JPS6262475U - - Google Patents

Info

Publication number

JPS6262475U

JPS6262475U JP15385785U JP15385785U JPS6262475U JP S6262475 U JPS6262475 U JP S6262475U JP 15385785 U JP15385785 U JP 15385785U JP 15385785 U JP15385785 U JP 15385785U JP S6262475 U JPS6262475 U JP S6262475U

Authority

JP

Japan

Prior art keywords

soldering

wiring board

printed wiring

flexible printed

soldering land

Prior art date

1985-10-08

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 238000005476 soldering Methods 0.000 claims description 5
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• 239000011889 copper foil Substances 0.000 description 1
• 239000006071 cream Substances 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1