JPS63117024A - Ultraviolet-curable silicone composition - Google Patents
Ultraviolet-curable silicone compositionInfo
- Publication number
- JPS63117024A JPS63117024A JP26354086A JP26354086A JPS63117024A JP S63117024 A JPS63117024 A JP S63117024A JP 26354086 A JP26354086 A JP 26354086A JP 26354086 A JP26354086 A JP 26354086A JP S63117024 A JPS63117024 A JP S63117024A
- Authority
- JP
- Japan
- Prior art keywords
- group
- parts
- weight
- composition according
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 46
- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 18
- -1 polysiloxane Polymers 0.000 claims abstract description 29
- 125000003118 aryl group Chemical group 0.000 claims abstract description 12
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 8
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 6
- 238000002156 mixing Methods 0.000 claims abstract description 6
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 claims abstract description 5
- 125000001183 hydrocarbyl group Chemical group 0.000 claims abstract 6
- 125000004432 carbon atom Chemical group C* 0.000 claims description 8
- 125000002947 alkylene group Chemical group 0.000 claims description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 claims description 3
- 125000003854 p-chlorophenyl group Chemical group [H]C1=C([H])C(*)=C([H])C([H])=C1Cl 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 11
- 229910052760 oxygen Inorganic materials 0.000 abstract description 11
- 239000001301 oxygen Substances 0.000 abstract description 11
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 abstract description 3
- 229910000077 silane Inorganic materials 0.000 abstract description 3
- 239000005046 Chlorosilane Substances 0.000 abstract description 2
- 239000003054 catalyst Substances 0.000 abstract description 2
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical compound Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 abstract description 2
- 125000003107 substituted aryl group Chemical group 0.000 abstract description 2
- 230000001588 bifunctional effect Effects 0.000 abstract 1
- 230000005855 radiation Effects 0.000 abstract 1
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 18
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 10
- 238000001723 curing Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 150000001451 organic peroxides Chemical class 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 5
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 5
- 150000002430 hydrocarbons Chemical group 0.000 description 5
- 125000003396 thiol group Chemical group [H]S* 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 4
- 206010034972 Photosensitivity reaction Diseases 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000005054 phenyltrichlorosilane Substances 0.000 description 4
- 230000036211 photosensitivity Effects 0.000 description 4
- 238000003786 synthesis reaction Methods 0.000 description 4
- ORVMIVQULIKXCP-UHFFFAOYSA-N trichloro(phenyl)silane Chemical group Cl[Si](Cl)(Cl)C1=CC=CC=C1 ORVMIVQULIKXCP-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- IVRMZWNICZWHMI-UHFFFAOYSA-N azide group Chemical group [N-]=[N+]=[N-] IVRMZWNICZWHMI-UHFFFAOYSA-N 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- OSXYHAQZDCICNX-UHFFFAOYSA-N dichloro(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](Cl)(Cl)C1=CC=CC=C1 OSXYHAQZDCICNX-UHFFFAOYSA-N 0.000 description 3
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 description 3
- 229920001921 poly-methyl-phenyl-siloxane Polymers 0.000 description 3
- 239000002562 thickening agent Substances 0.000 description 3
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000006356 dehydrogenation reaction Methods 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 229910021485 fumed silica Inorganic materials 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- 230000007062 hydrolysis Effects 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 238000006713 insertion reaction Methods 0.000 description 2
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 2
- 125000003944 tolyl group Chemical group 0.000 description 2
- 125000005023 xylyl group Chemical group 0.000 description 2
- KETQAJRQOHHATG-UHFFFAOYSA-N 1,2-naphthoquinone Chemical compound C1=CC=C2C(=O)C(=O)C=CC2=C1 KETQAJRQOHHATG-UHFFFAOYSA-N 0.000 description 1
- 229940105324 1,2-naphthoquinone Drugs 0.000 description 1
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 1
- DZZAHLOABNWIFA-UHFFFAOYSA-N 2-butoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCCCC)C(=O)C1=CC=CC=C1 DZZAHLOABNWIFA-UHFFFAOYSA-N 0.000 description 1
- SZIFAVKTNFCBPC-UHFFFAOYSA-N 2-chloroethanol Chemical compound OCCCl SZIFAVKTNFCBPC-UHFFFAOYSA-N 0.000 description 1
- 125000001731 2-cyanoethyl group Chemical group [H]C([H])(*)C([H])([H])C#N 0.000 description 1
- WSPOQKCOERDWJQ-UHFFFAOYSA-N 2-methyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound C[SiH]1O[SiH2]O[SiH2]O[SiH2]O1 WSPOQKCOERDWJQ-UHFFFAOYSA-N 0.000 description 1
- BSMGLVDZZMBWQB-UHFFFAOYSA-N 2-methyl-1-phenylpropan-1-one Chemical compound CC(C)C(=O)C1=CC=CC=C1 BSMGLVDZZMBWQB-UHFFFAOYSA-N 0.000 description 1
- UQRONKZLYKUEMO-UHFFFAOYSA-N 4-methyl-1-(2,4,6-trimethylphenyl)pent-4-en-2-one Chemical group CC(=C)CC(=O)Cc1c(C)cc(C)cc1C UQRONKZLYKUEMO-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 239000004902 Softening Agent Substances 0.000 description 1
- RMKZLFMHXZAGTM-UHFFFAOYSA-N [dimethoxy(propyl)silyl]oxymethyl prop-2-enoate Chemical compound CCC[Si](OC)(OC)OCOC(=O)C=C RMKZLFMHXZAGTM-UHFFFAOYSA-N 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 125000002877 alkyl aryl group Chemical group 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 125000000732 arylene group Chemical group 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- XTKDAFGWCDAMPY-UHFFFAOYSA-N azaperone Chemical compound C1=CC(F)=CC=C1C(=O)CCCN1CCN(C=2N=CC=CC=2)CC1 XTKDAFGWCDAMPY-UHFFFAOYSA-N 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- QABCGOSYZHCPGN-UHFFFAOYSA-N chloro(dimethyl)silicon Chemical compound C[Si](C)Cl QABCGOSYZHCPGN-UHFFFAOYSA-N 0.000 description 1
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 1
- 125000000068 chlorophenyl group Chemical group 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 229940126214 compound 3 Drugs 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 125000000596 cyclohexenyl group Chemical group C1(=CCCCC1)* 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 238000004807 desolvation Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 239000003759 ester based solvent Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 230000003090 exacerbative effect Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 150000002894 organic compounds Chemical group 0.000 description 1
- 150000003961 organosilicon compounds Chemical class 0.000 description 1
- 125000000286 phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 230000002165 photosensitisation Effects 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- UFUASNAHBMBJIX-UHFFFAOYSA-N propan-1-one Chemical compound CC[C]=O UFUASNAHBMBJIX-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- LVTJOONKWUXEFR-FZRMHRINSA-N protoneodioscin Natural products O(C[C@@H](CC[C@]1(O)[C@H](C)[C@@H]2[C@]3(C)[C@H]([C@H]4[C@@H]([C@]5(C)C(=CC4)C[C@@H](O[C@@H]4[C@H](O[C@H]6[C@@H](O)[C@@H](O)[C@@H](O)[C@H](C)O6)[C@@H](O)[C@H](O[C@H]6[C@@H](O)[C@@H](O)[C@@H](O)[C@H](C)O6)[C@H](CO)O4)CC5)CC3)C[C@@H]2O1)C)[C@H]1[C@H](O)[C@H](O)[C@H](O)[C@@H](CO)O1 LVTJOONKWUXEFR-FZRMHRINSA-N 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 239000002964 rayon Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000001235 sensitizing effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000008247 solid mixture Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- ABADVTXFGWCNBV-UHFFFAOYSA-N trichloro-(4-chlorophenyl)silane Chemical compound ClC1=CC=C([Si](Cl)(Cl)Cl)C=C1 ABADVTXFGWCNBV-UHFFFAOYSA-N 0.000 description 1
- 238000005292 vacuum distillation Methods 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Landscapes
- Polymerisation Methods In General (AREA)
- Graft Or Block Polymers (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は、紫外線硬化性シリコーン組成物に関し、さら
に詳しくは酸素存在下においても良好な硬化性を示す紫
外線硬化性シリコーン組成物に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to an ultraviolet curable silicone composition, and more particularly to an ultraviolet curable silicone composition that exhibits good curability even in the presence of oxygen.
シリコーンを紫外線で硬化させる組成物および方法は、
先行技術に記載されている。例えば、米国特許第3.7
26,710号は、ビニル基含有ポリオルガノシロキサ
ンに各種の増感剤を添加し、高強度紫外線照射を用いる
硬化方法を示している。しかしながらこの方法によると
、硬化が表面にのみとどまり、内部まで均一に硬化しな
いという欠点があった。また、米国特許第3.816.
282号は、メルカプト基含有ポリオルガノシロキサン
、ポリメチルビニルシロキサンおよび各種の有機過酸化
物で付加架橋させる組成物を提示しているが、この組成
物は室温における保存安定性が悪く、ゲル化が進行して
しまうという重大な欠点があった。また、メルカプト基
含有ポリオルガノシロキサンの合成に多段階の工程を要
し、メルカプト基特有の悪臭を放つなどの欠点もあった
。また、特開昭50−86553号公報には、メルカプ
ト基含有ポリオルガノシロキサンおよびゲル化禁止剤と
して2価フェノールまたはそのアルキル誘導体から成る
組成物が示されているが、保存時の安定性は改良された
ものの、メルカプト基含有ポリオルガノシロキサンにつ
いての前記の欠点は同様に残っていた。さらに、硬化が
表面のみにとどまり、内部まで均一に硬化しないという
欠点もあった。また、特開昭50−61486号公報は
、ビニル基含有ポリオルガノシロキサンとポリオルガノ
ハイドロジエンシロキサンおよび増悪剤を用い、付加反
応により架橋させる組成物を示しているが、これも硬化
が表面のみにとどまり内部まで硬化しないし、発泡現象
をひき起こすという重大な欠点を有していた。また、特
開昭48−19682号公報は、アクリル系不飽和基含
有ポリオルガノシロキサンおよび増悪剤からなる組成物
を提案しているが、この方法はすぐれた感光効果をもつ
反面、酸素の影響を受けやすく、感光性の経時変化及び
暗減衰が大きいという欠点がある。そのうえ、アクリル
系不飽和基含有ポリオルガノシロキサンの合成に多段階
を必要とし、得られたシリコーンの耐熱性が悪いという
欠点があった。また、アジド基含有ポリオルガノシロキ
サン、ビニルi含有ポリオルガノシロキサンおよび有機
過酸化物から成る組成物が、特開昭54−69197号
公報に提案されている。これは、アジド基含有ポリオル
ガノシロキサンのアジドの分解によるポリオルガノシロ
キサンの炭化水素基からの水素引抜反応、ビニル基含有
ポリオルガノシロキサンのビニル基への挿入反応および
ナイトレンどうしのカップリング反応による架橋、また
有機過酸化物の分解によるポリオルガノシロキサンの炭
化水素基からの水素引抜反応、ビニル基含有ポリオルガ
ノシロキサンのビニル基への挿入反応による架橋を並用
したものである。この提案は、すぐれた感光効果をもち
、酸素の影響も受けず、感光性の経時変化も少ないとい
う利点があったが、黄変するという欠点があった。また
、特開昭55−125123号公報には、ビニル基含有
ポリオルガノシロキサンあるいはビニル基含有ポリオル
ガノシロキサンと有機過酸化物とから成る組成物に、波
長100〜300 nmの紫外線を照射する方法が記載
されているが、ビニル基含有ポリオルガノシロキサンの
みの場合は、表面が硬化するのみにとどまり、深部まで
硬化しないし、硬化時間も、実用に耐えないほどの長時
間が必要であるという欠点があった。また、有機過酸化
物の併用も、同特許に例示されているベルオキシケクー
ル系、ジアルキル系、および、エステル系有機過酸化物
では、表面が未硬化で、硬化時間も、実用に耐えないほ
どの長時間が必要であるという欠点があった。Compositions and methods for curing silicone with ultraviolet light include
Described in the prior art. For example, U.S. Pat.
No. 26,710 discloses a curing method in which various sensitizers are added to vinyl group-containing polyorganosiloxane and high-intensity ultraviolet irradiation is used. However, this method has the disadvantage that curing occurs only on the surface and does not uniformly cure the inside. Also, U.S. Patent No. 3.816.
No. 282 proposes a composition in which addition crosslinking is performed using a mercapto group-containing polyorganosiloxane, polymethylvinylsiloxane, and various organic peroxides, but this composition has poor storage stability at room temperature and does not gel. There was a serious drawback in that it progressed. In addition, the synthesis of mercapto group-containing polyorganosiloxanes requires a multi-step process, and there are also drawbacks such as emitting a bad odor peculiar to mercapto groups. Furthermore, JP-A-50-86553 discloses a composition comprising a mercapto group-containing polyorganosiloxane and a dihydric phenol or its alkyl derivative as a gelling inhibitor, but the stability during storage is improved. However, the drawbacks mentioned above for mercapto group-containing polyorganosiloxanes remained as well. Furthermore, there was a drawback that the curing was limited to only the surface and the inside was not uniformly cured. Furthermore, JP-A No. 50-61486 discloses a composition that is crosslinked by an addition reaction using a vinyl group-containing polyorganosiloxane, a polyorganohydrodiene siloxane, and an exacerbating agent, but this also cures only the surface. It has the serious disadvantage that it does not harden to the inside and causes foaming. Furthermore, JP-A-48-19682 proposes a composition consisting of an acrylic unsaturated group-containing polyorganosiloxane and an aggravating agent, but while this method has an excellent photosensitizing effect, it is susceptible to the effects of oxygen. It has the drawbacks of being easily susceptible to photosensitivity, and having large changes in photosensitivity over time and dark decay. Moreover, the synthesis of the polyorganosiloxane containing an acrylic unsaturated group requires multiple steps, and the resulting silicone has the disadvantage of poor heat resistance. Further, a composition comprising an azide group-containing polyorganosiloxane, a vinyl i-containing polyorganosiloxane, and an organic peroxide has been proposed in JP-A-54-69197. This is a hydrogen abstraction reaction from the hydrocarbon group of the polyorganosiloxane by decomposition of the azide in the azide group-containing polyorganosiloxane, an insertion reaction into the vinyl group of the vinyl group-containing polyorganosiloxane, and crosslinking by a coupling reaction between nitrenes. Further, hydrogen abstraction reaction from the hydrocarbon groups of polyorganosiloxane by decomposition of organic peroxide and crosslinking reaction by insertion reaction into vinyl groups of polyorganosiloxane containing vinyl groups are used simultaneously. This proposal had the advantage of having excellent photosensitivity, being unaffected by oxygen, and having little change in photosensitivity over time, but had the disadvantage of yellowing. Furthermore, JP-A-55-125123 discloses a method of irradiating a vinyl group-containing polyorganosiloxane or a composition comprising a vinyl group-containing polyorganosiloxane and an organic peroxide with ultraviolet rays with a wavelength of 100 to 300 nm. However, in the case of only vinyl group-containing polyorganosiloxane, the disadvantage is that only the surface is cured, and the deep part is not cured, and the curing time is too long to be practical. there were. In addition, when using organic peroxides in combination, the beryoxykecool-based, dialkyl-based, and ester-based organic peroxides exemplified in the same patent do not have an uncured surface and the curing time is too long for practical use. The drawback was that it required a long time.
さらに特開昭48−16991号公報および特開昭53
−134085号公報では、メタクリロイルプロポキシ
変性ポリシロキサンと増感剤、溶剤から成る組成物が提
示され、紫外線照射により強度の高い皮膜が形成される
ことが記されている。また特開昭54−162787号
公報には、(メタ)アクリロキシアルキル基含有ポリオ
ルガノシロキサン、アクリレート系架橋剤および感光剤
から成る組成物が提示され、低いエネルギーの紫外線照
射により速く硬化することが記されている。しかしなが
ら、これらのアクリル系基含有組成物は、いずれも酸素
存在下で紫外線照射を行った場合の硬化が不十分で、表
面にベタツキ状態が残るという問題を有している。Furthermore, JP-A-48-16991 and JP-A-53
JP-134085 discloses a composition comprising a methacryloylpropoxy-modified polysiloxane, a sensitizer, and a solvent, and describes that a film with high strength is formed by ultraviolet irradiation. Furthermore, JP-A-54-162787 discloses a composition comprising a (meth)acryloxyalkyl group-containing polyorganosiloxane, an acrylate crosslinking agent, and a photosensitizer, which can be rapidly cured by low-energy ultraviolet irradiation. It is written. However, all of these acrylic group-containing compositions have the problem that they are insufficiently cured when irradiated with ultraviolet rays in the presence of oxygen, leaving a sticky state on the surface.
本発明の目的は、酸素の存在下でも紫外線照射により良
好に硬化し、また低温特性に優れたシリコーン組成物を
提供することにある。An object of the present invention is to provide a silicone composition that is well cured by ultraviolet irradiation even in the presence of oxygen and has excellent low-temperature properties.
本発明者らはこのような紫外線硬化性シリコーン組成物
を得るべく検討を重ねた結果、(メタ)アクリロキ・ジ
アルキル基を含有する3次元構造をもつシロキサン単位
とアリル基を含有する3次元構造をもつシロキサン単位
を有するシリコーン化合物を用いることにより酸素存在
下においても紫外線照射で良好に硬化する組成物が得ら
れることを見出し、ここに本発明をなすに至った。As a result of repeated studies to obtain such an ultraviolet curable silicone composition, the present inventors have developed a three-dimensional structure containing a siloxane unit having a three-dimensional structure containing a (meth)acryloki dialkyl group and an allyl group. The present inventors have discovered that by using a silicone compound having a siloxane unit, it is possible to obtain a composition that is well cured by ultraviolet irradiation even in the presence of oxygen, and has thus arrived at the present invention.
本発明はすなわち、
(A) 平均式;
(式中、R1は水素原子またはメチル基、Qlは炭素数
1〜5の置換または非置換の2価の炭化水素基、R2は
置換または非置換のアリール基、R3は置換または非置
換の1価の炭化水素基、aは1〜3、bはO〜8、Cは
O〜3、dは2〜lOの整数を表わし、a/ (a +
b + c + d)≧0.08かつ(b+c)/(
a+b+c+d)≧0.10である。)で表わされるポ
リシロキサン
100重量部
(B) 式;
%式%
(式中、R4は水素原子またはメチル基、R5は炭素数
1〜3のアルキル基またはアリール基、Q2は炭素数1
〜5の2価の炭化水素基、eは0〜8の整数を表わす。The present invention is characterized in that: (A) average formula; aryl group, R3 is a substituted or unsubstituted monovalent hydrocarbon group, a is 1 to 3, b is O to 8, C is O to 3, d is an integer of 2 to 1O, a/(a +
b + c + d)≧0.08 and (b+c)/(
a+b+c+d)≧0.10. ) 100 parts by weight of polysiloxane (B) Formula; % Formula % (In the formula, R4 is a hydrogen atom or a methyl group, R5 is an alkyl group or an aryl group having 1 to 3 carbon atoms, and Q2 is a carbon number 1
-5 divalent hydrocarbon group, e represents an integer of 0-8.
)で表わされるアクリル系化合物 5〜2
000重量部(C) 増感剤 (A) + (B)の
合計100重量部に対し0.5〜15重量部
から成ることを特徴とする紫外線硬化性シリコーン組成
物である。) Acrylic compound represented by 5-2
000 parts by weight (C) This is an ultraviolet curable silicone composition characterized by comprising 0.5 to 15 parts by weight of the sensitizer (A) + (B), based on a total of 100 parts by weight.
本発明における(A)成分のポリシロキサンは、平均式
;
で示される化合物で、本発明の組成物において硬化物の
主成分となるとともに、酸素存在下でも紫外線照射によ
り本組成物を良好に硬化させる本発明における最も特徴
的な成分である。R1としては水素原子またはメチル基
があげられる。The polysiloxane as the component (A) in the present invention is a compound represented by the average formula: It is a main component of the cured product in the composition of the present invention, and can be cured well by ultraviolet irradiation even in the presence of oxygen. This is the most characteristic component of the present invention. Examples of R1 include a hydrogen atom or a methyl group.
Qlは炭素数1〜5の置換または非置換の2価の炭化水
素基で、メチレン基、エチレン基、プロピレン基、ブチ
レン基などのアルキレン基;フェニレン基などのアリー
レン基などやそれらの基にハロゲン原子が置換した基を
あげることができるが、合成の容易さから炭素数2〜4
のアルキレン基が好ましい。またR2としてはフェニル
基、トリル基、キシリル基、ビフェニル基などのアリー
ル基および2,4−クロロフェニル基などの置換アリー
ル基が例示されるが、合成の容易さと良好な硬化性を示
すことからフェニル基または2.4−クロロフェニル基
であることがより好ましい R3としてはメチル基、エ
チル基、プロピル基、ブチル基、イソブチル基、アミル
基、ヘキシル基、オクチル基、デシル基などのアルキル
基;アリル基、シクロヘキセニル基などのアルケニル基
;シクロペンチル基、シクロヘキシル基などのシクロア
ルキル基;トリル基、キシリル基、メシチル基などのア
ルカリル基;ベンジル基、フェニルエチル基などのアラ
ルキル基;あるいは、これらの基の水素原子の一部もし
くは全部がハロゲン原子などで置換された基、例えば3
.3.3− )リフルオロプロピル基、クロロメチル基
、クロロフェニル基、シアノエチル基などが例示される
が、合成の容易さ、形成された硬化皮膜の強度および耐
熱性の点からすべてがメチル基であることが好ましい。Ql is a substituted or unsubstituted divalent hydrocarbon group having 1 to 5 carbon atoms; alkylene groups such as methylene, ethylene, propylene, and butylene; arylene groups such as phenylene; and halogens in these groups. Examples include groups with substituted atoms, but for ease of synthesis, groups with 2 to 4 carbon atoms are preferred.
An alkylene group is preferred. Examples of R2 include aryl groups such as phenyl, tolyl, xylyl, and biphenyl, and substituted aryl groups such as 2,4-chlorophenyl. or 2,4-chlorophenyl group R3 is an alkyl group such as methyl group, ethyl group, propyl group, butyl group, isobutyl group, amyl group, hexyl group, octyl group, decyl group; allyl group , alkenyl groups such as cyclohexenyl; cycloalkyl groups such as cyclopentyl and cyclohexyl; alkaryl groups such as tolyl, xylyl and mesityl; aralkyl groups such as benzyl and phenylethyl; or A group in which some or all of the hydrogen atoms are substituted with a halogen atom, such as 3
.. 3.3-) Lifluoropropyl group, chloromethyl group, chlorophenyl group, cyanoethyl group, etc. are exemplified, but all are methyl groups from the viewpoint of ease of synthesis, strength and heat resistance of the formed cured film. It is preferable.
また、各シロキサン成分を示すa、b、cおよびdは、
aが1〜3の整数、b fJ< o 〜gの整数、Cが
O〜3の整数、dは2〜10の整数であり、空気中での
良好な硬化性を得るためにはa/(a+b+c+d)≧
0.08かつ(b+c)/(a+b+c+d)≧0.1
0の条件を満足することが必要であり、さらにb/(a
+b+c+d)≧0.12であることがより好ましい。In addition, a, b, c, and d indicating each siloxane component are
a is an integer of 1 to 3, b is an integer of fJ<o to g, C is an integer of O to 3, and d is an integer of 2 to 10. In order to obtain good curability in air, a/ (a+b+c+d)≧
0.08 and (b+c)/(a+b+c+d)≧0.1
It is necessary to satisfy the condition of 0, and furthermore, b/(a
It is more preferable that +b+c+d)≧0.12.
このような化合物としては、次のような平均式で示され
る物質が例示される。Examples of such compounds include substances represented by the following average formula.
このようなポリシロキサンは、r−(メタ)アクリロキ
シプロピルトリメトキシシランなどの(メタ)アクリロ
キシ基を含有する3官能性シラン;フェニルトリクロロ
シラン、クロロフェニルトリクロロシラン、ジフェニル
ジクロロシランなどのアリール基含有クロロシラン;ジ
メチルクロロシランなどの2官能性シランを周知の方法
で共加水分解し、水酸化カリウム等の触媒下で縮合する
ことにより得られる。Such polysiloxanes include trifunctional silanes containing (meth)acryloxy groups such as r-(meth)acryloxypropyltrimethoxysilane; chlorosilanes containing aryl groups such as phenyltrichlorosilane, chlorophenyltrichlorosilane, and diphenyldichlorosilane. ; It is obtained by cohydrolyzing a difunctional silane such as dimethylchlorosilane by a well-known method and condensing it in the presence of a catalyst such as potassium hydroxide.
本発明における(B)のアクリル系化合物は、R’ 0
(式中、R’、R’、Q”、eは前述のとおり。)で示
されるもので、(A)成分が固体状の場合はその溶媒と
しての作用をするとともに、硬化物の機械的特性を保つ
ための成分である H4としてはR’と同様水素原子ま
たはメチル基が例示される。The acrylic compound (B) in the present invention is represented by R' 0 (in the formula, R', R', Q", and e are as described above), and when the component (A) is solid, acts as a solvent and is a component for maintaining the mechanical properties of the cured product. Examples of H4 include a hydrogen atom or a methyl group, similar to R'.
R5としては、−メチル基、エチル基、プロピル基のア
ルキル基;フェニル基などのアリール基が例示されるが
、良好な光硬化性が得られ、また高い屈折率を必要とす
る場合はアリール基が好ましい。Q2はメチレン基、エ
チレン基、プロピレン基、ブチレン基などの炭素数1〜
5のアルキレン基;フェニレン基などのアリール基など
やそれらの基にハロゲンなどの置換基を草大した基をあ
げることができるが、(^)成分との相溶性から炭素数
2〜4のアルキレン基が好ましく、毒性や低温での硬化
性の面からエチレン基がより好ましし;。またeはO〜
8の整数で、(A)成分との相溶性および良好な硬化性
を与えることから1〜5の整数であることが好ましい。Examples of R5 include alkyl groups such as -methyl group, ethyl group, and propyl group; aryl groups such as phenyl group; however, when good photocurability is obtained and a high refractive index is required, aryl groups are used. is preferred. Q2 has 1 or more carbon atoms such as methylene group, ethylene group, propylene group, butylene group, etc.
Alkylene group in 5; Examples include aryl groups such as phenylene groups, and groups with substituents such as halogen on these groups, but alkylene groups with 2 to 4 carbon atoms are preferred due to compatibility with the (^) component. A group is preferable, and an ethylene group is more preferable from the viewpoint of toxicity and curability at low temperatures. Also, e is O~
It is an integer of 8, and is preferably an integer of 1 to 5 because it provides compatibility with component (A) and good curability.
本発明における(B)成分の配合量は、(A)成分10
0重量部に対し5〜2000重量部、好ましくは10〜
1000重量部である。5重量部未満では組成物の粘度
が高すぎて作業性に問題があり、また2000重量部を
超えると本発明の特徴である酸素存在下における紫外線
照射による硬化性が著しく悪くなる。The blending amount of component (B) in the present invention is 10% of component (A).
5 to 2000 parts by weight, preferably 10 to 0 parts by weight
It is 1000 parts by weight. If it is less than 5 parts by weight, the viscosity of the composition will be too high, causing problems in workability, and if it exceeds 2,000 parts by weight, the curability by ultraviolet irradiation in the presence of oxygen, which is a feature of the present invention, will be significantly impaired.
本発明における(C)の増感剤は、光を受けて励起化し
、(メタ)アクリロキシ基を含有するシロキサンに励起
エネルギーを与えて紫外線照射による硬化反応を促進す
るものである。このような物質としては、アセトフェノ
ン、ベンゾインプロピルエーテル、ベンゾインブチルエ
ーテル、ジェトキシアセトフェノン、2−メチル−2−
ヒドロキシプロピオフェノン、1−(4−イソプロピル
フェニル)−2−ヒドロキシ−2−メチルプロパノン、
2−ヒドロキシ−2−メチル−1−フェニルプロパン−
1−オンなどのケトン系あるいはエーテル系化合物、ベ
ンゾキノン、アントラキノン、1.2−ナフトキノンな
どのキノン系化合物などが例示されるが、硬化速度を速
める意味で2−ヒドロキシ−2−メチル−1−フェニル
プロパン−1−オンが最も好ましい。The sensitizer (C) in the present invention is excited upon receiving light, imparts excitation energy to the siloxane containing a (meth)acryloxy group, and promotes the curing reaction by ultraviolet irradiation. Such substances include acetophenone, benzoinpropyl ether, benzoin butyl ether, jetoxyacetophenone, 2-methyl-2-
Hydroxypropiophenone, 1-(4-isopropylphenyl)-2-hydroxy-2-methylpropanone,
2-Hydroxy-2-methyl-1-phenylpropane-
Examples include ketone or ether compounds such as 1-one, quinone compounds such as benzoquinone, anthraquinone, and 1,2-naphthoquinone, but 2-hydroxy-2-methyl-1-phenyl is used to speed up the curing speed. Most preferred is propan-1-one.
この(C)成分の配合量は、(A) +(B)の合計1
00重量部に対して0.5〜15重量部、好ましくは1
.0〜10重量部である。0.5重量部未満では好まし
い増感効果が得られず、15重量部を越えると増粘しや
すく系の安定性に支障をきたす。The blending amount of this component (C) is the total of (A) + (B) 1
0.5 to 15 parts by weight, preferably 1
.. It is 0 to 10 parts by weight. If it is less than 0.5 parts by weight, a desirable sensitizing effect cannot be obtained, and if it exceeds 15 parts by weight, the viscosity tends to increase and the stability of the system is impaired.
本発明の組成物には、必要に応じて増粘剤としてポリア
クリルレジン、ポリメタクリルレジンを用いてもよい。In the composition of the present invention, polyacrylic resin or polymethacrylic resin may be used as a thickener, if necessary.
これにより、硬化物に柔軟性を付与することもできる。Thereby, flexibility can also be imparted to the cured product.
ただし多すぎると、紫外線による酸素存在下での硬化性
が失われるので、配合量は(A)成分100重量部に対
し10重量部以下でなければならない。また、柔軟剤と
して、ケイ素に結合せる全有機中の5〜40モル%がフ
ェニル基であるポリメチルフェニルシロキサンを用いて
もよく、これにより硬化物の硬さを調整することもでき
る。これも多すぎると、分離現象や硬化物からのにじみ
を生じるので、その配合量は(A)成分100重量部に
対し10重量部以下でなければならない。However, if the amount is too large, the curability in the presence of oxygen due to ultraviolet rays will be lost, so the blending amount must be 10 parts by weight or less per 100 parts by weight of component (A). Further, as a softening agent, polymethylphenylsiloxane in which 5 to 40 mol % of the total organic compounds bonded to silicon are phenyl groups may be used, and thereby the hardness of the cured product can be adjusted. If this amount is too large, a separation phenomenon or bleeding from the cured product may occur, so the blending amount must be 10 parts by weight or less per 100 parts by weight of component (A).
また、硬化物の機械的強度をさらに向上させるために、
必要に応じて煙霧質シリカ、沈澱シリカ、焼成シリカ、
シリカエアロゲル、石英微粉末などを加えても何等さし
つかえない、これらのシリカは単独で用いても2種以上
を混合して用いてもよく、また、そのまま用いても、表
面をポリジメチルシロキサン、オクタメチルシクロテト
ラシロキサン、ヘキサメチルジシラザンのような有機ケ
イ素化合物で処理して用いてもよい。In addition, in order to further improve the mechanical strength of the cured product,
Fumed silica, precipitated silica, pyrogenic silica,
There is no harm in adding silica airgel, quartz fine powder, etc. These silicas can be used alone or in combination of two or more, and even if used as is, the surface can be coated with polydimethylsiloxane, octa It may be used after being treated with an organosilicon compound such as methylcyclotetrasiloxane or hexamethyldisilazane.
さらに本発明の組成物には、支持体に塗布するための粘
度を調整する目的で溶剤を用いることができる。このよ
うな溶剤としては、メチルエチルケトン、メチルイソブ
チルケトンなどのようなケトン系溶剤、ベンゼン、トル
エン、キシレンなどの芳香族炭化水素系溶剤などを使用
することができる。Furthermore, a solvent can be used in the composition of the present invention for the purpose of adjusting the viscosity for coating on a support. Examples of such a solvent include ketone solvents such as methyl ethyl ketone and methyl isobutyl ketone, and aromatic hydrocarbon solvents such as benzene, toluene and xylene.
なお、本発明の組成物には、上記溶剤のほかに例えばハ
ロゲン化炭化水素溶剤、アルコール系溶剤、エステル系
溶剤などで、(メタ)アクリロキシ基に対し不活性なも
のを希釈剤として用いてよい。In addition to the above-mentioned solvents, in the composition of the present invention, for example, halogenated hydrocarbon solvents, alcohol solvents, ester solvents, etc. that are inert to (meth)acryloxy groups may be used as diluents. .
本発明の組成物によれば、従来の紫外線硬化性シリコー
ン組成物と異なり、酸素存在下においても紫外線を短時
間照射することにより効果的に硬化させることができる
。而して得られた硬化生成物は電気特性、耐熱性、耐候
性が極めて優れている。そのため硬化生成物は、半導体
の接合部の保護コーティング、コンデンサーコイルなど
受動素子の防湿コーティング、光ファイバーのプライマ
リ−、バッファーコーティングなど、幅広い用途に適用
できる。According to the composition of the present invention, unlike conventional ultraviolet curable silicone compositions, it can be effectively cured by short-time irradiation with ultraviolet light even in the presence of oxygen. The cured product thus obtained has extremely excellent electrical properties, heat resistance, and weather resistance. Therefore, the cured product can be applied to a wide range of applications, including protective coatings for semiconductor junctions, moisture-proof coatings for passive devices such as condenser coils, and primary and buffer coatings for optical fibers.
以下、本発明を実施例によって説明する。実施例中、部
はいずれも重量部を表わす。Hereinafter, the present invention will be explained by examples. In the examples, all parts represent parts by weight.
参考例1
フラスコに水1000部およびトルエン1000部を仕
込み、温度を10℃に保ちその中にγ−メタクリロキシ
プロピルトリエトキシシラン、フェニルトリクロロシラ
ンおよびジメチルジク口ロシランを第1表に示す割合で
1時間かけて滴下し、70℃で1時間保って攪拌しなが
ら加水分解を行った。反応終了後下層を分離し、水洗、
加熱による脱水を行った後、0.1水酸化カリウム水溶
液中で115℃で5時間保って縮合反応を行い、その後
エチレンクロロヒドリンで中和後、トルエンを一部脱溶
し、濾過して第1表のメタクリロキシ基含有シロキサン
を得た。Reference Example 1 1,000 parts of water and 1,000 parts of toluene were placed in a flask, the temperature was kept at 10°C, and γ-methacryloxypropyltriethoxysilane, phenyltrichlorosilane and dimethyldichlorosilane were added in the proportions shown in Table 1 for 1 hour. The solution was added dropwise over the course of 1 hour, and the mixture was kept at 70° C. for 1 hour to perform hydrolysis while stirring. After the reaction is complete, separate the lower layer, wash with water,
After dehydration by heating, the mixture was kept at 115°C for 5 hours in a 0.1 potassium hydroxide aqueous solution to carry out a condensation reaction, and then neutralized with ethylene chlorohydrin, toluene was partially removed, and filtered. A methacryloxy group-containing siloxane shown in Table 1 was obtained.
第 1 表 ここで、 C)1.0 D : (C113)ZSiO である。Table 1 here, C) 1.0 D: (C113)ZSiO It is.
参考例2
比較例化合物のメタクリロキシ基含有シロキサンとして
、次の化合物を得た。Reference Example 2 The following compound was obtained as a methacryloxy group-containing siloxane as a comparative example compound.
フラスコに水1000部、トルエン150部およびn−
ブチルアルコール200部を仕込み、温度を10℃に保
ちながらその中にジメチルジクロロシラン150部、ジ
フェニルジクロロシラン100 部、フェニルトリクロ
ロシラン40部およびγ−メタクリロキシプロピルトリ
エトキシシラン60部を1時間かけて滴下し、参考例1
と同様な方法で加水分解した。これを30分間攪拌して
静置復水層を分離し、水洗後減圧蒸留によりトルエン、
ブチルアルコール等を留去することにより固形組成物P
を得た。In a flask, 1000 parts of water, 150 parts of toluene and n-
Charge 200 parts of butyl alcohol, and while maintaining the temperature at 10°C, add 150 parts of dimethyldichlorosilane, 100 parts of diphenyldichlorosilane, 40 parts of phenyltrichlorosilane, and 60 parts of γ-methacryloxypropyltriethoxysilane over 1 hour. Dripping, Reference Example 1
Hydrolyzed in the same manner. This was stirred for 30 minutes to separate the stationary condensate layer, and after washing with water, toluene was extracted by vacuum distillation.
Solid composition P is obtained by distilling off butyl alcohol, etc.
I got it.
実施例1
参考例1,2によって得られた化合物(A1゜A2並び
にP)に、第2表に示す割合でアクリル系化合物C)1
.=Cl1−C賢0CJah−0−Calls (Bl
)および 0H
シー2−メチル−1−フェニルプロパン−1−オン)を
混合し、万能混練機で均一に分散させて本発明の組成@
IJ511〜S14および比較組成物C1l、C12を
得た。Example 1 Acrylic compound C) 1 was added to the compounds (A1゜A2 and P) obtained in Reference Examples 1 and 2 in the proportions shown in Table 2.
.. =Cl1-Cken0CJah-0-Calls (Bl
) and 0H C2-methyl-1-phenylpropan-1-one) and uniformly dispersed with a universal kneader to form the composition of the present invention @
IJ511 to S14 and comparative compositions C11 and C12 were obtained.
これらの組成物を直径約6cmのポリテトラフルオロエ
チレンでコーティングしたステンレス容器に約2cmの
厚みになるように流し込み、脱泡後、紫外線照射用の8
0W/cmの高圧水銀ランプ(ウシオ電機■製、UV−
7000)で空気中にて10cmの距離から0.5秒間
照射し、その硬化状態を比較確認することにより光硬化
性を調べた。また、完全に硬化したS11〜14につい
ては、JIS K 6301に準じる方法にて硬化物の
硬さを測定した。その結果を第2表に示す。These compositions were poured into a stainless steel container coated with polytetrafluoroethylene with a diameter of about 6 cm to a thickness of about 2 cm, and after defoaming, an
0W/cm high-pressure mercury lamp (manufactured by Ushio Inc., UV-
7000) in the air from a distance of 10 cm for 0.5 seconds, and the photocurability was examined by comparing and confirming the curing state. Further, for completely cured S11 to S14, the hardness of the cured products was measured by a method according to JIS K 6301. The results are shown in Table 2.
[
実施例2
参考例1のA2,81.増粘剤としてダイアナルBR1
02(三菱レイヨンi製、ポリ (メタ)アクリルレジ
ン)、両末端がトリメチルシロキサン単位で閉塞され残
りがジメチルシロキサン単位70%とジフェニルシロキ
サン単位30%から成り25℃における粘度が200c
Stのポリメチルフェニルシロキサンおよび2−ヒドロ
キシ−2−メチル−1−フェニルプロパン−1−オンを
第3表の比率で実施例1と同じ方法で均一に混合し、組
成物521. S22を得た。[Example 2 A2, 81 of Reference Example 1. Dial BR1 as a thickener
02 (manufactured by Mitsubishi Rayon i, poly (meth)acrylic resin), both ends are blocked with trimethylsiloxane units and the remainder consists of 70% dimethylsiloxane units and 30% diphenylsiloxane units, and the viscosity at 25°C is 200c.
St polymethylphenylsiloxane and 2-hydroxy-2-methyl-1-phenylpropan-1-one were uniformly mixed in the same manner as in Example 1 in the ratios shown in Table 3 to form composition 521. Obtained S22.
この組成物について、実施例1と同様の方法で光硬化性
試験、硬さおよび粘度を測定した。Regarding this composition, a photocurability test, hardness and viscosity were measured in the same manner as in Example 1.
いずれも良好な光硬化性を示した。また、増粘剤および
ポリメチルフェニルシロキサンを用いることで、硬化物
の硬さを低くすることもできることがわかる。All exhibited good photocurability. It is also understood that the hardness of the cured product can be lowered by using a thickener and polymethylphenylsiloxane.
第 3 表
参考例3
フラスコに水1000部およびトルエン1000部を仕
込み、実施例1と同様の方法にてγ−メタクリロキシプ
ロピルトリエトキシシラン、フェニルトリクロロシラン
、ジフェニルジクロロシランおよびジメチルジクロロシ
ランを第4表に示す割合で配合して加水分解、縮合反応
、中和、脱溶、濾過を行い、第4表のメタクリロキシ含
有シロキサンA3〜A6を得た。Table 3 Reference Example 3 A flask was charged with 1,000 parts of water and 1,000 parts of toluene, and γ-methacryloxypropyltriethoxysilane, phenyltrichlorosilane, diphenyldichlorosilane and dimethyldichlorosilane were added in the same manner as in Example 1. They were blended in the proportions shown in the table and subjected to hydrolysis, condensation reaction, neutralization, desolvation, and filtration to obtain methacryloxy-containing siloxanes A3 to A6 shown in Table 4.
実施例3
化合物へ3〜^6およびP 、 C)Iz=CH−CO
−(OCJ4)z−OC6H4・C91119(B2)
および2−ヒドロキシ−2−メチル−1−フェニルプロ
パン−1−オンを第5表に示す比率で均一になるように
混合し、組成物S31〜S34および比較組成物C31
を得た。Example 3 To the compound 3~^6 and P, C) Iz=CH-CO
-(OCJ4)z-OC6H4・C91119(B2)
and 2-hydroxy-2-methyl-1-phenylpropan-1-one were mixed uniformly in the ratio shown in Table 5, and compositions S31 to S34 and comparative composition C31 were prepared.
I got it.
これらについて、照射条件を0.5秒、1秒、2秒にす
る以外は実施例1と同様の方法にて光硬化性試験を行っ
た。その結果を第5表に示す。A photocuring test was conducted on these in the same manner as in Example 1 except that the irradiation conditions were changed to 0.5 seconds, 1 second, and 2 seconds. The results are shown in Table 5.
Claims (1)
素数1〜5の置換または非置換の2価 の炭化水素基、R^2は置換または非置換のアリール基
、R^3は置換または非置換の1価の炭化水素基、aは
1〜3、bは0〜8、c は0〜3、dは2〜10の整数を表わし、a/(a+b
+c+d)≧0.08かつ(b+c)/(a+b+c+
d)≧0.10である。)で表わされるポリシロキサン
100重量部 (B)式; ▲数式、化学式、表等があります▼ (式中、R^4は水素原子またはメチル基、R^5は炭
素数1〜3のアルキル基またはアリー ル基、Q^2は炭素数1〜5の2価の炭化水素基、eは
0〜8の整数を表わす。)で表わ されるアクリル系化合物5〜2000重量部(C)増感
剤(A)+(B)の合計100重量部に対し0.5〜1
5重量部 から成ることを特徴とする紫外線硬化制シリコーン組成
物。 2 (A)のQ^1が炭素数2〜4のアルキレン基であ
る特許請求の範囲第1項記載の組成物。 3 (A)のR^2がフェニル基または2,4−クロロ
フェニル基である特許請求の範囲第1項記載の組成物。 4 (A)のR^3がメチル基である特許請求の範囲第
1項記載の組成物。 5 (A)のb/(a+b+c+d)が0.12以上で
ある特許請求の範囲第1項記載の組成物。 6 (B)のR^5がアリール基である特許請求の範囲
第1項記載の組成物。 7 (B)のQ^2がエチレン基である特許請求の範囲
第1項記載の組成物。 8 (B)のeが1〜5の整数である特許請求の範囲第
1項記載の組成物。 9 (B)成分の配合量が(A)成分100重量部に対
し10〜1000重量部である特許請求の範囲第1項記
載の組成物。 10 (C)が2−ヒドロキシ−2−メチル−1−フェ
ニルプロパン−1−オンである特許請求の範囲第1項記
載の組成物。 11 (C)成分の配合量が(A)+(B)の合計10
0重量部に対し、1.0〜10重量部である特許請求の
範囲第1項記載の組成物。[Claims] 1 (A) Average formula; ▲ Numerical formulas, chemical formulas, tables, etc. Substituted divalent hydrocarbon group, R^2 is a substituted or unsubstituted aryl group, R^3 is a substituted or unsubstituted monovalent hydrocarbon group, a is 1-3, b is 0-8, c represents an integer from 0 to 3, d represents an integer from 2 to 10, and a/(a+b
+c+d)≧0.08 and (b+c)/(a+b+c+
d) ≧0.10. ) 100 parts by weight of polysiloxane (B) Formula; ▲ Numerical formulas, chemical formulas, tables, etc. are available ▼ (In the formula, R^4 is a hydrogen atom or a methyl group, and R^5 is an alkyl group having 1 to 3 carbon atoms. or an aryl group, Q^2 is a divalent hydrocarbon group having 1 to 5 carbon atoms, and e represents an integer of 0 to 8.) 5 to 2000 parts by weight of an acrylic compound (C) Sensitizer ( 0.5 to 1 per 100 parts by weight of A) + (B)
5 parts by weight of an ultraviolet curable silicone composition. 2. The composition according to claim 1, wherein Q^1 in (A) is an alkylene group having 2 to 4 carbon atoms. 3. The composition according to claim 1, wherein R^2 in (A) is a phenyl group or a 2,4-chlorophenyl group. 4. The composition according to claim 1, wherein R^3 in (A) is a methyl group. 5. The composition according to claim 1, wherein b/(a+b+c+d) of (A) is 0.12 or more. 6. The composition according to claim 1, wherein R^5 in (B) is an aryl group. 7. The composition according to claim 1, wherein Q^2 in (B) is an ethylene group. 8. The composition according to claim 1, wherein e in (B) is an integer of 1 to 5. 9. The composition according to claim 1, wherein the amount of component (B) is 10 to 1000 parts by weight per 100 parts by weight of component (A). 10. The composition of claim 1, wherein (C) is 2-hydroxy-2-methyl-1-phenylpropan-1-one. 11 The blending amount of component (C) is (A) + (B), total 10
The composition according to claim 1, wherein the amount is 1.0 to 10 parts by weight relative to 0 parts by weight.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26354086A JPH089656B2 (en) | 1986-11-05 | 1986-11-05 | UV curable silicone composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26354086A JPH089656B2 (en) | 1986-11-05 | 1986-11-05 | UV curable silicone composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63117024A true JPS63117024A (en) | 1988-05-21 |
JPH089656B2 JPH089656B2 (en) | 1996-01-31 |
Family
ID=17390959
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP26354086A Expired - Lifetime JPH089656B2 (en) | 1986-11-05 | 1986-11-05 | UV curable silicone composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH089656B2 (en) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63162714A (en) * | 1986-12-19 | 1988-07-06 | バイエル・アクチエンゲゼルシヤフト | Polyethersiloxane graft polymer |
US5179134A (en) * | 1990-11-19 | 1993-01-12 | Loctite Corporation | Photocurable silicone composition, and method of making the same |
US5182315A (en) * | 1990-11-19 | 1993-01-26 | Loctite Corporation | Photocurable silicone gel composition, and method of making the same |
US5212211A (en) * | 1990-11-19 | 1993-05-18 | Loctite Corporation | Polymodal-cure silicone composition, and method of making the same |
US5348986A (en) * | 1990-11-19 | 1994-09-20 | Loctite Corporation | Photocurable silicone composition, and method of making same |
JPH09151334A (en) * | 1995-11-30 | 1997-06-10 | Toray Dow Corning Silicone Co Ltd | Protection material composition for electronic part |
US5738976A (en) * | 1995-03-16 | 1998-04-14 | Shin-Etsu Chemical Co., Ltd. | Photo-curable organopolysiloxane composition and a method for producing a (meth) acryloyloxyl group-containing organopolysiloxane used therein |
WO2007086323A1 (en) * | 2006-01-24 | 2007-08-02 | Asahi Kasei Emd Corporation | Photosensitive resin composition |
CN102443112A (en) * | 2010-10-04 | 2012-05-09 | 信越化学工业株式会社 | Radiation-curable composition |
JP2012097251A (en) * | 2010-10-04 | 2012-05-24 | Shin-Etsu Chemical Co Ltd | Radiation-curable composition |
WO2016109992A1 (en) * | 2015-01-05 | 2016-07-14 | 烟台德邦先进硅材料有限公司 | Organic silicon composition for uv curing |
CN113166626A (en) * | 2018-12-04 | 2021-07-23 | 信越化学工业株式会社 | Ultraviolet-curable silicone pressure-sensitive adhesive composition and cured product thereof |
-
1986
- 1986-11-05 JP JP26354086A patent/JPH089656B2/en not_active Expired - Lifetime
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63162714A (en) * | 1986-12-19 | 1988-07-06 | バイエル・アクチエンゲゼルシヤフト | Polyethersiloxane graft polymer |
US5179134A (en) * | 1990-11-19 | 1993-01-12 | Loctite Corporation | Photocurable silicone composition, and method of making the same |
US5182315A (en) * | 1990-11-19 | 1993-01-26 | Loctite Corporation | Photocurable silicone gel composition, and method of making the same |
US5212211A (en) * | 1990-11-19 | 1993-05-18 | Loctite Corporation | Polymodal-cure silicone composition, and method of making the same |
US5348986A (en) * | 1990-11-19 | 1994-09-20 | Loctite Corporation | Photocurable silicone composition, and method of making same |
US5738976A (en) * | 1995-03-16 | 1998-04-14 | Shin-Etsu Chemical Co., Ltd. | Photo-curable organopolysiloxane composition and a method for producing a (meth) acryloyloxyl group-containing organopolysiloxane used therein |
JPH09151334A (en) * | 1995-11-30 | 1997-06-10 | Toray Dow Corning Silicone Co Ltd | Protection material composition for electronic part |
WO2007086323A1 (en) * | 2006-01-24 | 2007-08-02 | Asahi Kasei Emd Corporation | Photosensitive resin composition |
JP5241241B2 (en) * | 2006-01-24 | 2013-07-17 | 旭化成イーマテリアルズ株式会社 | Photosensitive resin composition |
CN102443112A (en) * | 2010-10-04 | 2012-05-09 | 信越化学工业株式会社 | Radiation-curable composition |
JP2012097251A (en) * | 2010-10-04 | 2012-05-24 | Shin-Etsu Chemical Co Ltd | Radiation-curable composition |
WO2016109992A1 (en) * | 2015-01-05 | 2016-07-14 | 烟台德邦先进硅材料有限公司 | Organic silicon composition for uv curing |
CN113166626A (en) * | 2018-12-04 | 2021-07-23 | 信越化学工业株式会社 | Ultraviolet-curable silicone pressure-sensitive adhesive composition and cured product thereof |
CN113166626B (en) * | 2018-12-04 | 2023-09-05 | 信越化学工业株式会社 | Ultraviolet-curable silicone pressure-sensitive adhesive composition and cured product thereof |
Also Published As
Publication number | Publication date |
---|---|
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