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Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Priority to JP1985126563UpriorityCriticalpatent/JPS6236573U/ja
Publication of JPS6236573UpublicationCriticalpatent/JPS6236573U/ja
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
H01L2224/331—Disposition
H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
H01L2224/33181—On opposite sides of the body
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Cooling Or The Like Of Electrical Apparatus
(AREA)
