JPS62287676A - Substrate for led formed by coating al plate with ceramic by flame spraying - Google Patents

Substrate for led formed by coating al plate with ceramic by flame spraying

Info

Publication number
JPS62287676A
JPS62287676A JP61131189A JP13118986A JPS62287676A JP S62287676 A JPS62287676 A JP S62287676A JP 61131189 A JP61131189 A JP 61131189A JP 13118986 A JP13118986 A JP 13118986A JP S62287676 A JPS62287676 A JP S62287676A
Authority
JP
Japan
Prior art keywords
plate
substrate
led
ceramics
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP61131189A
Other languages
Japanese (ja)
Inventor
Yoshio Nanba
吉雄 難波
Yoshitomo Sato
佐藤 義智
Shinji Maekawa
前川 信治
Yoshihiro Tsuji
辻 美紘
Isamu Tanaka
勇 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kobe Steel Ltd
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Priority to JP61131189A priority Critical patent/JPS62287676A/en
Publication of JPS62287676A publication Critical patent/JPS62287676A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To improve heat dissipation characteristics and maintain dielectric strength, by using an Al plate on which a ceramics film is formed by flame spray coating of ceramics on a plate surface. CONSTITUTION:Plasma spray coating, for example, of Al2O3 powder of 5-25 mum is performed on an Al plate 1 to form on Al2O3 film 2, for example, of 100mum or 200mum or 500mum thick. Further, an electrolytic copper foil of about 35mum thick is bonded thereon, which is subjected to an etching to form a circuit pattern. As the result, it can be confirmed that the plate wherein a film is formed by plasma spray coating of ceramics(Al2O3) powder on the Al plate is superior to a ceramic plate(SiO2) in heat dissipation characteristics. The results of measuring the dielectric strength of the substrate sufficiently satisfy the required value to the substrate for LWD printer. Further, an Al plate is used as a main material, so that the substrate for LED can be manufacture at a low cost.

Description

【発明の詳細な説明】 3、発明の詳細な説明 [産業上の利用分野] 本発明は、LED (発光ダイオード)プリンターに用
いられる、プリンターヘッド部のLED素子を装若する
基板に関するものである。
Detailed Description of the Invention 3. Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a substrate used in an LED (light emitting diode) printer, on which an LED element of a printer head is mounted. .

[従来の技術] 最近、電子計算機やワードプロセッサー等の端末装鐙で
あるプリンターとして、その高速印字性が要求されるこ
とから、インパクトタイプのワイヤートッドプリンタに
替ってデジタル画像処理を応用したレーザープリンタや
LEDプリンターが開発されている。
[Prior Art] Recently, high-speed printing performance has been required for printers used as terminal stirrups for electronic computers, word processors, etc., so laser printers that apply digital image processing have replaced impact-type wire tod printers. and LED printers have been developed.

この内、レーザープリンターは構造上小型化し難く、ま
たミラーを使用する関係から高速応答性に欠け、高速印
字に限界があるため、LEDプリンターの研究に努力が
払われている。けだし、I、EDプリンターは光プリン
ターの特徴である高速でインテリジェントなプリンター
が実現できる他に、小型化し易く、機械的動作が出力側
に無く、全て電子化できる等プリンターに要求される利
点を有しているからである。
Among these, laser printers are difficult to miniaturize due to their structure, lack high-speed response due to the use of mirrors, and have limitations in high-speed printing, so efforts are being made to research LED printers. In addition to realizing high-speed and intelligent printers, which are the characteristics of optical printers, Kedashi, I, and ED printers also have the advantages required of printers, such as being easy to downsize, having no mechanical movement on the output side, and being completely electronic. This is because they are doing so.

このLEDプリンターの原理は第3図に示されるような
ものである。
The principle of this LED printer is as shown in FIG.

先ず、記録紙幅の分離され、高細密化された発光部を含
むプリンターヘッドが駆動ドライバーに接続されており
、該発光部は多数のLEDによりその表面が構成されて
おり、外部信号で印字部に相当するLEDがラッチ、点
灯され、そのLEDの光ドットによりセルフォックレン
ズを介して感光ドラムを露光する。これ以後は電子写真
技術の応用で、複写機の構成となり、感光ドラムの光の
照射された部分はチャージが除電され、該除電部へトナ
ーが付着し、トナーは記録紙に転写し、定着されてプリ
ントアウトされる。
First, a printer head containing a high-density light-emitting section separated by the width of the recording paper is connected to a drive driver.The surface of the light-emitting section is made up of a large number of LEDs, and the print section is activated by an external signal. The corresponding LED is latched and turned on, and the light dot of the LED exposes the photosensitive drum through the SELFOC lens. After this, the application of electrophotographic technology led to the construction of a copying machine, in which the charge is removed from the portion of the photosensitive drum that is irradiated with light, toner adheres to the charge removed portion, and the toner is transferred to recording paper and fixed. will be printed out.

ところで、現在LEDプリンターの発光郡部において、
LEDを装着するための基板としてはf54図に示すよ
うな構成の板が用いられている。即ち、5iC)+ セ
ラミックスのfi711に電解銅箔12を接着した板材
を素材とし、これを裁断して多数のチップ13を得ると
ともに、該銅箔をエツチングにより所要の回路パターン
を形成したものである。
By the way, currently in the light emitting area of LED printers,
A board having a structure as shown in Fig. f54 is used as a board for mounting the LED. That is, the material is a plate material made by bonding an electrolytic copper foil 12 to a 5iC)+ ceramic fi711, which is cut to obtain a large number of chips 13, and the copper foil is etched to form a required circuit pattern. .

[発明が解決しようとする問題点] ところで、LED用の基板として要求される特性として
は、放熱性、耐電圧性、及び寸法の安定性が挙げられる
[Problems to be Solved by the Invention] By the way, properties required for an LED substrate include heat dissipation, voltage resistance, and dimensional stability.

この要求される特性に対して、従来の5iOzセラミツ
クス板では放熱性の点で問題があり、また高価になると
いう経済的観点からの問題もある。
In response to these required characteristics, conventional 5iOz ceramic plates have problems in terms of heat dissipation, and also have problems from an economical point of view that they are expensive.

前記の問題点を改善するには、セラミックス板よりも安
価であり、且つ放熱性も優れているAl板が適している
といえるが、Al板そのものでは耐電圧性が満足されな
いことになるという問題がある。
In order to improve the above-mentioned problems, it can be said that an aluminum plate is suitable as it is cheaper than a ceramic plate and has better heat dissipation, but the problem is that the voltage resistance is not satisfied with the aluminum plate itself. There is.

そこで、本発明はAl板を使用して放8#性を向上させ
ながら、耐電圧性を確保せしめたLED用基板を提供す
ることを目的として創作された。
Therefore, the present invention was created with the aim of providing an LED substrate that uses an Al plate to improve radiation performance and ensure voltage resistance.

[問題点を解決するための手段] 本発明は、Al板の板面にセラミックスを溶射して、セ
ラミックスの皮膜を形成したことを特徴とするAl板に
セラミックス溶射したLED用基板に係る。
[Means for Solving the Problems] The present invention relates to an LED substrate having ceramics sprayed on an Al plate, characterized in that a ceramic film is formed by spraying ceramics on the surface of the Al plate.

ここに、セラミックスとしてはAl2O3、S i02
 、TiO2、またはMgO等が用いられる。
Here, as ceramics, Al2O3, Si02
, TiO2, or MgO.

[作用] Al板に溶射された居を形成したセラミックスは、それ
が薄い層として形成されているため、LEDに発生した
熱は該層に接着された銅箔を介して容易にAl板に熱伝
導し、Al板から熱放牧されることになるため、従来の
ように熱伝導性に劣るSiO2だけで構成されていた基
板より放熱性に優れたものとなる。
[Function] Since the ceramics that formed the matrix sprayed onto the Al plate are formed as a thin layer, the heat generated in the LED is easily transferred to the Al plate through the copper foil bonded to the layer. Since it conducts heat and radiates heat from the Al plate, it has better heat dissipation than a conventional substrate made only of SiO2, which has poor thermal conductivity.

また、セラミックスの層が構成されているこ゛とにより
、電気的絶縁性はもとより、その耐電圧性はLEDが使
用される範囲での所要の性渣が保証されることになる。
Moreover, since the ceramic layer is constructed, not only electrical insulation but also voltage resistance is guaranteed to meet the required properties within the range in which the LED is used.

セラミックスの層を皮膜としたのは前記のように電気絶
縁性を確保すると共にAl板への熱伝導性を確保するた
めであり、LEDから発生する熱量に応じて所要の熱伝
導性が確保され。
The reason why the ceramic layer is made into a film is to ensure electrical insulation as mentioned above and thermal conductivity to the Al plate, and the required thermal conductivity is ensured according to the amount of heat generated from the LED. .

その所要の耐電圧性が確保されるようにその厚さを選択
すればよい。
The thickness may be selected so as to ensure the required voltage resistance.

セラミックスの種類としては、以上のようにこの場合に
おいて電気的絶縁性及び耐絶縁性が優し−C−オればよ
く、A1203 、S ioz、TiO2,またはMg
O等を用いることができる。
As mentioned above, in this case, the type of ceramic may be any one that has good electrical insulation and insulation resistance, such as A1203, Sioz, TiO2, or Mg
O etc. can be used.

尚、LED用基板に要求されるもう一つの特性としての
寸法安定性については、放熱特性が優れていることによ
り、熱膨張による寸法の変化が少なくなり、該特性につ
いても充分にLED用基板として使用できるものである
Regarding dimensional stability, which is another property required for LED substrates, excellent heat dissipation properties reduce dimensional changes due to thermal expansion, and this property is also sufficient for LED substrates. It can be used.

[実施例] 以下、本発明の一実施例を図を用いながら説明する。[Example] An embodiment of the present invention will be described below with reference to the drawings.

第1図に示すように、500mm(1)X250 m 
m (w ) X 2 m m (t )のAl板1の
上に5〜25gmのAl2O3の粉末をプラズマ溶射し
、1100IL、200 pm、及び500 ILmの
厚みのAl2O3の皮W22を形成し、更に35pmの
厚さの電解銅箔3を接着し、エツチングにより回路パタ
ーンを形成した後に特性試験を行なった。
As shown in Figure 1, 500 mm (1) x 250 m
5 to 25 gm of Al2O3 powder was plasma sprayed onto the Al plate 1 of m (w) After bonding an electrolytic copper foil 3 with a thickness of 35 pm and forming a circuit pattern by etching, a characteristic test was conducted.

尚、比較のために、f?14図のようにAl板と同形状
のセラミックス板(S i 02板)に35pmの厚さ
の電解銅箔を接若し、エツチングにより回路パターンを
形成したものについても同様の試験を行なった。
For comparison, f? Similar tests were conducted on a ceramic plate (S i 02 plate) having the same shape as the Al plate, to which an electrolytic copper foil with a thickness of 35 pm was attached and a circuit pattern was formed by etching, as shown in Fig. 14.

(これらの板からはLEDチップが約4000個以上と
れることになる。) 試験方法としては、基板上にチップ抵抗をハンダ付けし
、供給した電力とチップ抵抗の温度を測定することとし
、その測定結果を抵抗消費電力を横軸に、温度上昇を縦
軸にとって評価した。
(Approximately 4,000 or more LED chips can be obtained from these boards.) The test method was to solder a chip resistor onto the board and measure the supplied power and the temperature of the chip resistor. The results were evaluated using resistance power consumption on the horizontal axis and temperature rise on the vertical axis.

この結果は第2図に示される。The results are shown in FIG.

同図から、放熱性の点において、Al板にセラミックス
(A1203)の粉末をプラズマ溶射して皮膜を形成し
たものの方がセラミックス板(Si02)の場合より優
れていることが確認できる。
From the same figure, it can be confirmed that, in terms of heat dissipation, a film formed by plasma spraying ceramic (A1203) powder on an Al plate is superior to a ceramic plate (Si02).

また1本実施例の基板の耐電圧特性を測定した結果、次
表の値を得られた。
Furthermore, as a result of measuring the withstand voltage characteristics of the substrate of this example, the values shown in the following table were obtained.

これらの値はLWDプリンター用基板基板求される値を
充分に満足するものである。
These values fully satisfy the values required for a substrate for an LWD printer.

尚、寸法安定性については、放熱特性が優れていること
により、熱膨張による寸法の変化を押えることができ、
充分にLED用基板とじて使用できるものであった。こ
の点については、Al板をフィン付の押出型材として構
成することにより放熱を助長し、更に改善することがで
きる。
Regarding dimensional stability, due to its excellent heat dissipation properties, dimensional changes due to thermal expansion can be suppressed.
It could be used as an LED substrate. This point can be further improved by configuring the Al plate as an extruded member with fins to promote heat dissipation.

[発明の効果] 以上のように本発明は、At板にセラミックス溶射して
皮膜を形成することにより、放熱性に優れたLED用基
板を提供するものであり、また耐電圧性についてもLE
D用基板として充分に使用できる特性を有している。
[Effects of the Invention] As described above, the present invention provides an LED substrate with excellent heat dissipation by forming a coating on an At plate by spraying ceramics, and also has voltage resistance that is superior to that of LE.
It has characteristics that allow it to be used satisfactorily as a D substrate.

また1本発明においては、従来のように高価なSiO2
板をそのまま使用するものではなく、Al板を主材料と
しているため、LED用基板を安価に製造することを可
能とする。
In addition, in the present invention, expensive SiO2
Since the board is not used as is and the main material is an Al board, it is possible to manufacture the LED board at a low cost.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は実施例のLED用基板の構成を示す斜視図、第
2図は横軸に抵抗消費電力を、縦軸に温度上昇をとり、
I、EI)用基板の放Q特性を示したグラフ、第3図は
LEDプリンターの原理を示す図、第4図は従来のI、
ED用基板の構成を示す斜視図である。 1・・・Al板 2・・・Al2O3皮W23・・・銅
箔第1図  3;朔 2;A12031 抵抗消費電力αつ 第3図 第4図
FIG. 1 is a perspective view showing the structure of the LED board of the example, and FIG. 2 shows the resistance power consumption on the horizontal axis and the temperature rise on the vertical axis.
Figure 3 is a diagram showing the principle of an LED printer; Figure 4 is a graph showing the radiation Q characteristics of a board for conventional I, EI).
FIG. 2 is a perspective view showing the configuration of an ED substrate. 1... Al plate 2... Al2O3 skin W23... Copper foil Figure 1 3; Shade 2; A12031 Resistor power consumption α Figure 3 Figure 4

Claims (5)

【特許請求の範囲】[Claims] (1)Al板の板面にセラミックスを溶射して、セラミ
ックスの皮膜を形成したことを特徴とするAl板にセラ
ミックス溶射したLED用基板。
(1) An LED substrate in which ceramics are sprayed on an Al plate, characterized in that a ceramic film is formed by spraying ceramics on the surface of the Al plate.
(2)セラミックスがAl_2O_3である特許請求の
範囲第(1)項記載のAl板にセラミックス溶射したL
ED用基板。
(2) L coated with ceramics sprayed on an Al plate according to claim (1), wherein the ceramic is Al_2O_3
ED board.
(3)セラミックスがSiO_2である特許請求の範囲
第(1)項記載のAl板にセラミックス溶射したLED
用基板。
(3) An LED in which ceramics are sprayed on an Al plate according to claim (1), wherein the ceramic is SiO_2.
board for.
(4)セラミックスがTiO_2である特許請求の範囲
第(1)項記載のAl板にセラミックス溶射したLED
用基板。
(4) An LED in which ceramics are sprayed on an Al plate according to claim (1), wherein the ceramic is TiO_2.
board for.
(5)セラミックスがMgOである特許請求の範囲第(
1)項記載のAl板にセラミックス溶射したLED用基
板。
(5) Claim No. 1 in which the ceramic is MgO (
An LED substrate obtained by spraying ceramics on the Al plate described in item 1).
JP61131189A 1986-06-06 1986-06-06 Substrate for led formed by coating al plate with ceramic by flame spraying Pending JPS62287676A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61131189A JPS62287676A (en) 1986-06-06 1986-06-06 Substrate for led formed by coating al plate with ceramic by flame spraying

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61131189A JPS62287676A (en) 1986-06-06 1986-06-06 Substrate for led formed by coating al plate with ceramic by flame spraying

Publications (1)

Publication Number Publication Date
JPS62287676A true JPS62287676A (en) 1987-12-14

Family

ID=15052098

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61131189A Pending JPS62287676A (en) 1986-06-06 1986-06-06 Substrate for led formed by coating al plate with ceramic by flame spraying

Country Status (1)

Country Link
JP (1) JPS62287676A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1493187A2 (en) * 2002-04-10 2005-01-05 Heatron, Inc. Lighting device and method
JP2007317701A (en) * 2006-05-23 2007-12-06 Koha Co Ltd Substrate for light source, and illuminator employing it
CZ300602B6 (en) * 2007-09-12 2009-06-24 Ústav fyziky plazmatu AV CR, v.v.i. Nanocrystalline composite material based on AI203 - ZrO2 - SiO2 and process for preparing thereof
US20130148307A1 (en) * 2010-08-25 2013-06-13 Robert Bosch Gmbh Method for producing and electrical circuit and electrical circuit

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1493187A2 (en) * 2002-04-10 2005-01-05 Heatron, Inc. Lighting device and method
EP1493187A4 (en) * 2002-04-10 2008-03-19 Heatron Inc Lighting device and method
JP2007317701A (en) * 2006-05-23 2007-12-06 Koha Co Ltd Substrate for light source, and illuminator employing it
CZ300602B6 (en) * 2007-09-12 2009-06-24 Ústav fyziky plazmatu AV CR, v.v.i. Nanocrystalline composite material based on AI203 - ZrO2 - SiO2 and process for preparing thereof
US20130148307A1 (en) * 2010-08-25 2013-06-13 Robert Bosch Gmbh Method for producing and electrical circuit and electrical circuit

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