JPS63111697A - 配線基板およびその製造方法 - Google Patents

配線基板およびその製造方法

Info

Publication number
JPS63111697A
JPS63111697A JP25916886A JP25916886A JPS63111697A JP S63111697 A JPS63111697 A JP S63111697A JP 25916886 A JP25916886 A JP 25916886A JP 25916886 A JP25916886 A JP 25916886A JP S63111697 A JPS63111697 A JP S63111697A
Authority
JP
Japan
Prior art keywords
wiring board
layer
wiring
conductor
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP25916886A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0365034B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
義孝 福岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP25916886A priority Critical patent/JPS63111697A/ja
Priority to DE8787309593T priority patent/DE3784213T2/de
Priority to EP87309593A priority patent/EP0266210B1/en
Publication of JPS63111697A publication Critical patent/JPS63111697A/ja
Publication of JPH0365034B2 publication Critical patent/JPH0365034B2/ja
Priority to US07/817,996 priority patent/US5153709A/en
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP25916886A 1986-10-29 1986-10-30 配線基板およびその製造方法 Granted JPS63111697A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP25916886A JPS63111697A (ja) 1986-10-30 1986-10-30 配線基板およびその製造方法
DE8787309593T DE3784213T2 (de) 1986-10-29 1987-10-29 Elektronischer apparat mit einem keramischen substrat.
EP87309593A EP0266210B1 (en) 1986-10-29 1987-10-29 Electronic apparatus comprising a ceramic substrate
US07/817,996 US5153709A (en) 1986-10-29 1992-01-09 Electronic apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25916886A JPS63111697A (ja) 1986-10-30 1986-10-30 配線基板およびその製造方法

Publications (2)

Publication Number Publication Date
JPS63111697A true JPS63111697A (ja) 1988-05-16
JPH0365034B2 JPH0365034B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-10-09

Family

ID=17330299

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25916886A Granted JPS63111697A (ja) 1986-10-29 1986-10-30 配線基板およびその製造方法

Country Status (1)

Country Link
JP (1) JPS63111697A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02101545U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1989-01-30 1990-08-13
JPH0613533A (ja) * 1992-06-24 1994-01-21 Toshiba Corp マルチチップモジュール
JP2018101657A (ja) * 2016-12-19 2018-06-28 ローム株式会社 センサモジュール

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02101545U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1989-01-30 1990-08-13
JPH0613533A (ja) * 1992-06-24 1994-01-21 Toshiba Corp マルチチップモジュール
JP2018101657A (ja) * 2016-12-19 2018-06-28 ローム株式会社 センサモジュール

Also Published As

Publication number Publication date
JPH0365034B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-10-09

Similar Documents

Publication Publication Date Title
EP0266210B1 (en) Electronic apparatus comprising a ceramic substrate
US5828093A (en) Ceramic capacitor and semiconductor device in which the ceramic capacitor is mounted
US5897724A (en) Method of producing a hybrid integrated circuit
US5227583A (en) Ceramic package and method for making same
EP0725981B1 (en) Component stacking in multi-chip semiconductor packages
US6583019B2 (en) Perimeter anchored thick film pad
JPH08274575A (ja) 素子複合搭載回路基板
US20050224934A1 (en) Circuit device
US4639830A (en) Packaged electronic device
JPS63111697A (ja) 配線基板およびその製造方法
JPH04206658A (ja) ハーメチックシール型電気回路装置
JP2002373961A (ja) 樹脂封止型電子装置
JPS63111696A (ja) 配線基板およびその製造方法
JPS63110755A (ja) 配線基板およびその製造方法
JPH02164096A (ja) 多層電子回路基板とその製造方法
JPH06124850A (ja) 積層複合電子部品
JPS6318335B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS59201452A (ja) 高密度テ−プボンデイング用デバイス封止
JP2841825B2 (ja) 混成集積回路
JPS6016749B2 (ja) 集積回路用パツケ−ジ
JP3250166B2 (ja) 積層複合電子部品
JPS5842259A (ja) 半導体パッケージの製造方法
JPH05343470A (ja) 半導体装置
JPH0282691A (ja) 半導体素子の実装構造
JPS6235552A (ja) 半導体搭載装置の製造方法

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term