JPS6286845A - 金属ベ−スチツプキヤリアの製造法 - Google Patents

金属ベ−スチツプキヤリアの製造法

Info

Publication number
JPS6286845A
JPS6286845A JP60228124A JP22812485A JPS6286845A JP S6286845 A JPS6286845 A JP S6286845A JP 60228124 A JP60228124 A JP 60228124A JP 22812485 A JP22812485 A JP 22812485A JP S6286845 A JPS6286845 A JP S6286845A
Authority
JP
Japan
Prior art keywords
hole
chip carrier
land
holes
metal substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60228124A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0379867B2 (https=
Inventor
Toru Higuchi
徹 樋口
Toshiyuki Yamaguchi
敏行 山口
Takeshi Kano
武司 加納
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP60228124A priority Critical patent/JPS6286845A/ja
Publication of JPS6286845A publication Critical patent/JPS6286845A/ja
Publication of JPH0379867B2 publication Critical patent/JPH0379867B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
JP60228124A 1985-10-14 1985-10-14 金属ベ−スチツプキヤリアの製造法 Granted JPS6286845A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60228124A JPS6286845A (ja) 1985-10-14 1985-10-14 金属ベ−スチツプキヤリアの製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60228124A JPS6286845A (ja) 1985-10-14 1985-10-14 金属ベ−スチツプキヤリアの製造法

Publications (2)

Publication Number Publication Date
JPS6286845A true JPS6286845A (ja) 1987-04-21
JPH0379867B2 JPH0379867B2 (https=) 1991-12-20

Family

ID=16871586

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60228124A Granted JPS6286845A (ja) 1985-10-14 1985-10-14 金属ベ−スチツプキヤリアの製造法

Country Status (1)

Country Link
JP (1) JPS6286845A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100209263B1 (ko) * 1996-12-31 1999-07-15 이해규 칩 캐리어 및 이 제조방법과 이 칩 캐리어를 이용한 반도체 부품

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100209263B1 (ko) * 1996-12-31 1999-07-15 이해규 칩 캐리어 및 이 제조방법과 이 칩 캐리어를 이용한 반도체 부품

Also Published As

Publication number Publication date
JPH0379867B2 (https=) 1991-12-20

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees