JPS63104434A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS63104434A
JPS63104434A JP24971986A JP24971986A JPS63104434A JP S63104434 A JPS63104434 A JP S63104434A JP 24971986 A JP24971986 A JP 24971986A JP 24971986 A JP24971986 A JP 24971986A JP S63104434 A JPS63104434 A JP S63104434A
Authority
JP
Japan
Prior art keywords
power
semiconductor chip
leads
lead
source use
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24971986A
Other languages
Japanese (ja)
Inventor
Yukihiro Bandai
Shuichi Nakagami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Hitachi Computer Engineering Co Ltd
Original Assignee
Hitachi Ltd
Hitachi Computer Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Computer Engineering Co Ltd filed Critical Hitachi Ltd
Priority to JP24971986A priority Critical patent/JPS63104434A/en
Publication of JPS63104434A publication Critical patent/JPS63104434A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

PURPOSE: To expand a lead for signal use in such a way that a lead for power- source use, installed at a package cap, is connected electrically to a semiconductor chip at a protruded electrode.
CONSTITUTION: A semiconductor chip 2 is attached to a package substrate 1. Two or more leads 6 tor power-source use are installed on the surface of a package cap 5 on the side of the semiconductor chip 2; solder bumps (protruding electrodes) 7A are formed at terminals 7 of these leads 6 for power-source use. Then, the package substrate 1 and the package cap 5 are brought close to each other by melting an assembled protruding electrode 8 for power-source use back into contact with the solder bumps 7A so that spacers 4 for sealing use can be attached and sealed hermetically by an adhesive agent or the like. Because it is not required to install the leads 6 for power-source use on the side of the semiconductor chip 2, it is possible to expand the lead for signal use.
COPYRIGHT: (C)1988,JPO&Japio
JP24971986A 1986-10-22 1986-10-22 Semiconductor device Pending JPS63104434A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24971986A JPS63104434A (en) 1986-10-22 1986-10-22 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24971986A JPS63104434A (en) 1986-10-22 1986-10-22 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS63104434A true JPS63104434A (en) 1988-05-09

Family

ID=17197179

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24971986A Pending JPS63104434A (en) 1986-10-22 1986-10-22 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS63104434A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02192743A (en) * 1989-01-20 1990-07-30 Fujitsu Ltd Semiconductor device
JPH04269842A (en) * 1991-02-26 1992-09-25 Rohm Co Ltd Mounting structure of semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02192743A (en) * 1989-01-20 1990-07-30 Fujitsu Ltd Semiconductor device
JPH04269842A (en) * 1991-02-26 1992-09-25 Rohm Co Ltd Mounting structure of semiconductor device

Similar Documents

Publication Publication Date Title
EP0977251A4 (en) Resin sealed semiconductor device and method for manufacturing the same
EP0969504A4 (en) Semiconductor device
JPS63104434A (en) Semiconductor device
JPS58122763A (en) Resin sealed type semiconductor device
JPS63248154A (en) Packaging part of semiconductor device and packaging method
JPS634651A (en) Semiconductor device
JPS62296528A (en) Resin-sealed semiconductor device
JPH02211643A (en) Semiconductor device
JPS63143851A (en) Semiconductor device
JPS5483768A (en) Semiconductor device
JPH01123428A (en) Resin sealed semiconductor device
JPS63104435A (en) Semiconductor device
JPS59117146A (en) Semiconductor integrated circuit
JPH02153557A (en) Resin sealed type semiconductor device
JPS61260657A (en) Semiconductor device
JPS6242441A (en) Integrated circuit device
JPH04196450A (en) Semiconductor package
JPH03201545A (en) Semiconductor device
JPS57118661A (en) Integrated circuit for noise prevention
JPH01124227A (en) Semiconductor device
JPH02252250A (en) Film for semiconductor chip terminal connection and connection method for semiconductor chip terminal
JPH0287558A (en) Ic chip
JPS618958A (en) Semiconductor device
JPH03169057A (en) Semiconductor device
JPH01187954A (en) Resin seal type semiconductor device