JPS6240449Y2 - - Google Patents
Info
- Publication number
- JPS6240449Y2 JPS6240449Y2 JP1980147769U JP14776980U JPS6240449Y2 JP S6240449 Y2 JPS6240449 Y2 JP S6240449Y2 JP 1980147769 U JP1980147769 U JP 1980147769U JP 14776980 U JP14776980 U JP 14776980U JP S6240449 Y2 JPS6240449 Y2 JP S6240449Y2
- Authority
- JP
- Japan
- Prior art keywords
- electrode body
- glass tube
- large diameter
- diameter portion
- diameter part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980147769U JPS6240449Y2 (pm) | 1980-10-16 | 1980-10-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980147769U JPS6240449Y2 (pm) | 1980-10-16 | 1980-10-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5771355U JPS5771355U (pm) | 1982-04-30 |
| JPS6240449Y2 true JPS6240449Y2 (pm) | 1987-10-16 |
Family
ID=29507261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980147769U Expired JPS6240449Y2 (pm) | 1980-10-16 | 1980-10-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6240449Y2 (pm) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5636163U (pm) * | 1979-08-25 | 1981-04-07 |
-
1980
- 1980-10-16 JP JP1980147769U patent/JPS6240449Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5771355U (pm) | 1982-04-30 |
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