JPS6292653U - - Google Patents

Info

Publication number
JPS6292653U
JPS6292653U JP18463985U JP18463985U JPS6292653U JP S6292653 U JPS6292653 U JP S6292653U JP 18463985 U JP18463985 U JP 18463985U JP 18463985 U JP18463985 U JP 18463985U JP S6292653 U JPS6292653 U JP S6292653U
Authority
JP
Japan
Prior art keywords
wiring board
lead frame
land portion
hybrid
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18463985U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18463985U priority Critical patent/JPS6292653U/ja
Publication of JPS6292653U publication Critical patent/JPS6292653U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
JP18463985U 1985-11-29 1985-11-29 Pending JPS6292653U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18463985U JPS6292653U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1985-11-29 1985-11-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18463985U JPS6292653U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1985-11-29 1985-11-29

Publications (1)

Publication Number Publication Date
JPS6292653U true JPS6292653U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1987-06-13

Family

ID=31132508

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18463985U Pending JPS6292653U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1985-11-29 1985-11-29

Country Status (1)

Country Link
JP (1) JPS6292653U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0232558A (ja) * 1988-06-02 1990-02-02 Burr Brown Corp ハイブリッド集積回路製作方法
JPH0269967A (ja) * 1988-09-05 1990-03-08 Nippon Telegr & Teleph Corp <Ntt> 高速・高周波集積回路用パッケージ
JPH036096A (ja) * 1989-06-02 1991-01-11 Matsushita Electric Works Ltd 回路基板
JPH03198355A (ja) * 1989-12-26 1991-08-29 Nec Corp 半導体装置
JPH03268351A (ja) * 1990-03-16 1991-11-29 Toshiba Corp 半導体装置
JPH09199528A (ja) * 1996-01-22 1997-07-31 Nec Corp 樹脂封止型半導体装置
JP2009176825A (ja) * 2008-01-22 2009-08-06 Asmo Co Ltd 樹脂封止型半導体装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS492866A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1972-04-21 1974-01-11
JPS577148A (en) * 1980-06-16 1982-01-14 Mitsubishi Electric Corp Semiconductor module
JPS60189958A (ja) * 1984-03-09 1985-09-27 Nec Kansai Ltd 半導体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS492866A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1972-04-21 1974-01-11
JPS577148A (en) * 1980-06-16 1982-01-14 Mitsubishi Electric Corp Semiconductor module
JPS60189958A (ja) * 1984-03-09 1985-09-27 Nec Kansai Ltd 半導体装置

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0232558A (ja) * 1988-06-02 1990-02-02 Burr Brown Corp ハイブリッド集積回路製作方法
JPH0269967A (ja) * 1988-09-05 1990-03-08 Nippon Telegr & Teleph Corp <Ntt> 高速・高周波集積回路用パッケージ
JPH036096A (ja) * 1989-06-02 1991-01-11 Matsushita Electric Works Ltd 回路基板
JPH03198355A (ja) * 1989-12-26 1991-08-29 Nec Corp 半導体装置
JPH03268351A (ja) * 1990-03-16 1991-11-29 Toshiba Corp 半導体装置
JPH09199528A (ja) * 1996-01-22 1997-07-31 Nec Corp 樹脂封止型半導体装置
JP2009176825A (ja) * 2008-01-22 2009-08-06 Asmo Co Ltd 樹脂封止型半導体装置

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