JPS63132433U - - Google Patents
Info
- Publication number
- JPS63132433U JPS63132433U JP1987024708U JP2470887U JPS63132433U JP S63132433 U JPS63132433 U JP S63132433U JP 1987024708 U JP1987024708 U JP 1987024708U JP 2470887 U JP2470887 U JP 2470887U JP S63132433 U JPS63132433 U JP S63132433U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- bonded
- insulating film
- electronic device
- tape carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
Landscapes
- Electronic Switches (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987024708U JPS63132433U (US06623731-20030923-C00012.png) | 1987-02-21 | 1987-02-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987024708U JPS63132433U (US06623731-20030923-C00012.png) | 1987-02-21 | 1987-02-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63132433U true JPS63132433U (US06623731-20030923-C00012.png) | 1988-08-30 |
Family
ID=30824184
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987024708U Pending JPS63132433U (US06623731-20030923-C00012.png) | 1987-02-21 | 1987-02-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63132433U (US06623731-20030923-C00012.png) |
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1987
- 1987-02-21 JP JP1987024708U patent/JPS63132433U/ja active Pending
