JPS63122176U - - Google Patents
Info
- Publication number
- JPS63122176U JPS63122176U JP1539887U JP1539887U JPS63122176U JP S63122176 U JPS63122176 U JP S63122176U JP 1539887 U JP1539887 U JP 1539887U JP 1539887 U JP1539887 U JP 1539887U JP S63122176 U JPS63122176 U JP S63122176U
- Authority
- JP
- Japan
- Prior art keywords
- vehicle body
- floor panel
- side sill
- tunnel portion
- extending
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002787 reinforcement Effects 0.000 claims description 3
- 230000003014 reinforcing effect Effects 0.000 claims description 3
Landscapes
- Body Structure For Vehicles (AREA)
Description
第１図は、本考案の第１実施例に係る自動車の
ピラー部補強構造を示す斜視図、第２図は、同実
施例構造の断面図、第３図は、同実施例構造にお
ける連結部材のフロアパネル部位置の断面図、第
４図は、本考案の第２実施例に係る自動車のピラ
ー部補強構造を示す断面図である。
１……センターピラー、１ａ……ピラーアウタ
パネル、１ｂ……ピラーインナパネル、２……サ
イドシル、２ａ……サイドシルインナパネル、２
ｂ……サイドシルアウタパネル、１１……トンネ
ル部、１５……連結補強部材、１５Ａ……第１の
接合部、１５Ｂ……第２の接合部、１５Ｃ……第
３の接合部。
FIG. 1 is a perspective view showing a pillar reinforcement structure for an automobile according to a first embodiment of the present invention, FIG. 2 is a sectional view of the same embodiment structure, and FIG. 3 is a connecting member in the same embodiment structure. FIG. 4 is a sectional view showing a pillar reinforcement structure for an automobile according to a second embodiment of the present invention. 1...Center pillar, 1a...Pillar outer panel, 1b...Pillar inner panel, 2...Side sill, 2a...Side sill inner panel, 2
b...Side sill outer panel, 11...Tunnel portion, 15...Connection reinforcing member, 15A...First joint part, 15B...Second joint part, 15C...Third joint part.
Claims (1)
方向に延びるサイドシルと、該サイドシルより車
体上方に延びるセンターピラーと、このセンター
ピラー下部を上記サイドシルおよびフロアパネル
と結合する連結補強部材と、上記フロアパネルの
車幅方向中央部に位置して車体前後方向に延びる
トンネル部とを備えてなる自動車において、上記
連結補強部材のフロアパネル側接合端部を上記ト
ンネル部まで延設し当該トンネル部と結合したこ
とを特徴とする自動車のピラー部補強構造。 A side sill located on both sides of the vehicle body floor panel and extending in the longitudinal direction of the vehicle body, a center pillar extending upward from the vehicle body from the side sill, a connecting reinforcing member that connects the lower part of the center pillar with the side sill and the floor panel, and the floor panel. and a tunnel portion located at the center in the width direction of the vehicle and extending in the longitudinal direction of the vehicle body, in which a joint end on the floor panel side of the connection reinforcing member is extended to the tunnel portion and joined to the tunnel portion. An automobile pillar reinforcement structure characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1539887U JPS63122176U (en) | 1987-02-03 | 1987-02-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1539887U JPS63122176U (en) | 1987-02-03 | 1987-02-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63122176U true JPS63122176U (en) | 1988-08-09 |
Family
ID=30806295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1539887U Pending JPS63122176U (en) | 1987-02-03 | 1987-02-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63122176U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0510166U (en) * | 1991-07-19 | 1993-02-09 | マツダ株式会社 | Car side body structure |
| US7465619B2 (en) | 2001-08-09 | 2008-12-16 | Amberwave Systems Corporation | Methods of fabricating dual layer semiconductor devices |
-
1987
- 1987-02-03 JP JP1539887U patent/JPS63122176U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0510166U (en) * | 1991-07-19 | 1993-02-09 | マツダ株式会社 | Car side body structure |
| US7465619B2 (en) | 2001-08-09 | 2008-12-16 | Amberwave Systems Corporation | Methods of fabricating dual layer semiconductor devices |