JPS63108981A - Distance measuring instrument - Google Patents
Distance measuring instrumentInfo
- Publication number
- JPS63108981A JPS63108981A JP61254585A JP25458586A JPS63108981A JP S63108981 A JPS63108981 A JP S63108981A JP 61254585 A JP61254585 A JP 61254585A JP 25458586 A JP25458586 A JP 25458586A JP S63108981 A JPS63108981 A JP S63108981A
- Authority
- JP
- Japan
- Prior art keywords
- light
- spot
- light source
- workpiece
- light spot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003287 optical effect Effects 0.000 abstract description 4
- 230000000007 visual effect Effects 0.000 abstract 2
- 238000012790 confirmation Methods 0.000 abstract 1
- 238000005259 measurement Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Measurement Of Optical Distance (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、レーザ加工機のノズルと対象ワークとの間
の距離を非接触で測定する距離計測装置に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a distance measuring device that measures the distance between a nozzle of a laser processing machine and a target workpiece in a non-contact manner.
一般に、レーザ加工機は、加工レンズによって集束した
レーザ光をワーク表面に照射して該ワークを溶接したり
、切断したりする等の加工を行なっているが、その加工
の効率を高めるために、レーザ光のビームウェスト位置
をワーク位置に合せている。この位置を合せるために、
加工機のノズルとワークとの間の距離を制御しており、
この制御を正確に行うために、その距離を測定する距離
測定装置が使用されている。Generally, laser processing machines perform processing such as welding or cutting the workpiece by irradiating the workpiece surface with laser light focused by a processing lens, but in order to increase the processing efficiency, The beam waist position of the laser beam is aligned with the workpiece position. To align this position,
It controls the distance between the processing machine nozzle and the workpiece.
In order to accurately perform this control, a distance measuring device is used to measure the distance.
従来この種の距離計測装置として第３図に示すようなも
のがあった。図において、１はレーザ加工機のノズル、
２はノズル１へ距離計を取付けるカップリング、３は計
測用の第１光源、４は第１光源３より放射される光ビー
ムを集束する投光レンズ、５は光源３によってワーク８
上に形成され “る第１光スポットを撮像する受光
レンズ、６は受光レンズ５による第１光スポットの結像
位置に設置され、その結像に応じた電気信号を出方する
受光素子、７は受光素子６から出力される電気信号を処
理してノズル１とワーク８との間の距離Ｈを算出する処
理回路である。Conventionally, there has been a distance measuring device of this type as shown in FIG. In the figure, 1 is the nozzle of the laser processing machine,
2 is a coupling for attaching a distance meter to the nozzle 1; 3 is a first light source for measurement; 4 is a projection lens that focuses the light beam emitted from the first light source 3; 5 is a coupling that attaches a distance meter to the nozzle 1;
A light-receiving lens 6 is installed at the position where the first light spot is imaged by the light-receiving lens 5, and a light-receiving element 7 outputs an electric signal in accordance with the image formation. is a processing circuit that processes the electrical signal output from the light receiving element 6 and calculates the distance H between the nozzle 1 and the workpiece 8 .
以下従来の距離計の動作について説明する。The operation of the conventional distance meter will be explained below.
第１光源３よりワーク８に向けて放射された光ビームは
投光レンズ５によりワーク８の表面に適当な大きさの第
１光スポットを形成する。受光レンズ５は上記の第１光
スポットを撮像して受光素子６の受光面上に光スポット
の像を結像する。A light beam emitted toward the workpiece 8 from the first light source 3 forms a first light spot of an appropriate size on the surface of the workpiece 8 by the projection lens 5. The light-receiving lens 5 images the first light spot and forms an image of the light spot on the light-receiving surface of the light-receiving element 6 .
この受光素子６は光位置検出器とも称されるもので、こ
れは受光面における光スポットの結像位置に応じた、電
気信号を発生する。この受光素子６の２つの電極に生じ
る電流Ｉ＾、１Ｂの値により光スポット結像位置Ｐは
として得られる。この式は受光素子６の出力が光スポッ
ト像の位置とその強度に比例した出力を発生するため、
光スポット像の強度変化に相当する（ＩＡ＋ＩＢ）の項
を分母に導入することにより光スポット像の位置のみに
比例する出力を得ている。This light-receiving element 6 is also called an optical position detector, and generates an electric signal according to the imaging position of the light spot on the light-receiving surface. The light spot imaging position P is obtained by the values of the currents I^ and 1B generated in the two electrodes of the light receiving element 6. This formula is based on the fact that the output of the light receiving element 6 generates an output proportional to the position of the light spot image and its intensity.
By introducing the term (IA+IB) corresponding to the intensity change of the light spot image into the denominator, an output proportional only to the position of the light spot image is obtained.
−力受光レンズ５の光点よりワークまでの距離りは
ｈ＝□ ・・・・・・・・・・・・・・・・・・・・・
（２）ａｎ ０
として計算できる。ここで、Ｌは装置の構成のみで決ま
る固定値である。またθは上述した光スポット像の位置
Ｐと、受光レンズ５の設計位置により求まる。つまりｈ
はワーク８の表面の変位に対応するＰのみを変数として
求まる。したがって、加工機のノズル１とワーク８表面
間の距離Ｈはｈに一定の値を加えるのみでありＨ＝に−
Ｐとして算出できる。-The distance from the light point of the force receiving lens 5 to the workpiece is h=□ ・・・・・・・・・・・・・・・・・・・・・
(2) Can be calculated as an 0 . Here, L is a fixed value determined only by the configuration of the device. Further, θ is determined from the position P of the light spot image described above and the designed position of the light receiving lens 5. In other words h
is determined using only P, which corresponds to the displacement of the surface of the workpiece 8, as a variable. Therefore, the distance H between the nozzle 1 of the processing machine and the surface of the workpiece 8 is simply adding a constant value to h, and H=-
It can be calculated as P.
Ｋは事前に計算または実測により決定されるものである
。処理回路７は以上の計算を演算し、距離Ｈを送出する
。この距離Ｈがレーザ加工機のノズル１を制御する情報
となる。K is determined in advance by calculation or actual measurement. The processing circuit 7 performs the above calculations and sends out the distance H. This distance H becomes information for controlling the nozzle 1 of the laser processing machine.
従来の距離計測装置は以上のようにして距離Ｈを計測し
ていたが、計測用の第１光源３が近赤外光のため、ワー
ク８上の光スポットの位置が目視で確認できず、計測点
の位置がわからなかった。The conventional distance measuring device measures the distance H as described above, but because the first light source 3 for measurement uses near-infrared light, the position of the light spot on the workpiece 8 cannot be visually confirmed. The location of the measurement point was unknown.
また、スタンドオフの位置（計算上の計測位置）もわか
りにくかった。It was also difficult to determine the position of the standoff (calculated measurement position).
この発明は上記のような従来のものの欠点を解消するた
めなされたもので、計測点の目視による確認を可能にす
ることができるとともに、スタンドオフの位置を明確に
することのできる距離計測装置を提供することを目的と
する。This invention was made in order to eliminate the drawbacks of the conventional devices as described above, and provides a distance measuring device that can visually confirm the measurement point and clarify the position of the standoff. The purpose is to provide.
この発明に係る距離計測装置は、第１光源によって形成
される第１光スポットの位置に、可視光の第２光スポッ
トを形成する第２光源を設けたものである。The distance measuring device according to the present invention is provided with a second light source that forms a second light spot of visible light at the position of the first light spot formed by the first light source.
この発明における距離計測装置は第１光源によって形成
される第１光スポットの位置に、第２光源が可視光の第
２光スポットを形成する。In the distance measuring device according to the present invention, the second light source forms a second light spot of visible light at the position of the first light spot formed by the first light source.
この発明の一実施例を第１図について説明する。 An embodiment of the invention will be described with reference to FIG.
なお、第３図と同一なものには同一符号を付したのでそ
の説明は省略する。第１図において、９゜９はワーク８
に向けて可視の光を放射する第２光源で、これは計４１
ｑ用の光を放射する第１光源３を挟む位置に設置され、
計４１１用の放射光に対して斜め方向に可視光を放射す
るようになっている。Components that are the same as those in FIG. 3 are designated by the same reference numerals, and their explanations will be omitted. In Figure 1, 9°9 is the workpiece 8
A second light source that emits visible light towards the
installed at a position sandwiching the first light source 3 that emits light for q,
Visible light is emitted in an oblique direction with respect to the radiation light for a total of 411.
１０．１０は第２光源９，９から放射される可視光を集
束して、第１光源３によってワーク８上に形成される第
１光スポットの位置に第２光スポットを形成するレンズ
である。10.10 is a lens that focuses the visible light emitted from the second light sources 9, 9 to form a second light spot at the position of the first light spot formed on the workpiece 8 by the first light source 3. .
次に、上記距離計測装置の動作を説明する。第１光源３
よりワーク８上に照射された光スポットを受光レンズ５
により撮像し、受光素子６上に光スポットを結像させて
距離Ｈを計測する。この計測は従来のものと同じである
のでその説明を省略する。Next, the operation of the distance measuring device will be explained. First light source 3
The light spot irradiated onto the workpiece 8 is sent to the light receiving lens 5.
The distance H is measured by imaging a light spot on the light receiving element 6. This measurement is the same as the conventional one, so its explanation will be omitted.
第２光源９，９から放射される可視光はレンズ１０．１
０によって集束されてワーク８上に第２光スポットを形
成する。この際、ワーク８がスタンドオフの位置に一致
していれば、上記第２光スポットと、第１光源３によっ
てワーク３上に形成される第１光スポット１１（第３図
参照）とが一致するとともに、第３図のＢに示すように
可視光の第２光スポット１２は一つになる。ワーク８が
スタンドオフからずれると、第３図のＡ、Ｃに示すよう
に、可視光の第２光スポット１２は二つになる。したが
って、スタンドオフの位置が明確になり、また計測点を
目視することができる。The visible light emitted from the second light sources 9, 9 is transmitted through the lens 10.1.
0 to form a second light spot on the workpiece 8. At this time, if the workpiece 8 matches the position of the standoff, the second light spot and the first light spot 11 formed on the workpiece 3 by the first light source 3 (see FIG. 3) match. At the same time, as shown in FIG. 3B, the second visible light spots 12 become one. When the workpiece 8 is displaced from the standoff, the second visible light spot 12 becomes two, as shown in A and C of FIG. Therefore, the position of the standoff becomes clear and the measurement point can be visually observed.
上記実施例では可視光の第２光源９，９は２個であるが
２個以上の複数であってもよい。また、上記第２光源９
によって形成される第２光スポットの径が最小となる位
置にスタンドオフの位置を合わせれば、第２光源９は１
つでもよい。In the above embodiment, there are two visible light second light sources 9, 9, but there may be two or more second light sources 9, 9. Further, the second light source 9
If the position of the standoff is adjusted to the position where the diameter of the second light spot formed by
Any time is fine.
以上のように、この発明によれば第１光源によって形成
される第１光スポットの位置に可視光の第２光スポット
を形成する第２光源を設けたので、計測点の位置を目視
することができ、またスタンドオフの位置も明確になる
という効果を得る。As described above, according to the present invention, since the second light source that forms the second light spot of visible light is provided at the position of the first light spot formed by the first light source, the position of the measurement point can be visually observed. This also has the effect of making the standoff position clear.
第１図はこの発明の一実施例による距離計測装置の概略
構成図、第２図は従来の距離計測装置の概略構成図、第
３図はワークに形成される光スポットの説明図である。
１はノズル、３は第１光源、８はワーク、９は第２光源
である。FIG. 1 is a schematic diagram of a distance measuring device according to an embodiment of the present invention, FIG. 2 is a schematic diagram of a conventional distance measuring device, and FIG. 3 is an explanatory diagram of a light spot formed on a workpiece. 1 is a nozzle, 3 is a first light source, 8 is a workpiece, and 9 is a second light source.
Claims (1)
に第１光スポットを形成するとともに、この第１光スポ
ットを撮像して加工機のノズルと前記対象ワークとの間
の距離を測定する距離計測装置において、前記第１光ス
ポットの位置に可視光の第２光スポットを形成する第２
光源を設けたことを特徴とする距離計測装置。A first light source emits light onto the target workpiece to form a first light spot on the target workpiece, and the first light spot is imaged to measure the distance between the nozzle of the processing machine and the target workpiece. In the distance measuring device, a second light spot of visible light is formed at a position of the first light spot.
A distance measuring device characterized by being provided with a light source.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61254585A JPH0642993B2 (en) | 1986-10-28 | 1986-10-28 | Distance measuring device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61254585A JPH0642993B2 (en) | 1986-10-28 | 1986-10-28 | Distance measuring device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63108981A true JPS63108981A (en) | 1988-05-13 |
| JPH0642993B2 JPH0642993B2 (en) | 1994-06-08 |
Family
ID=17267079
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61254585A Expired - Lifetime JPH0642993B2 (en) | 1986-10-28 | 1986-10-28 | Distance measuring device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0642993B2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005131668A (en) * | 2003-10-30 | 2005-05-26 | Sunx Ltd | Laser beam machining apparatus and method for adjusting work distance |
| JP2008055455A (en) * | 2006-08-30 | 2008-03-13 | Sumitomo Electric Ind Ltd | Laser beam machining method and laser beam machining apparatus |
| EP2042258A1 (en) * | 2006-07-19 | 2009-04-01 | Toyota Jidosha Kabushiki Kaisha | Laser processing system and laser processing method |
| JP2013146773A (en) * | 2012-01-20 | 2013-08-01 | Panasonic Industrial Devices Sunx Co Ltd | Laser beam machining device |
| JP2016205981A (en) * | 2015-04-22 | 2016-12-08 | 株式会社Ihi | Terahertz irradiation position visualization device |
| CN110170741A (en) * | 2019-07-03 | 2019-08-27 | 温州大学 | Focus on light beam focusing mechanism in laser processing |
| CN111315530A (en) * | 2017-10-25 | 2020-06-19 | 株式会社尼康 | Processing device and method for manufacturing moving body |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS534553A (en) * | 1976-07-02 | 1978-01-17 | Asahi Optical Co Ltd | Light guide |
| JPS61108484A (en) * | 1984-10-29 | 1986-05-27 | Mitsubishi Electric Corp | Laser beam machine |
-
1986
- 1986-10-28 JP JP61254585A patent/JPH0642993B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS534553A (en) * | 1976-07-02 | 1978-01-17 | Asahi Optical Co Ltd | Light guide |
| JPS61108484A (en) * | 1984-10-29 | 1986-05-27 | Mitsubishi Electric Corp | Laser beam machine |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005131668A (en) * | 2003-10-30 | 2005-05-26 | Sunx Ltd | Laser beam machining apparatus and method for adjusting work distance |
| JP4519443B2 (en) * | 2003-10-30 | 2010-08-04 | サンクス株式会社 | Laser processing apparatus and work distance adjustment method thereof |
| EP2042258A1 (en) * | 2006-07-19 | 2009-04-01 | Toyota Jidosha Kabushiki Kaisha | Laser processing system and laser processing method |
| EP2042258A4 (en) * | 2006-07-19 | 2011-07-13 | Toyota Motor Co Ltd | Laser processing system and laser processing method |
| US8164027B2 (en) | 2006-07-19 | 2012-04-24 | Toyota Jidosha Kabushiki Kaisha | Laser processing system and laser processing method |
| JP2008055455A (en) * | 2006-08-30 | 2008-03-13 | Sumitomo Electric Ind Ltd | Laser beam machining method and laser beam machining apparatus |
| US8294123B2 (en) | 2006-08-30 | 2012-10-23 | Sumitomo Electric Industries, Ltd. | Laser processing method and laser processing apparatus |
| JP2013146773A (en) * | 2012-01-20 | 2013-08-01 | Panasonic Industrial Devices Sunx Co Ltd | Laser beam machining device |
| JP2016205981A (en) * | 2015-04-22 | 2016-12-08 | 株式会社Ihi | Terahertz irradiation position visualization device |
| CN111315530A (en) * | 2017-10-25 | 2020-06-19 | 株式会社尼康 | Processing device and method for manufacturing moving body |
| EP3702087A4 (en) * | 2017-10-25 | 2021-07-14 | Nikon Corporation | Processing device and method for producing moving body |
| CN110170741A (en) * | 2019-07-03 | 2019-08-27 | 温州大学 | Focus on light beam focusing mechanism in laser processing |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0642993B2 (en) | 1994-06-08 |
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