JPS6263933U - - Google Patents
Info
- Publication number
- JPS6263933U JPS6263933U JP15560685U JP15560685U JPS6263933U JP S6263933 U JPS6263933 U JP S6263933U JP 15560685 U JP15560685 U JP 15560685U JP 15560685 U JP15560685 U JP 15560685U JP S6263933 U JPS6263933 U JP S6263933U
- Authority
- JP
- Japan
- Prior art keywords
- gas
- recess
- ejecting
- window
- opening group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985155606U JPH0322914Y2 (cs) | 1985-10-09 | 1985-10-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985155606U JPH0322914Y2 (cs) | 1985-10-09 | 1985-10-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6263933U true JPS6263933U (cs) | 1987-04-21 |
| JPH0322914Y2 JPH0322914Y2 (cs) | 1991-05-20 |
Family
ID=31076456
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985155606U Expired JPH0322914Y2 (cs) | 1985-10-09 | 1985-10-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0322914Y2 (cs) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5742175U (cs) * | 1980-08-14 | 1982-03-08 |
-
1985
- 1985-10-09 JP JP1985155606U patent/JPH0322914Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5742175U (cs) * | 1980-08-14 | 1982-03-08 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0322914Y2 (cs) | 1991-05-20 |