JPS6240874U - - Google Patents

Info

Publication number

JPS6240874U

JPS6240874U JP13296985U JP13296985U JPS6240874U JP S6240874 U JPS6240874 U JP S6240874U JP 13296985 U JP13296985 U JP 13296985U JP 13296985 U JP13296985 U JP 13296985U JP S6240874 U JPS6240874 U JP S6240874U

Authority

JP

Japan

Prior art keywords

printed wiring

wiring board

land

mounting hole

component mounting

Prior art date

1985-08-29

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000011888 foil Substances 0.000 claims 1
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• 239000011889 copper foil Substances 0.000 description 1
• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1