JPS624862B2 - - Google Patents

Info

Publication number
JPS624862B2
JPS624862B2 JP7647878A JP7647878A JPS624862B2 JP S624862 B2 JPS624862 B2 JP S624862B2 JP 7647878 A JP7647878 A JP 7647878A JP 7647878 A JP7647878 A JP 7647878A JP S624862 B2 JPS624862 B2 JP S624862B2
Authority
JP
Japan
Prior art keywords
mold
resin
lead frame
air vent
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP7647878A
Other languages
English (en)
Japanese (ja)
Other versions
JPS554922A (en
Inventor
Kunihiko Nishi
Yoshiaki Wakashima
Hideo Inayoshi
Nobuo Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7647878A priority Critical patent/JPS554922A/ja
Publication of JPS554922A publication Critical patent/JPS554922A/ja
Publication of JPS624862B2 publication Critical patent/JPS624862B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP7647878A 1978-06-26 1978-06-26 Lead frame Granted JPS554922A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7647878A JPS554922A (en) 1978-06-26 1978-06-26 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7647878A JPS554922A (en) 1978-06-26 1978-06-26 Lead frame

Publications (2)

Publication Number Publication Date
JPS554922A JPS554922A (en) 1980-01-14
JPS624862B2 true JPS624862B2 (enEXAMPLES) 1987-02-02

Family

ID=13606292

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7647878A Granted JPS554922A (en) 1978-06-26 1978-06-26 Lead frame

Country Status (1)

Country Link
JP (1) JPS554922A (enEXAMPLES)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230073177A (ko) 2020-09-24 2023-05-25 닛뽄 가야쿠 가부시키가이샤 촉매 전구체, 그것을 이용한 촉매, 화합물의 제조 방법 및 촉매의 제조 방법

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61146956U (enEXAMPLES) * 1985-02-28 1986-09-10
JPS61146955U (enEXAMPLES) * 1985-02-28 1986-09-10
JPS61162063U (enEXAMPLES) * 1985-03-28 1986-10-07
JPS61203562U (enEXAMPLES) * 1985-06-07 1986-12-22
JPS61269351A (ja) * 1985-05-23 1986-11-28 Nec Yamagata Ltd 半導体装置用リ−ドフレ−ム
JPS6268718A (ja) * 1985-09-20 1987-03-28 Matsushita Electric Ind Co Ltd 円盤状記録媒体成形金型および円盤状記録媒体
JPS6276543U (enEXAMPLES) * 1985-10-31 1987-05-16
JPS62134253U (enEXAMPLES) * 1986-02-14 1987-08-24
KR100242249B1 (ko) * 1997-05-13 2000-02-01 김규현 패키지성형금형구조 및 반도체패키지

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230073177A (ko) 2020-09-24 2023-05-25 닛뽄 가야쿠 가부시키가이샤 촉매 전구체, 그것을 이용한 촉매, 화합물의 제조 방법 및 촉매의 제조 방법

Also Published As

Publication number Publication date
JPS554922A (en) 1980-01-14

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