JPS6240840U - - Google Patents
Info
- Publication number
- JPS6240840U JPS6240840U JP1985132705U JP13270585U JPS6240840U JP S6240840 U JPS6240840 U JP S6240840U JP 1985132705 U JP1985132705 U JP 1985132705U JP 13270585 U JP13270585 U JP 13270585U JP S6240840 U JPS6240840 U JP S6240840U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- semiconductor device
- dissipation fin
- sides
- brazing material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000005219 brazing Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 2
- 230000005855 radiation Effects 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 claims 4
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985132705U JPS6240840U (US07709020-20100504-C00041.png) | 1985-08-28 | 1985-08-28 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985132705U JPS6240840U (US07709020-20100504-C00041.png) | 1985-08-28 | 1985-08-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6240840U true JPS6240840U (US07709020-20100504-C00041.png) | 1987-03-11 |
Family
ID=31032340
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985132705U Pending JPS6240840U (US07709020-20100504-C00041.png) | 1985-08-28 | 1985-08-28 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6240840U (US07709020-20100504-C00041.png) |
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1985
- 1985-08-28 JP JP1985132705U patent/JPS6240840U/ja active Pending