JPS63107146A - Multistage package for electronic part - Google Patents

Abstract

PURPOSE:To package electronic parts in a three-dimensional pattern with respect to a packaging plane and to improve the packaging density of the electronic parts, by the constitution wherein pins are protruded downward from each package main body, pinholes are provided at the upper ends of the pins, and a plurality of the packages are laminated in the up and down directions. CONSTITUTION:A package 10 has a disk shaped package main body 1 having a sleeve at the peripheral part. A required wiring pattern 3 is formed on the upper surface of the package main body 1 with a conductor film. Leads 5 of a semiconductor device 4, which is mounted on the surface of the package main body 1, are connected to the wiring pattern 3. Meanwhile a plurality of pins 6 are arranged at the sleeve 2 on the periphery of the package main body 1 so that the pins are protruded downward. When a plurality of the packages 10 formed in this way are laminated in the up and down direction, electronic parts such as the semiconductor device 4, which are mounted on the packages 10, are electrically connected one another through the wiring pattern 3, the pins 6 and pinholes 7. Thus the specified circuit is constituted.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a package for mounting electronic components,
In particular, the present invention relates to packages such as flat packages and mini-flat packages that enable multi-stage mounting, which is effective for high-density mounting of integrated circuits.

[Conventional technology]

Conventionally, when electronic components such as semiconductor devices such as integrated circuits and other components are mounted on a circuit board, each electronic component is arranged in accordance with a wiring pattern formed on the circuit board, and then mechanically and An electrically connected configuration is adopted.

In particular, with integrated circuit components such as flat packages and mini-flat packages, it is impossible to mount each component vertically due to its structure. The mounting structure has been adopted.

[Problem that the invention seeks to solve]

In the conventional mounting structure described above, components are only two-dimensionally arranged on a circuit board as a mounting surface, and the space above cannot be utilized. For this reason, if the mounting area of the circuit board is limited, the number of components that can be mounted is limited, and it is difficult to replace or add components once you want to add functionality after mounting, especially when making a circuit prototype. There is a problem with becoming.

[Means for solving problems]

The present invention provides an electronic component multi-stage mounting package that allows electronic components to be mounted in the vertical direction, thereby improving the packaging density and making it possible to easily replace or add components. The purpose is to

The electronic component multi-stage mounting package of the present invention is composed of a puff cage body on which electronic components are mounted, a pin formed protruding from the bottom of this body, and a pinhole formed at the upper end of this pin. It is configured so that it can fit into the pinholes and pins of other packages stacked one above the other.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a plan view of a package according to an embodiment of the present invention, and FIG. 2 is a front view thereof. Further, FIG. 3 shows a cross-sectional structure taken along line AA in FIG. 1, and FIG. 4 shows a partially enlarged structure.

As shown in these figures, this package 10 has a disc-shaped package body 1 having a sleeve 2 around its periphery. A required wiring pattern 3 is formed of a conductive film on the upper surface of the package body 1, and as shown in FIG. It is configured to be connected to pattern 3. Note that this example shows an example in which the present invention is applied to a flat package semiconductor device with 16 pins in two directions.

On the other hand, a plurality of pins 6 are disposed in the circumferential direction on the sleeve 2 around the package body 1 so as to protrude downward. Some of these pins 6 are connected to the wiring pattern 3.
Further, a portion thereof is electrically connected to the lead 5 of the semiconductor device 4 via this wiring pattern 3, and is configured as an external terminal of the semiconductor device 4.

Further, the upper end portion of the pin 6 is exposed on the upper surface of the package body 1, and a recessed portion is formed in the axial direction from the upper end surface to constitute a pinhole 7. As will be described later, pins 6 of other packages can fit into the pin holes 7 and are electrically connected to each other.

According to this configuration, a plurality of packages are prepared, semiconductor devices and other electronic components are mounted on their respective hard cages, and then these packages are stacked one above the other as shown in Figure 5, and the upper package is stacked vertically as shown in Figure 5. The pins 6 are fitted into the pin holes 7 of the lower package to electrically connect them.

As a result, the semiconductor device 4 mounted on each puff cage 10
Electronic components such as wiring pattern 3. They are electrically connected to each other via pins 6 and pinholes 7 to form a predetermined circuit.

By mounting the thus configured circuit board 11 as a mounting surface, the electronic components of each package are electrically connected to the circuit board 11 via the pins 6 of the bottom puff cage 1o, and the required mounting will be held. Thereby, even the electronic components mounted on the uppermost package body can be connected to the circuit board 11.

Note that some of the pins 6 may be configured to function as relay terminals between upper and lower packages without directly connecting to a semiconductor device or electronic component.

In this case, the signal line created by the vertically corresponding pins 6 and pinholes 7 does not intersect with other signal lines, so that the signal can be safely and reliably transmitted to the circuit board.

Therefore, with this package structure, electronic components such as the semiconductor device 4 can be three-dimensionally mounted on the circuit board 11, and the number of components mounted relative to the planar area of the circuit board 11 is increased to improve the mounting density. can. Furthermore, when replacing or adding electronic components, all that is required is to connect and disconnect the pins 6 and pinholes 7 of each package 10, and this work can be performed extremely easily.

Here, the package body may have a polygonal shape.

〔Effect of the invention〕

As explained above, the present invention is achieved by forming a pin protruding downward from a package body on which an electronic component is mounted, forming a pinhole at the upper end of the pin, and making the pin and the pinhole fit into each other. Since multiple packages are stacked one on top of the other, electronic components can be mounted three-dimensionally on the mounting surface. This has the effect of making it easy to replace or add.

[Brief explanation of the drawing]

FIG. 1 is a plan view of an integrated circuit multi-stage package according to the present invention, FIG. 2 is a front view thereof, FIG. 3 is a sectional view taken along line A-A in FIG. 1, and FIG. FIG. 5 is a front view showing an example of application of the present invention, and FIG. 6 is a plan view thereof. 1...Package body, 2...Sleeve, 3...
Wiring pattern, 4... semiconductor device, 5... lead,
6...Pin, Fig. 1, 7, Jimbo J, Fig. 2, Fig. 3, n, Fig. 4, Fig. 5, Fig. 6

Claims (3)

[Claims] (1) Consisting of a package body on which electronic components are mounted, a pin protruding from the bottom of the body, and a pinhole formed directly above the pin in electrical continuity with the pin, and these pins and pinholes. 1. An electronic component multi-stage mounting package characterized in that it is configured to be able to fit into pinholes and pins of other packages stacked above and below, respectively. (2) The electronic component multi-stage mounting package according to claim 1, wherein the package body is formed into a circular shape, and a plurality of pins and pinholes are equally distributed in the circumferential direction around the periphery of the package body. (3) The electronic component multi-stage mounting package according to claim 1, wherein a recess is formed at the upper end of the pin to form a pinhole.