JPS63106662U - - Google Patents
Info
- Publication number
- JPS63106662U JPS63106662U JP20009186U JP20009186U JPS63106662U JP S63106662 U JPS63106662 U JP S63106662U JP 20009186 U JP20009186 U JP 20009186U JP 20009186 U JP20009186 U JP 20009186U JP S63106662 U JPS63106662 U JP S63106662U
- Authority
- JP
- Japan
- Prior art keywords
- printed
- solder
- screen
- layer
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
Description
第１図は本考案に用いる３層式スクリーン印刷
基板の一部正断面図、第２図は本考案の一実施例
要部正断面図である。
Ａ…スクリーン印刷基板、１…銅板、２，３…
ニツケル層、４，５，６…半田印刷透孔、７，８
…半田貯留凹部。
FIG. 1 is a partial front cross-sectional view of a three-layer screen printed board used in the present invention, and FIG. 2 is a front cross-sectional view of a main part of an embodiment of the present invention. A... Screen printed board, 1... Copper plate, 2, 3...
Nickel layer, 4, 5, 6...Solder printing through hole, 7, 8
...Solder storage recess.
Claims (1)
ーン印刷基板に半田印刷透孔を形成したスクリー
ン印刷メタルマスクに於て、印刷半田膜厚に応じ
て半田印刷透孔周辺部の上部層又は上部層と中間
層を切欠し半田貯留凹部を形成した半田印刷膜厚
制御用スクリーン印刷メタルマスク。 In a screen-printed metal mask in which solder-printed holes are formed on a three-layer screen-printed board with a nickel layer formed on both sides of a copper plate, the upper layer or the upper layer around the solder-printed hole is used depending on the thickness of the printed solder film. A screen-printed metal mask for controlling the thickness of solder printing film with a notch in the middle layer to form a solder storage recess.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20009186U JPS63106662U (en) | 1986-12-27 | 1986-12-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20009186U JPS63106662U (en) | 1986-12-27 | 1986-12-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63106662U true JPS63106662U (en) | 1988-07-09 |
Family
ID=31162281
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20009186U Pending JPS63106662U (en) | 1986-12-27 | 1986-12-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63106662U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5956579A (en) * | 1982-09-24 | 1984-04-02 | Fujitsu Ltd | Compound metal mask |
-
1986
- 1986-12-27 JP JP20009186U patent/JPS63106662U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5956579A (en) * | 1982-09-24 | 1984-04-02 | Fujitsu Ltd | Compound metal mask |