JPS6262448U - - Google Patents
Info
- Publication number
- JPS6262448U JPS6262448U JP15424485U JP15424485U JPS6262448U JP S6262448 U JPS6262448 U JP S6262448U JP 15424485 U JP15424485 U JP 15424485U JP 15424485 U JP15424485 U JP 15424485U JP S6262448 U JPS6262448 U JP S6262448U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- semiconductor device
- intermediate member
- case member
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15424485U JPS6262448U (US06633600-20031014-M00021.png) | 1985-10-07 | 1985-10-07 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15424485U JPS6262448U (US06633600-20031014-M00021.png) | 1985-10-07 | 1985-10-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6262448U true JPS6262448U (US06633600-20031014-M00021.png) | 1987-04-17 |
Family
ID=31073866
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15424485U Pending JPS6262448U (US06633600-20031014-M00021.png) | 1985-10-07 | 1985-10-07 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6262448U (US06633600-20031014-M00021.png) |
-
1985
- 1985-10-07 JP JP15424485U patent/JPS6262448U/ja active Pending