JPS6273555U - - Google Patents

Info

Publication number

JPS6273555U

JPS6273555U JP16631385U JP16631385U JPS6273555U JP S6273555 U JPS6273555 U JP S6273555U JP 16631385 U JP16631385 U JP 16631385U JP 16631385 U JP16631385 U JP 16631385U JP S6273555 U JPS6273555 U JP S6273555U

Authority

JP

Japan

Prior art keywords

plug

semiconductor package

copper

metal layer

external lead

Prior art date

1985-10-28

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 229910052751 metal Inorganic materials 0.000 claims description 5
• 239000002184 metal Substances 0.000 claims description 5
• 239000004065 semiconductor Substances 0.000 claims description 4
• 229910001182 Mo alloy Inorganic materials 0.000 claims 1
• 229910001080 W alloy Inorganic materials 0.000 claims 1
• WUUZKBJEUBFVMV-UHFFFAOYSA-N copper molybdenum Chemical compound [Cu].[Mo] WUUZKBJEUBFVMV-UHFFFAOYSA-N 0.000 claims 1
• SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 claims 1