JPS6244444U - - Google Patents
Info
- Publication number
- JPS6244444U JPS6244444U JP1985136045U JP13604585U JPS6244444U JP S6244444 U JPS6244444 U JP S6244444U JP 1985136045 U JP1985136045 U JP 1985136045U JP 13604585 U JP13604585 U JP 13604585U JP S6244444 U JPS6244444 U JP S6244444U
- Authority
- JP
- Japan
- Prior art keywords
- solid
- imaging device
- state imaging
- image sensor
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 3
- 238000003384 imaging method Methods 0.000 claims 4
- 239000000919 ceramic Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Solid State Image Pick-Up Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985136045U JPS6244444U (US20090163788A1-20090625-C00002.png) | 1985-09-04 | 1985-09-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985136045U JPS6244444U (US20090163788A1-20090625-C00002.png) | 1985-09-04 | 1985-09-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6244444U true JPS6244444U (US20090163788A1-20090625-C00002.png) | 1987-03-17 |
Family
ID=31038796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985136045U Pending JPS6244444U (US20090163788A1-20090625-C00002.png) | 1985-09-04 | 1985-09-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6244444U (US20090163788A1-20090625-C00002.png) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5011466B1 (US20090163788A1-20090625-C00002.png) * | 1970-03-31 | 1975-05-01 | ||
| JPS5139466B2 (US20090163788A1-20090625-C00002.png) * | 1971-12-23 | 1976-10-28 |
-
1985
- 1985-09-04 JP JP1985136045U patent/JPS6244444U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5011466B1 (US20090163788A1-20090625-C00002.png) * | 1970-03-31 | 1975-05-01 | ||
| JPS5139466B2 (US20090163788A1-20090625-C00002.png) * | 1971-12-23 | 1976-10-28 |
