JPS6276591U - - Google Patents

Info

Publication number
JPS6276591U
JPS6276591U JP1985152137U JP15213785U JPS6276591U JP S6276591 U JPS6276591 U JP S6276591U JP 1985152137 U JP1985152137 U JP 1985152137U JP 15213785 U JP15213785 U JP 15213785U JP S6276591 U JPS6276591 U JP S6276591U
Authority
JP
Japan
Prior art keywords
electronic component
tip
metal member
heat sink
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985152137U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0310705Y2 (US20110009641A1-20110113-C00116.png
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985152137U priority Critical patent/JPH0310705Y2/ja
Priority to US06/914,942 priority patent/US4879632A/en
Priority to DE86307669T priority patent/DE3688962T2/de
Priority to EP86307669A priority patent/EP0217676B1/en
Publication of JPS6276591U publication Critical patent/JPS6276591U/ja
Priority to US07/079,877 priority patent/US4783721A/en
Priority to US07/079,876 priority patent/US4920574A/en
Priority to US07/261,904 priority patent/US5126919A/en
Application granted granted Critical
Publication of JPH0310705Y2 publication Critical patent/JPH0310705Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1985152137U 1985-10-04 1985-10-04 Expired JPH0310705Y2 (US20110009641A1-20110113-C00116.png)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP1985152137U JPH0310705Y2 (US20110009641A1-20110113-C00116.png) 1985-10-04 1985-10-04
US06/914,942 US4879632A (en) 1985-10-04 1986-10-03 Cooling system for an electronic circuit device
DE86307669T DE3688962T2 (de) 1985-10-04 1986-10-03 Kühlsystem für eine elektronische Schaltungsanordnung.
EP86307669A EP0217676B1 (en) 1985-10-04 1986-10-03 Cooling system for electronic circuit device
US07/079,877 US4783721A (en) 1985-10-04 1987-07-30 Cooling system for an electronic circuit device
US07/079,876 US4920574A (en) 1985-10-04 1987-07-30 Cooling system for an electronic circuit device
US07/261,904 US5126919A (en) 1985-10-04 1988-10-25 Cooling system for an electronic circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985152137U JPH0310705Y2 (US20110009641A1-20110113-C00116.png) 1985-10-04 1985-10-04

Publications (2)

Publication Number Publication Date
JPS6276591U true JPS6276591U (US20110009641A1-20110113-C00116.png) 1987-05-16
JPH0310705Y2 JPH0310705Y2 (US20110009641A1-20110113-C00116.png) 1991-03-15

Family

ID=31069842

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985152137U Expired JPH0310705Y2 (US20110009641A1-20110113-C00116.png) 1985-10-04 1985-10-04

Country Status (1)

Country Link
JP (1) JPH0310705Y2 (US20110009641A1-20110113-C00116.png)

Also Published As

Publication number Publication date
JPH0310705Y2 (US20110009641A1-20110113-C00116.png) 1991-03-15

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