JPS6242022B2 - - Google Patents

Info

Publication number
JPS6242022B2
JPS6242022B2 JP58011786A JP1178683A JPS6242022B2 JP S6242022 B2 JPS6242022 B2 JP S6242022B2 JP 58011786 A JP58011786 A JP 58011786A JP 1178683 A JP1178683 A JP 1178683A JP S6242022 B2 JPS6242022 B2 JP S6242022B2
Authority
JP
Japan
Prior art keywords
copper foil
roughening treatment
rolling
rough
electrochemical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58011786A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59136484A (ja
Inventor
Takeshi Fukuda
Tamio Mizutani
Yoshinao Sakamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fukuda Kinzoku Hakufun Kogyo Kk
Original Assignee
Fukuda Kinzoku Hakufun Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fukuda Kinzoku Hakufun Kogyo Kk filed Critical Fukuda Kinzoku Hakufun Kogyo Kk
Priority to JP1178683A priority Critical patent/JPS59136484A/ja
Publication of JPS59136484A publication Critical patent/JPS59136484A/ja
Publication of JPS6242022B2 publication Critical patent/JPS6242022B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal

Landscapes

  • Metal Rolling (AREA)
  • Electroplating Methods And Accessories (AREA)
  • ing And Chemical Polishing (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
JP1178683A 1983-01-26 1983-01-26 銅箔の粗面化処理方法 Granted JPS59136484A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1178683A JPS59136484A (ja) 1983-01-26 1983-01-26 銅箔の粗面化処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1178683A JPS59136484A (ja) 1983-01-26 1983-01-26 銅箔の粗面化処理方法

Publications (2)

Publication Number Publication Date
JPS59136484A JPS59136484A (ja) 1984-08-06
JPS6242022B2 true JPS6242022B2 (https=) 1987-09-05

Family

ID=11787612

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1178683A Granted JPS59136484A (ja) 1983-01-26 1983-01-26 銅箔の粗面化処理方法

Country Status (1)

Country Link
JP (1) JPS59136484A (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3155920B2 (ja) * 1996-01-16 2001-04-16 三井金属鉱業株式会社 プリント配線板用電解銅箔及びその製造方法
JP4485003B2 (ja) * 2000-02-28 2010-06-16 日鉱金属株式会社 パーティクルゲッター用高強度電解銅箔、該銅箔を内部に配設した薄膜形成装置及び該電解銅箔の製造方法
JP2008086999A (ja) * 2006-09-29 2008-04-17 Hitachi Cable Ltd 圧延銅箔及びその製造方法並びに圧延銅箔を用いたフレキシブルプリント基板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58116717A (ja) * 1981-12-29 1983-07-12 エルナ−株式会社 アルミニウム電極箔の製造方法

Also Published As

Publication number Publication date
JPS59136484A (ja) 1984-08-06

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