first image memory 6. Further, by using the transmitted illumination 3, a transparent surface Q[Bo3 as shown in FIG. 3 is imaged with the camera 5,
The image signal is stored in the second image memory 7.

The image signals [Aol, [BO] stored in the first image memory 6 and the second image memory 7 are the first 2 flil!
In each of the converting means 8, the second binarizing means 9, and the third binarizing means 10, the first threshold Tb+, the second threshold Th2, and the third threshold 1''h3 are used. 2#i processing, first binarized image [A+J1th: 21a 1il
i image [A2], ffi 32 tKi image E 8
+ ] is output.

Here, in the reflection image & A binarized image [Al1] can be obtained. Further, in the reflected image rAo], it is difficult to distinguish between the silver color of the surface pattern and the white color of the substrate, but on the other hand, the resistor and insulator are black and can be distinguished from the surface pattern and the board surface. Therefore, the reflection image [Ao
If E is binarized, a second binarized image [Al1] in which the low antibody and the insulator are 1 (black) is obtained, and by inverting this, the surface pattern and substrate surface are identified as shown in Figure 5. It is possible to obtain an inverted second binarized image [Al1] in which the value becomes 1 (black).

The third threshold Th3 for the binarization process for the transparent surface @[Bo3 is approximately equal to the second threshold la Th2, and as shown in FIG. Extract the third binarized image [B11] in which the conductor pattern becomes 1 (black).

In this way, the binarized images @ [A+], [A21, [B1
], the logical operations HAND and OR shown in the following equation are executed.

[Go] = [A2] ・[B+] [C+
] = [Co] + [A+] That is, the reflected image [the second binarized image of Aol [the inverted second binarized image obtained by inverting A21], the transmitted image [the third 21ia image of Bo E] The logical product with [B+] is AND gate 1
It is calculated by 2. From this AND output [Co], since only the surface pattern is common to [Al1 and [B1], only the surface pattern shown in FIG. 7 is extracted.

Also, from the output [C1] of the OR gate 13, [Co
The surface pattern of J and the resistor of [Al1 are matched,
1q of target inspection images as shown in FIG. 8 are obtained.

Note that the first binarized image [A11] of the reflected image [Ao]
Since only the resistor is extracted, this can be used as an inspection image to check whether the resistor is printed correctly.

This invention is not limited to the above embodiments, and various modifications can be made within the scope of the technical idea described in the claims.

[Effects of the Invention] Since the present invention has the above configuration, the transmitted image and the reflected image are binarized, and the surface pattern of the sample substrate and the printed pattern of the resistor can be determined from the logical operation of the obtained 21ifi image. 1q of inspection images can be automatically generated, and automatic inspection is possible. Therefore, there is no need for visual inspection as in the past, which contributes to improvement in inspection work efficiency. Furthermore, since intersections can be inspected using transparent images, accuracy is improved.

[Brief explanation of the drawing]

Fig. 1 is a block diagram of an embodiment of this invention, Fig. 2 is an explanatory diagram of a disused image in the above embodiment, Fig. 3 is an explanatory diagram of a transparent image, and Fig. 4 is a first binary image. 5 is an explanatory diagram of the second binary image, FIG. 6 is an explanatory diagram of the third binary image, FIG. 7 is an explanatory diagram of the surface pattern image, and FIG. 8 is an explanatory diagram of the inspection image. It is an explanatory diagram. 1... Rimple board 2... Diffusion plate 3... Transmitted illumination 4... Direct illumination 5... Camera 6.7... Image memory 8 to 10... Binarization means 11...・Inversion means 12...AND gate 13...OR gate

Claims (1)

[Scope of Claims] Imaging means for respectively obtaining a transmitted image by transmitted illumination of a sample substrate on which a conductive pattern, an insulator, and a resistor are baked and printed on an insulating substrate, and a reflected image by direct illumination of the sample substrate; an image memory for storing a transmitted image and a reflected image acquired by the imaging means; and a first binary value for performing binarization processing on the reflected image using a first low-level threshold value for extracting a resistor. a first binarization means for obtaining a converted image, and a binarization process is performed on the reflected image using a second threshold value higher than the first threshold value for extracting resistors and insulators. a second binarization means for obtaining a second binarized image; and binarization processing using a third threshold substantially equal to the second threshold for extracting a conductor pattern from the transparent image. a third binarization means for obtaining a third binarized image; and surface pattern image acquisition for obtaining a surface pattern image from the AND of the inverted image of the second binarized image and the third binarized image. An optical pattern detection apparatus for a sample substrate, comprising: means for obtaining an inspection image from a logical sum of the surface pattern image and the first binarized image.